Evaluation of Thermal Resistance for Underfill Layer in Three-dimensional Stacked ICs by Transient Thermal Analysis
Keyword(s):
2018 ◽
Vol 2018
(HiTEC)
◽
pp. 000028-000031
◽
Keyword(s):
2016 ◽
Vol 858
◽
pp. 1078-1081
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Evaluation of Thermal Resistance Degradation of SiC Power Module Corresponding to Thermal Cycle Test
2017 ◽
Vol 2017
(HiTEN)
◽
pp. 1-5
◽
Thermal Resistance and Transient Thermal Analysis of SiC Power Module Using Ni Micro Plating Bonding
2019 ◽
Vol 139
(10)
◽
pp. 838-846
◽
Keyword(s):
2013 ◽
Vol 60
(8)
◽
pp. 2548-2555
◽
2016 ◽
Vol 856
◽
pp. 245-250
◽
2014 ◽
Vol 65
(11)
◽
pp. 1069-1088
◽
1999 ◽
Vol 36
(8)
◽
pp. 807-823
◽
Keyword(s):
1995 ◽
Vol 28
(3)
◽
pp. 277-291
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