scholarly journals Influence of Distribution Size of Micro Energy Director Array on Ultrasonic Precise Sealing of Polymer MEMS Device

CONVERTER ◽  
2021 ◽  
pp. 50-58
Author(s):  
Miaomiao Zhang
Keyword(s):  
Hot Embossing ◽  
Wetting Behavior ◽  
Mems Device ◽  
Energy Director ◽  
Polymer Mems

In order to improve the quality and precision of ultrasonic precision sealing of polymer MEMS device, micro energy director array was proposed on the sealing surface of polymer MEMS device, the influence of the distribution size of micro energy director array to ultrasonic precise sealing was studied. Based on the experiment of PMMA micro-pipe sealing, five kinds of micro energy directors with different distribution sizes were made on the sealing surface by hot embossing technique. The method of ultrasonic precise sealing based on efficiency’s feedback was used and the influence of micro energy director array’s distribution size on the quality of ultrasonic sealing was summarized through the observation on the rule of wetting behavior of micro energy director array.

Micro energy director array for ultrasonic precise sealing of polymer MEMS device

2011 ◽  
Vol 19 (4) ◽  
pp. 754-761
Author(s):  
罗怡 LUO Yi ◽  
张苗苗 ZHANG Miao-miao ◽  
孙屹博 SUN Yi-bo ◽  
王晓东 WANG Xiao-dong
Keyword(s):  
Mems Device ◽  
Energy Director ◽  
Polymer Mems

scholarly journals Hot embossing of polypropylene micro-tubes into functional tubular components with controlled inner-pore sizes

2018 ◽  
Vol 190 ◽  
pp. 10005
Author(s):  
Jie Zhao ◽  
Yi Qin
Keyword(s):  
Polymeric Materials ◽  
Hot Embossing ◽  
Sem Analysis ◽  
Tool Geometry ◽  
Micro Forming ◽  
Good Reliability ◽  
Low Viscosity ◽  
Automated Handling ◽  
Tubular Components

To meet ever-increasing demands on the micro-components for medical and non-medical applications, a new micro-shaping technology - “hot embossing of micro-tubes”, had been developed for the forming of polymeric tubular micro-components. The paper presents the results from the forming of Polypropylene(PP) micro-tubes with outer diameters of 1.3mm and inner diameters 0.6mm, to achieve various reduced inner-features. The study was effected by combining experiment, numerical simulation and SEM analysis. FE simulation was implemented by using the material data obtained from the material characterisation tests. The forming experiment was conducted with a high-precision hot-embossing machine, developed in-house, with automated handling and good reliability and repeatability. The Polypropylene (PP) micro-tubes were successfully formed into the desired features at the temperatures of 60°C and 100°C respectively. The influences of the parameters/factors, such as tool design, temperature, forming pressure and holding time, on the quality of the shaped parts, are discussed in details. Based on this study, it is concluded that PP is an ideal candidate material among the polymeric materials for hot embossing of tubular micro-components, due to its good ductility, low transition temperature and low viscosity. Keywords: Micro forming, Manufacturing process, Tool geometry

Stability and water wetting behavior of superhydrophobic polyurethane films created by hot embossing and plasma etching and coating

2019 ◽  
Vol 16 (6) ◽  
pp. 1800214 ◽  
Author(s):  
Jakob Barz ◽  
Michael Haupt ◽  
Christian Oehr ◽  
Thomas Hirth ◽  
Philipp Grimmer
Keyword(s):  
Plasma Etching ◽  
Hot Embossing ◽  
Wetting Behavior ◽  
Water Wetting

Fabrication and Molding Testing of the Blazed Gratings for Microoptics Applications

2010 ◽  
Vol 447-448 ◽  
pp. 396-400 ◽  
Author(s):  
Cha Bum Lee ◽  
Sun Kyu Lee
Keyword(s):  
Thermal Deformation ◽  
Diamond Tool ◽  
Hot Embossing ◽  
Optical Performance ◽  
Optimal Conditions ◽  
Experimental Conditions ◽  
Thermoplastic Material ◽  
Edge Surface ◽  
Electroless Ni

