scholarly journals A Design Method for Estimating the Reliability of Lead Free Solder Joints in Ball-Grid-Array-Type Packages under Impact Load

2003 ◽  
Vol 6 (7) ◽  
pp. 573-580 ◽  
Author(s):  
Akihiro YAGUCHI ◽  
Munehiro YAMADA ◽  
Kenichi YAMAMOTO
Keyword(s):  
Solder Joints ◽  
Impact Load ◽  
Design Method ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Array Type ◽  
Free Solder

Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

2009 ◽  
Vol 38 (12) ◽  
pp. 2702-2711 ◽  
Author(s):  
Bite Zhou ◽  
Thomas R. Bieler ◽  
Tae-Kyu Lee ◽  
Kuo-Chuan Liu
Keyword(s):  
Simple Shear ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Effect of Ni Plating Condition on Lead-Free Solder Joints Reliability of BGA Using Electroplated Ni/Au under Impact Load

2007 ◽  
Vol 10 (4) ◽  
pp. 305-313 ◽  
Author(s):  
Kenichi YAMAMOTO ◽  
Haruo AKAHOSHI ◽  
Takahiko KATO ◽  
Toshinori KAWAMURA ◽  
Masahiro KOIZUMI ◽  
...  
Keyword(s):  
Solder Joints ◽  
Impact Load ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Walter Dauksher ◽  
Dongkai Shangguan ◽  
Fubin Song ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.

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