Semi-Circular Surface Cracks And Flaking Failures In Silicon Nitride Bearings

2011 ◽  
Vol 2 (5) ◽  
pp. 336-340 ◽  
Author(s):  
Katsuyuki Kida
Author(s):  
J. J. Tien ◽  
B. T. Khuri-Yakub ◽  
G. S. Kino ◽  
A. G. Evans ◽  
D. Marshall

1998 ◽  
Vol 13 (7) ◽  
pp. 1899-1904 ◽  
Author(s):  
Hyo Sok Ahn ◽  
Said Jahanmir ◽  
John A. Slotwinski ◽  
Gerald V. Blessing

A pulse-echo ultrasonic technique consisting of focused normal-incident compressional waves was used for the detection and evaluation of surface and subsurface damage in micaceous glass-ceramic and silicon nitride samples. The damage was produced by indentation with a tungsten carbide ball. The nature of the damage was found to be material-dependent and was classified into two types: Hertzian cone cracks in the silicon nitride, and distributed subsurface microcracks in the glass-ceramic. While the cone cracks were visible on the surface as circular ring cracks, the distributed subsurface microcracks were not associated with any visible surface cracks. Both the cone cracks and the distributed subsurface microcracks were easily detected by the ultrasonic technique. In addition, the ultrasonic beam was focused to different depths below the surface of the glass-ceramic sample to probe the subsurface region containing the microfracture damage.


1981 ◽  
Author(s):  
J.J. Tien ◽  
K. Liang ◽  
B.T. Khuri-Yakub ◽  
G.S. Kino ◽  
D. Marshall ◽  
...  

2011 ◽  
Vol 217-218 ◽  
pp. 866-873 ◽  
Author(s):  
Katsuyuki Kida

Previous researchers investigated the failures of ball surfaces of silicon nitride bearings from the viewpoint of the ring crack model. They explained the process of flaking failures in terms of surface semi-circular cracks which grew by the stresses around the circumference of the contact circle. However, contrary to their explanation, we found that the ring crack model did not explain the process of the flaking failure of plates. In the present work we compare the growth directions of surface and subsurface cracks in order to find out which crack is more dominant in the process of the flaking failure. We carried out reciprocating-rolling contact fatigue (RCF) tests and concluded that the directions of arcs formed by the semi-circular surface cracks were dominated by subsurface crack growth direction.


Author(s):  
X. Shen ◽  
S. Lei

This paper applies distinct element method (DEM) to simulate the material removal process of laser assisted machining of silicon nitride ceramics and show the formation and propagation of surface/sub-surface cracks and damage. A synthetic specimen is created using particle clusters to approximate the granular microstructure of β-type silicon nitride ceramics. The effect of temperature on machining is considered by its influence on the material properties. In addition, some other parameters such as rake angle, depth of cut, local damping coefficient and cluster size are also considered in a parametric study. It shows that all these parameters influence surface/sub-surface cracks and chip formation of silicon nitride ceramics in laser assisted machining.


2012 ◽  
Vol 566 ◽  
pp. 65-69
Author(s):  
Katsuyuki Kida ◽  
Takashi Honda ◽  
Edson Costa Santos

In order to investigate the mechanism of surface cracks in silicon nitride ceramic (HIP-Si3N4) from the viewpoint of shear stress, the authors focused on torsion fatigue testing and observed the crack growth behavior under conditions where the stress ratio was R = - 1. Furthermore the residual stresses around the cracks were measured. Based on these results, mode II growth of surface cracks is discussed and it was concluded that under stress ratio R = -1, surface cracks grow slowly in mode II, for ΔKⅡ less than 3.6MPam1/2.


Author(s):  
D. R. Clarke ◽  
G. Thomas

Grain boundaries have long held a special significance to ceramicists. In part, this has been because it has been impossible until now to actually observe the boundaries themselves. Just as important, however, is the fact that the grain boundaries and their environs have a determing influence on both the mechanisms by which powder compaction occurs during fabrication, and on the overall mechanical properties of the material. One area where the grain boundary plays a particularly important role is in the high temperature strength of hot-pressed ceramics. This is a subject of current interest as extensive efforts are being made to develop ceramics, such as silicon nitride alloys, for high temperature structural applications. In this presentation we describe how the techniques of lattice fringe imaging have made it possible to study the grain boundaries in a number of refractory ceramics, and illustrate some of the findings.


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