scholarly journals Thermal Conductivity Determination of Ga-In Alloys for Thermal Interface Materials Design

Thermo ◽  
2021 ◽  
Vol 2 (1) ◽  
pp. 1-13
Author(s):  
Parker Maivald ◽  
Soumya Sridar ◽  
Wei Xiong
Keyword(s):  
Thermal Conductivity ◽  
Phase Region ◽  
Consumer Electronics ◽  
Thermal Interface Material ◽  
Two Phase ◽  
Thermal Interface ◽  
Thermal Conductivity Parameter ◽  
Conductivity Parameter ◽  
Efficient Heat Transfer ◽  
Thermal Conductivities

Thermal interface material (TIM) that exists in a liquid state at the service temperature enables efficient heat transfer across two adjacent surfaces in electronic applications. In this work, the thermal conductivities of different phase regions in the Ga-In system at various compositions and temperatures are measured for the first time. A modified comparative cut bar technique is used for the measurement of the thermal conductivities of GaxIn1−x (x = 0, 0.1, 0.214, 0.3, and 0.9) alloys at 40, 60, 80, and 100 °C, the temperatures commonly encountered in consumer electronics. The thermal conductivity of liquid and semi-liquid (liquid + β) Ga-In alloys are higher than most of the TIM’s currently used in consumer electronics. These measured quantities, along with the available experimental data from literature, served as input for the thermal conductivity parameter optimization using the CALPHAD (calculation of phase diagrams) method for pure elements, solution phase, and two-phase region. A set of self-consistent parameters for the description of the thermal conductivity of the Ga-In system is obtained. There is good agreement between the measured and calculated thermal conductivities for all of the phases. Due to their ease of manufacturing and high thermal conductivity, liquid/semi-liquid Ga-In alloys have significant potential for TIM in consumer electronics.

scholarly journals Thermal Conductivity of the Ga-In System: Experimental Measurements and CALPHAD Modeling

2020 ◽  
Author(s):  
Parker Maivald ◽  
Soumya Sridar ◽  
Wei Xiong
Keyword(s):  
Thermal Conductivity ◽  
Phase Region ◽  
Consumer Electronics ◽  
Thermal Interface Material ◽  
Two Phase ◽  
Diagram Method ◽  
Thermal Conductivity Parameter ◽  
Conductivity Parameter ◽  
Efficient Heat Transfer ◽  
Thermal Conductivities

Thermal interface material (TIM) that can exist as liquid at the service temperature enables efficient heat transfer across two adjacent surfaces in electronic applications. In this work, the thermal conductivities of different phase regions in the Ga-In system at various compositions and temperatures are measured for the first time. A modified comparative cut bar technique is used for the measurement of the thermal conductivities of InxGa1-x (x=0, 0.1, 0.214, 0.3, and 0.9) alloys at 40, 60, 80, and 100oC that are the temperatures commonly encountered in consumer electronics. The thermal conductivity values for the liquid and semi-liquid (liquid+β) Ga-In alloys are higher than the TIM currently used in consumer electronics. These measured quantities, along with the available experimental data from the literature, served as input for the thermal conductivity parameter optimization using the CALPHAD (CALculation of PHase Diagram) method for the pure elements, solution phase, and two-phase region. A set of self-consistent parameters for the description of the thermal conductivity of the Ga-In system is obtained. There is good agreement between the measured and calculated thermal conductivity values for all the phases. Hence, it can be envisaged that liquid/semi-liquid Ga-In alloys can be considered as a potential TIM in consumer electronics due to its high thermal conductivity.

Thermal conduction characteristics of silicone composites including ultrasonic-treated graphite

2021 ◽  
pp. 002199832110595
Author(s):  
Weontae Oh ◽  
Jong-Seong Bae ◽  
Hyoung-Seok Moon
Keyword(s):  
Thermal Conductivity ◽  
Ultrasonic Treatment ◽  
Thermal Conduction ◽  
Light Emitting Diode ◽  
Thermal Interface Material ◽  
Ultrasonic Power ◽  
Lighting System ◽  
Thermal Interface ◽  
Light Emitting ◽  
Inorganic Oxides

The microstructural change of graphite was studied after ultrasonic treatment of the graphite. When the graphite solution was treated with varying ultrasonic power and time, the microstructure changed gradually, and accordingly, the thermal conductivity characteristics of the composite containing the as-treated graphite was also different with each other. Thermal conductivity showed the best result in the silicone composite containing graphite prepared under the optimum condition of ultrasonic treatment, and the thermal conductivity of the composite improved proportionally along with the particle size of graphite. When the silicone composite was prepared by using a mixture of inorganic oxides and graphite rather than graphite alone, the thermal conductivity of the silicone composite was further increased. A silicone composite containing graphite was used for LED (light emitting diode) lighting system as a thermal interface material (TIM), and the temperature elevation due to heat generated, while the lighting was actually operated, was analyzed.

scholarly journals Thermal Properties of the Graphene Composites: Application of Thermal Interface Materials

2018 ◽  
Vol 7 (4.33) ◽  
pp. 530
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Zaiazmin Y.N ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Matrix Material ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Uniform Thickness ◽  
Thermal Interface ◽  
Interface Materials ◽  
Main Material

Epoxy mixed with others filler for thermal interface material (TIM) had been well conducted and developed. There are problem occurs when previous material were used as matrix material likes epoxy that has non-uniform thickness of thermal interface material produce, time taken for solidification and others. Thermal pad or thermal interface material using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity and thermal contact resistance. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10 wt. %, 20 wt. % and 30 wt. % of graphene was used with different contain of graphene oxide (GO).  The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/ (mK) with 30 w. % graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene-epoxy is an excellent thermal interface material in increasing thermal conductivity.  

