Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

2009 ◽  
Vol 38 (12) ◽  
pp. 2702-2711 ◽  
Author(s):  
Bite Zhou ◽  
Thomas R. Bieler ◽  
Tae-Kyu Lee ◽  
Kuo-Chuan Liu
Keyword(s):  
Simple Shear ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Walter Dauksher ◽  
Dongkai Shangguan ◽  
Fubin Song ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates

2017 ◽  
Vol 66 (4) ◽  
pp. 1229-1237 ◽  
Author(s):  
P. Wild ◽  
T. Grozinger ◽  
D. Lorenz ◽  
A. Zimmermann
Keyword(s):  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

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