This paper presents the experimental investigation of the optimal hot embossing replication to prevent the nanoscale thermal deformation of microstructures replicated from the electroless Ni mold fabricated by the diamond tool-interfered scribing process. The fabricated microstructures have the blazed profile with a period of 2.0 ㎛ and a depth of 0.2 ㎛ and a thermoplastic material PMMA as the replica was used. The hot embossing molding was carried out under the several experimental conditions. In terms of a quality of surface smoothness, profile, sharp blaze edge, surface roughness, peak to valley Ry and optical performance of the replica, the PMMA microstructures replicated under the optimal conditions, were ideally identical with those in the mold in dimension, and it was found that the demolding temperature is the most important factor for replication. From optical testing, diffraction efficiency of the replica was measured, 87.6%, similar to that of the calculated value 89.6%, and the replica molded in other conditions showed the noticeable efficiency drop due to molding error.

Experimental Study on the Fabrication of the Light Guide Plate with Hot Embossing Method

2010 ◽  
Vol 37-38 ◽  
pp. 448-452 ◽  
Author(s):  
Yong He ◽  
Ting Zhang ◽  
Jian Zhong Fu ◽  
Zi Chen Chen
Keyword(s):  
Light Guide ◽  
Hot Embossing ◽  
Holding Time ◽  
Optimal Process ◽  
Silicon Mold ◽  
Light Guide Plate ◽  
Guide Plate ◽  
Wet Chemical ◽  
Wet Chemical Etching

To improve the quality of the light guide plate (LGP) made by injection molding, a fabrication method based on hot embossing was proposed. The silicon mold of the LGP with micro pyramid array was fabricated by wet chemical etching. The experiments of embossing the LGP were performed with a self-designed hot embossing machine. Orthogonal method was used to analyze the imprint pressure, the holding time, the imprint temperature and the width of pyramid with respect to the accuracy of replication (AOR). The experimental results show that the imprint temperature has the greatest effect on the AOR, followed by the imprint pressure and the holding time, while the width of micro pyramid has the minimal effect on the AOR. The increase of imprint temperature can obviously improve the pattern filling quality in the lower imprint pressure (0.7MPa). At last the optimal process parameters were obtained with the imprint pressure of 0.9MPa, the holding time of 5min and the imprint temperature of 130°C.

Experimental Study on Hot Embossing of Micro/Nano Grating

2009 ◽  
Vol 60-61 ◽  
pp. 450-455 ◽  
Author(s):  
Yong Liang ◽  
Chong Liu ◽  
Huan Li Sun ◽  
Jing Min Li ◽  
Jun Shan Liu ◽  
...  
Keyword(s):  
Experimental Study ◽  
Methyl Methacrylate ◽  
Silicon Substrate ◽  
Hot Embossing ◽  
Mems Devices ◽  
High Quality ◽  
Novel Method ◽  
Temperature And Pressure ◽  
Polymer Mems ◽  
Pmma Polymer

During hot embossing process of polymer MEMS devices, the parameters such as temperature, pressure and time are important for the duplication precision of patterns. In this work, a novel method of hot embossing lithography for replication of multiple nano bar structure mould was conducted. The effects of hot embossing temperature and pressure on fabrication precision were studied. Linewidth of the pattern on the mould is from 71nm to 980nm. The replicas of nano bar structure were fabricated on the PMMA (polymer methyl methacrylate) layer with silicon substrate. The effects of hot embossing and demoulding temperature on replicating quality were also discussed. Experimental results indicate that higher demoulding temperature help to lessen PMMA leftover and improve the duplication quality. The hot embossing and dmoulding temperature of 110°C～120°C and 60°C～70°C were obtained to produce high quality duplication of multiple nano bar structures. Micro-grating replicas were also fabricated and demonstrated in this paper.

scholarly journals Evaluation of Warpage and Residual Stress of Precision Glass Micro-Optics Heated by Carbide-Bonded Graphene Coating in Hot Embossing Process

