Interconnect Reliability of Low Temperature Solder for Potential Application in Enterprise Computers, Portable, and Automotive Electronics

The electroresistance, ER effect of La0.85Ag0.15Mn1-xMoxO3 (x = 0.00 and 0.05) samples prepared using solid method are investigated. The increased of applied current from 5 mA to 10 mA does not change the metal-insulator transition temperature, TMI for both samples however decreased the resistivity in the temperature region of 50 K – 300 K. Both samples exhibit large ER effect at low temperature region. At TMI, the ER value is 75.5% (x =0) and decrease to 34.15% (x = 0.05). However, at 300 K, the value of ER increases to 57 % for Mo substituted sample, and the value decreases to 6.4% for the x =0 sample. The enhanced ER effect at 300 K may be due to the growth of conductive filaments under increased applied current. The increase of applied current may perturb the arrangement of magnetic inhomogeneity induced by Mo substitution, result in reduction of resistivity and lead to the observation of ER effect. These findings suggest potential application of La0.85Ag0.15Mn1-xMoxO3 (x = 0.05) in spintronic devices.

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Enhancing Interconnect Reliability and Performance by Converting Tantalum to 2D Layered Tantalum Sulfide at Low Temperature

Advanced Materials ◽

10.1002/adma.201902397 ◽

2019 ◽

pp. 1902397 ◽

Cited By ~ 4

Author(s):

Chun‐Li Lo ◽

Massimo Catalano ◽

Ava Khosravi ◽

Wanying Ge ◽

Yujin Ji ◽

...

Keyword(s):

Low Temperature ◽

Tantalum Sulfide ◽

Interconnect Reliability ◽

And Performance

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Low-temperature synthesis of multilayer graphene/amorphous carbon hybrid films and their potential application in solar cells

Nanoscale Research Letters ◽

10.1186/1556-276x-7-453 ◽

2012 ◽

Vol 7 (1) ◽

pp. 453 ◽

Cited By ~ 30

Author(s):

Tongxiang Cui ◽

Ruitao Lv ◽

Zheng-Hong Huang ◽

Hongwei Zhu ◽

Yi Jia ◽

...

Keyword(s):

Solar Cells ◽

Low Temperature ◽

Amorphous Carbon ◽

Potential Application ◽

Multilayer Graphene ◽

Hybrid Films ◽

Low Temperature Synthesis ◽

Temperature Synthesis

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Co-combustion studies for potential application of sawdust or its low temperature char as co-fuel with coal

Applied Thermal Engineering ◽

10.1016/j.applthermaleng.2013.11.069 ◽

2014 ◽

Vol 63 (2) ◽

pp. 616-623 ◽

Cited By ~ 27

Author(s):

P. Sarkar ◽

S.G. Sahu ◽

A. Mukherjee ◽

M. Kumar ◽

A.K. Adak ◽

...

Keyword(s):

Low Temperature ◽

Potential Application

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LTCC Thick Film Process Characterization

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2016cicmt-wp13 ◽

2016 ◽

Vol 2016 (CICMT) ◽

pp. 000142-000150 ◽

Cited By ~ 1

Author(s):

M. A. Girardi ◽

K. A. Peterson ◽

P. T. Vianco

Keyword(s):

Thin Film ◽

Low Temperature ◽

Thick Film ◽

High Frequency ◽

Automotive Electronics ◽

Design Flexibility ◽

Process Characterization ◽

Space Electronics ◽

Definition Of ◽

Critical Process

Abstract Low temperature cofired ceramic (LTCC) technology has proven itself in military/space electronics, wireless communication, microsystems, medical and automotive electronics, and sensors. The use of LTCC for high frequency applications is appealing due to its low losses, design flexibility and packaging and integration capability. The LTCC thick film process is summarized including some unconventional process steps such as feature machining in the unfired state and thin film definition of outer layer conductors. The LTCC thick film process was characterized to optimize process yields by focusing on these factors: 1) Print location, 2) Print thickness, 3) Drying of tapes and panels, 4) Shrinkage upon firing, and 5) Via topography. Statistical methods were used to analyze critical process and product characteristics in the determination towards that optimization goal.

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Thick Film Process Characterization for Thin Film Metallized LTCC

Journal of Microelectronics and Electronic Packaging ◽

10.4071/imaps.512 ◽

2016 ◽

Vol 13 (3) ◽

pp. 136-142 ◽

Cited By ~ 1

Author(s):

M. A. Girardi ◽

K. A. Peterson ◽

P. T. Vianco

Keyword(s):

Thin Film ◽

Low Temperature ◽

Thick Film ◽

High Frequency ◽

Automotive Electronics ◽

Design Flexibility ◽

Process Characterization ◽

Space Electronics ◽

Definition Of ◽

Critical Process

Low temperature cofired ceramic (LTCC) technology has proven to be invaluable in military/space electronics, wireless communication, microsystems, medical and automotive electronics, and sensors. The use of LTCC for high-frequency applications is appealing due to its low losses, design flexibility, and packaging and integration capability. The LTCC thick film process is summarized, including some unconventional process steps such as feature machining in the unfired state and thin film definition of outer layer conductors. The LTCC thick film process was characterized to optimize process yields by focusing on the following factors: (1) print location, (2) print thickness, (3) drying of tapes and panels, (4) shrinkage upon firing, and (5) via topography. Statistical methods were used to analyze critical process and product characteristics to achieve the optimization goal.

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