The Enhancement of Enargite Dissolution by Sodium Hypochlorite in Ammoniacal Solutions

The dissolution of both copper and arsenic from a copper concentrate was investigated in oxidative ammonia/ammonium solutions at moderate temperatures and atmospheric pressure. The main parameters studied were temperature, pH, concentrations of different ammonia salts, the presence of sodium hypochlorite, pretreatment with sodium chloride, and curing period. In all ammoniacal solutions studied, increasing the temperature enhanced the dissolution of copper, but the dissolution of arsenic remained marginal. Mixing the copper concentrate with sodium chloride and leaving it to rest for 72 h before leaching in ammoniacal solutions significantly increased the dissolution of copper and slightly increased the dissolution of arsenic from the concentrate. A maximum of 35% of Cu and 3.3% of As were extracted when ammonium carbonate was used as the lixiviant. The results show relatively rapid dissolution of the concentrate with the addition of sodium hypochlorite in ammonium carbonate solution, achieving a dissolution of up to 50% and 25% of copper and arsenic, respectively. A copper dissolution with a non-linear regression model was proposed, considering the effect of NaClO and NH4Cl at 25 °C. These findings highlight the importance of using the correct anionic ligands for the ammonium ions and temperature to obtain a high dissolution of copper or arsenic. The results also showed that the curing time of the packed bed before the commencement of leaching appeared to be an important parameter to enhance the dissolution of copper and leave the arsenic in the residues.

Recycling of Secondary cooper Waste

The process of dissolution of copper crumbs with nitric acid without superposition and with superposition of alternating current of industrial frequency is investigated. The main parameters of the process of copper dissolution by nitric acid in the absence of nitrogen dioxide formation are determined. The technology of electrolytic dissolution of copper with nitric acid is proposed.