Nanomaterials ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 363
Author(s):  
Lihua Li ◽  
Jian Zhou
Keyword(s):  
Residual Stress ◽  
Rapid Heating ◽  
Microlens Array ◽  
Hot Embossing ◽  
Heat Transfer Process ◽  
Trial And Error ◽  
Graphene Coating ◽  
Forming Temperature ◽  
Geometric Deviation

A newly developed hot embossing technique which uses the localized rapid heating of a thin carbide-bonded graphene (CBG) coating, greatly reduces the energy consumption and promotes the fabrication efficiency. However, because of the non-isothermal heat transfer process, significant geometric deviation and residual stress could be introduced. In this paper, we successfully facilitate the CBG-heating-based hot embossing into the fabrication of microlens array on inorganic glass N-BK7 substrate, where the forming temperature is as high as 800 °C. The embossed microlens array has high replication fidelity, but an obvious geometric warpage along the glass substrate also arises. Thermo-mechanical coupled finite element modelling of the embossing process is conducted and verified by the experimental results. Based on trial and error simulations, an appropriate compensation curvature is determined and adopted to modify the geometrical design of the silicon wafer mold. The warpage of the re-embossed microlens array is significantly decreased using the compensated mold, which demonstrates the feasibility of the simulation-oriented compensation scheme. Our work would contribute to improving the quality of optics embossed by this innovative CBG-heating-based hot embossing technique.

scholarly journals Nonuniform Heating Method for Hot Embossing of Polymers with Multiscale Microstructures

Polymers ◽  
2021 ◽  
Vol 13 (3) ◽  
pp. 337
Author(s):  
Chih-Yuan Chang
Keyword(s):  
Hot Embossing ◽  
Single Step ◽  
Nonuniform Heating ◽  
Process Conditions ◽  
Thermoplastic Polymer ◽  
Polymer Microstructure ◽  
Heating Method ◽  
Polymer Substrates ◽  
Flexible Fabrication

The hot embossing of polymers is one of the most popular methods for replicating high-precision structures on thermoplastic polymer substrates at the micro-/nanoscale. However, the fabrication of hybrid multiscale microstructures by using the traditional isothermal hot embossing process is challenging. Therefore, in this study, we propose a novel nonuniform heating method for the hot embossing of polymers with multiscale microstructures. In this method, a thin graphene-based heater with a nonuniform heating function, a facility that integrates the graphene-based heater and gas-assisted hot embossing, and a roll of thermoplastic film are employed. Under appropriate process conditions, multiscale polymer microstructure patterns are fabricated through a single-step hot embossing process. The quality of the multiscale microstructure patterns replicated is uniform and high. The technique has great potential for the rapid and flexible fabrication of multiscale microstructure patterns on polymer substrates.

Study of Flux on Wetting Behavior of Sn-Zn Lead-Free Solders

2011 ◽  
Vol 189-193 ◽  
pp. 3230-3237 ◽  
Author(s):  
Huan Liu ◽  
Feng Xue ◽  
Jian Zhou
Keyword(s):  
Sebacic Acid ◽  
Lead Free ◽  
Wetting Behavior ◽  
Cu Substrate ◽  
Temperature Range ◽  
Sem Image ◽  
Diffusion Layers ◽  
Substrate Surfaces ◽  
Lead Free Solders

The effects of fluxes with different activators (sebacic acid and diethylamine hydrochlcoride) on the wetting behavior of Sn-Zn lead-free solders were investigated. The wettability tests showed that fluxes with the addition of single sebacic acid or diethylamine hydrochlcoride significantly improved wettability of Sn-Zn solder on Cu substrate. However, fluxes with combined additions of above activators promoted wetting performance of the solder further. Thermal analysis (thermal-gravimetry analyzer and differential scanning calorimeter) results demonstrated that the effective temperature range of diethylamine hydrochlcoride is higher than that of sebacic acid. So diethylamine hydrochlcoride could react with oxides on the solder and substrate surfaces at a wider temperature range which resulted in an enhanced spreading of solders. Scanning electron microscopy (SEM) image showed that two kinds of diffusion layers were formed between Sn-Zn solder and Cu substrate, indicating fluxes with binary activators markedly improved welding quality of Sn-Zn solder.

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