Development of a Compliant Nanothermal Interface Material

2011 ◽  
Author(s):  
David Shaddock ◽  
Stanton Weaver ◽  
Ioannis Chasiotis ◽  
Binoy Shah ◽  
Dalong Zhong
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Stresses ◽  
Performance Testing ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bondline Thickness ◽  
Interface Materials

The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance. High thermal conductivity materials, such as solders, have been used as thermal interface materials. However, there is a limit to minimum bondline thickness in reducing resistance due to increased fatigue stress. A compliant thermal interface material is proposed that allows for thin solder bondlines using a compliant structure within the bondline to achieve thermal resistance <0.01 cm2C/W. The structure uses an array of nanosprings sandwiched between two plates of materials to match thermal expansion of their respective interface materials (ex. silicon and copper). Thin solder bondlines between these mating surfaces and high thermal conductivity of the nanospring layer results in thermal resistance of 0.01 cm2C/W. The compliance of the nanospring layer is two orders of magnitude more compliant than the solder layers so thermal stresses are carried by the nanosprings rather than the solder layers. The fabrication process and performance testing performed on the material is presented.

Development of High Thermally Conductive Die Attach for TIM Applications

2019 ◽  
Vol 2019 (1) ◽  
pp. 000312-000315
Author(s):  
Maciej Patelka ◽  
Sho Ikeda ◽  
Koji Sasaki ◽  
Hiroki Myodo ◽  
Nortisuka Mizumura
Keyword(s):  
Thermal Conductivity ◽  
High Power ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Power Semiconductor ◽  
Die Attach ◽  
Industry Standards ◽  
Thermally Conductive ◽  
Low Modulus ◽  
Thermal Grease

Abstract High power semiconductor applications require a Thermal Interface Die Attach Material with high thermal conductivity to efficiently release the heat generated from these devices. Current Thermal Interface Material solutions such as thermal grease, thermal pads and silicones have been industry standards, however may fall short in performance for high temperature or high-power applications. This presentation will focus on development of a cutting-edge Die Attach Solution for Thermal Interface Management, focusing on Fusion Type epoxy-based Ag adhesive with an extremally low Storage Modulus and the Thermal Conductivity reaching up to 30W/mK, and also Very Low Modulus, Low-Temperature Pressureless Sintered Silver Die Attach with the Thermal Conductivity of 70W/mK.

A new way synthesis of expanded graphite as a thermal filler to enhance the thermal conductivity of DGEBA resin as thermal interface material

2019 ◽  
Vol 32 (5) ◽  
pp. 506-523 ◽  
Author(s):  
Sagar Kumar Nayak ◽  
Smita Mohanty ◽  
Sanjay K Nayak
Keyword(s):  
Thermal Conductivity ◽  
Composite System ◽  
Expanded Graphite ◽  
Ammonium Persulfate ◽  
Stir Casting ◽  
Thermal Interface Material ◽  
Step Method ◽  
Thermal Interface ◽  
Lap Shear ◽  
Uniform Dispersion

In this work, a facile two-step method for the synthesis of highly thermal conductive expanded graphite (EG) was proposed. A binary component system of ammonium persulfate and concentrated sulfuric acid was prepared for the synthesis of EG from natural graphite flakes in which the former one acted as an oxidizing agent and the latter one used as an intercalating agent. Further, the silane functionalization of EG (mEG) was purposefully completed, as confirmed from the X-ray diffraction and Fourier transform infrared spectroscopy analysis. Epoxy-based thermal interface materials (TIMs) were fabricated with reinforcing EG and mEG by stir-casting method at different filler fraction. The guarded heat flow meter method indicated that the enhancement in thermal conductivity (TC) was 12.12-fold at 10 wt% loading of mEG (mEG10-Ep) than neat epoxy. The binding strength of mEG10-Ep composite tuned to 6.18 ± 0.8 MPa and determined by a single lap shear test, which confirms better reinforcing effect of silane functionalized EG than neat EG counterpart. The same was also corroborated from porosity evaluation of the composite system. At 50% weight loss in nitrogen atmosphere, thermogravimetric analysis revealed that the composite was stable up to 430°C. Dynamic mechanical analysis was engaged to estimate the glass transition temperature ( T g) of the epoxy composite system, which validates its prospective application as preferred TIMs in the electroactive device. The electrical conductivity of composite was deteriorated due to the encapsulation of EG with nonconductive silane functional groups. The uniform dispersion was achieved by mEG-filled composite as compared to its EG counterpart, which was visualized from fracture surface through scanning electron microscopy.

A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride

2018 ◽  
Vol 6 (36) ◽  
pp. 17540-17547 ◽  
Author(s):  
Zhilin Tian ◽  
Jiajia Sun ◽  
Shaogang Wang ◽  
Xiaoliang Zeng ◽  
Shuang Zhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Three Dimensional ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Hierarchical Porous ◽  
Templated Method

A high thermal conductivity boron nitride based thermal interface material was developed by a foam-templated method.

Sign in / Sign up

Export Citation Format

Share Document