Preparation of Novel ZnO/Cu2O Heterojunctions Composite Film by Codeposition Method and Their Enhanced Photocatalytic Performance Analysis

IIn this paper, a codeposition method is used to prepare ZnO/Cu2O composite film with a heterojunction structure in one step. The microstructure and photoelectric properties of the prepared ZnO/Cu2O composite film are characterized and analyzed, and its photocatalytic performance is evaluated. Compared with pure the Cu2O film, the composite film exposes more (111) crystal planes, and has a smaller impedance and a larger photocurrent and open circuit voltage value. These findings indicate that the ZnO/Cu2O composite film exhibits excellent photogenerated carrier separation and migration efficiencies. Among the prepared samples, M2 demonstrates the highest photocatalytic and recycling performance. The calculation of the band position shows that the Fermi level of the composite film exhibits a significant shift compared to that of the pure Cu2O film. The analysis shows that the decrease in the recombination probability of photogenerated carriers caused by the shift of the Fermi level and formation of an internal electric field is the main factor for the significant enhancement in the Cu2O photocatalytic performance. This article provides a novel method and idea to realize the efficient removal of organic dye pollutants in sewage.

Digital Holographic Study of pH Effects on Anodic Dissolution of Copper in Aqueous Chloride Electrolytes

The anodic dissolution of copper in chloride electrolytes with different pH has been investigated by using polarization measurements and digital holography. In acidic and neutral NaCl solutions, the oxidation processes of copper are almost the same: copper firstly dissolves as cuprous ions, which then produces the CuCl salt layer. The dissolution rate in the acidic solution is a little higher than that in the neutral. However, the mechanism is quite different in the alkaline NaCl solution: copper turns passive easily due to the formation of a relatively stable Cu2O film which results in pitting, and the dissolution rate of copper decreases before pit initiation.