Magnetic equivalent of electric superradiance in yttrium-iron-garnet films

A dense system of independent oscillators, connected only by their interaction with the same cavity excitation mode, will radiate coherently, which effect is termed superradiance. In several cases, especially if the density of oscillators is high, the superradiant decay of the oscillators’ excited state may dominate the intrinsic relaxation processes. At low frequencies, this limit can be achieved with cyclotron resonance in two-dimensional electron gases. In those experiments, the cyclotron resonance is coupled to the electric field of light, while the oscillator density can be easily controlled by varying the gate voltage. However, in the case of magnetic oscillators, to achieve the dominance of superradiance is more tricky, as material parameters limit the oscillator density, and the magnetic coupling to the light wave is rather weak. Here we present quasi-optical magnetic resonance experiments on thin films of yttrium iron garnet. Due to the simplicity of experimental geometry, the intrinsic damping and the contribution of superradiance can be easily separated in the transmission spectra. We show that with increasing film thickness, the losses due to coherent radiation prevail the system’s internal broadening.

Dynamic heterogeneity flow promotes binding reactions in a dense system of hard annular sector particles

Dynamic heterogeneity is observed in a dense ASP system and is demonstrated to be spatially correlated with binding reactions.

RNN-based Dimensional Speech Emotion Recognition

◆ A speech emotion recognition system based on recurrent neural networks is developed using long short-term memory networks.◆ Two of acoustic feature sets are evaluated: 31 Features (3 time-domain features, 5 frequency-domain features, 13 MFCCs, 5 F0s, and 5 Harmonics) and eGeMaps feature set (23 features).◆ To evaluate the performance, some metrics are used i.e. mean squared error (MSE), mean absolute percentage error (MAPE), mean absolute error (MAE) and concordance correlation coefficient (CCC). Among those metrics, CCC is main focus as it is used by other researchers.◆ The developed system used multi-task learning to maximize arousal, valence, and dominance at the same time using CCC loss (1 - CCC). The result shows using LSTM networks improve the CCC score compared to baseline dense system. The best CCC score isobtained on arousal followed by dominance and valence.

The Practical Divinity

This chapter focuses on “practical divinity,” or how Puritan ministers and laypeople understood the workings of redemption and developed a dense system of “means.” Summing up the essence of theology, the early seventeenth-century English theologian William Ames described it as “living to God,” or in such a way that the divine–human connection became visible. Well before Ames was emphasizing the interplay of piety and practice, the sixteenth-century humanist Desiderus Erasmus had advised clergy to avoid “intricate syllogisms” and focus on the “gospel life.” The makers of the practical divinity wanted to convert Catholics into Protestants and to stabilize the contours of orthodoxy, but a more telling goal was to raise the bar for all those who contented themselves with the vernacular wisdom summed up in the saying, “the God that made me, save me.” Nothing this simple would do. To these goals, the makers of the practical divinity added another, its value as an instrument of social and moral reformation.

Concentration dependent phase behavior and collapse dynamics of PNIPAM microgel by dielectric relaxation

Concentration dependent phase behavior of microgel: the dense system underwent a phase transition from colloidal crystal to liquid and to phase separation (above); the dilute system only underwent a transition from liquid to phase separation (below).

Integration of MEMS in Fan-Out Wafer-Level Packaging Technology based System-in-Package (WLSiP)

The Internet of Things/ Everything (IoT/E) will require billions of single or multiple MEMS/Sensors integrated in modules together with other functional building blocks like processor, memory, connectivity, built-in security, power management, energy harvesting, and battery charging. The success of IoT/E will also depend on the selection of the right Packaging Technology. The winner will be the one achieving the following key targets: best electrical and thermal system performance, miniaturization by dense system integration, effective MEMS/Sensors fusion into the systems, manufacturability in high volume at low cost. MEMS/Sensors packaging in low cost molded packages on large manufacturing formats has always been a challenge, whether because of the parameter drift of the sensors caused by the packaging itself or, as in many cases, the molded packaging technology is not compatible to the way MEMS/Sensors are working. Wafer-Level Packaging (WLP), namely Fan-Out WLP (FOWLP) technologies such as eWLB, WLFO, RCP, M-Series and InFO are showing good potential to meet those requirements and offer the envisioned system solutions. FOWLP will grow with CAGR between 50–80% until 2020, forecasted by the leading market research companies in this field. System integration solutions (WLSiP and WL3D) will dominate FOWLP volumes in the future compared to current single die FOWLP packages for mobile communication. The base technology is available and has proven maturity in high volume production, but for dense system integration of MEMS/Sensors, additional advanced building blocks need to be developed and qualified to extend the technology platform. The status and most recent developments on NANIUM's WLFO technology, which is based on Infineon's/Intel's eWLB technology, aiming to overcome the current limits for MEMS/Sensors integration, will be presented in this paper. This will cover the processing of Keep-Out Zones (KOZ) for MEMS/Sensors access to environment in molded wafer-level packages, mold stress relief on dies for MEMS/Sensors die decoupling from internal package stress, thin-film shielding using PVD seed layer as functional layer, and heterogeneous dielectrics stacking, in which different dielectric materials fulfill different functions in the package, including the ability to integrate Microfluidic.