Vertically Aligned Graphene-based Thermal Interface Material with High Thermal Conductivity

2018 ◽  
Author(s):  
Nan Wang ◽  
Shujing Chen ◽  
Amos Nkansah ◽  
Qianlong Wang ◽  
Xitao Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Vertically Aligned

Development of a Compliant Nanothermal Interface Material

2011 ◽  
Author(s):  
David Shaddock ◽  
Stanton Weaver ◽  
Ioannis Chasiotis ◽  
Binoy Shah ◽  
Dalong Zhong
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Stresses ◽  
Performance Testing ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bondline Thickness ◽  
Interface Materials

The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance. High thermal conductivity materials, such as solders, have been used as thermal interface materials. However, there is a limit to minimum bondline thickness in reducing resistance due to increased fatigue stress. A compliant thermal interface material is proposed that allows for thin solder bondlines using a compliant structure within the bondline to achieve thermal resistance <0.01 cm2C/W. The structure uses an array of nanosprings sandwiched between two plates of materials to match thermal expansion of their respective interface materials (ex. silicon and copper). Thin solder bondlines between these mating surfaces and high thermal conductivity of the nanospring layer results in thermal resistance of 0.01 cm2C/W. The compliance of the nanospring layer is two orders of magnitude more compliant than the solder layers so thermal stresses are carried by the nanosprings rather than the solder layers. The fabrication process and performance testing performed on the material is presented.

A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride

2018 ◽  
Vol 6 (36) ◽  
pp. 17540-17547 ◽  
Author(s):  
Zhilin Tian ◽  
Jiajia Sun ◽  
Shaogang Wang ◽  
Xiaoliang Zeng ◽  
Shuang Zhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Three Dimensional ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Hierarchical Porous ◽  
Templated Method

A high thermal conductivity boron nitride based thermal interface material was developed by a foam-templated method.

Thermal Interface Materials From Vertically Aligned Polymer Nanotube Arrays

2013 ◽  
Author(s):  
Thomas L. Bougher ◽  
Virendra Singh ◽  
Baratunde A. Cola
Keyword(s):  
Thermal Conductivity ◽  
Amorphous Polymer ◽  
Quartz Substrate ◽  
Applied Pressure ◽  
Thermal Interface Material ◽  
Bonding Pressure ◽  
Thermal Interface ◽  
Vertically Aligned ◽  
Conductive Fillers ◽  
Enhanced Thermal Conductivity

A number of studies have reported enhancing the thermal conductivity of semi-crystalline polymers through mechanical stretching, but practical application of this process has proven difficult. Here we demonstrate the application of enhanced thermal conductivity in a purely amorphous polymer for a thermal interface material (TIM) without conductive fillers. Many polymer-based TIMs contain carbon fillers to enhance the thermal conductivity, however the TIMs reported herein are comprised solely of polymer nanotubes. The conjugated polymer polythiophene (Pth) is electropolymerized in nanotemplates to produce arrays of vertically aligned nanotubes, which adhere well to opposing substrates through van der Waals forces. We find that the total thermal resistances of the Pth-TIMs are a strong function of height with some dependence on bonding pressure, yet independent of applied pressure after bonding. Photoacoustic measurements show that the total thermal resistance of the TIMs ranges from 9.8 ± 3.8 to 155 ± 32 mm2-K/W depending on the array height and bonding pressure. Estimates of the component resistances indicate that the majority of the resistance is in the contact between the nanotube free tips and the opposing quartz substrate. These Pth-TIMs demonstrate that enhanced thermal conductivity polymers can be suitable for heat transfer materials without thermally conductive fillers.

Development of a Metal Micro-Textured Thermal Interface Material

2009 ◽  
Author(s):  
R. Kempers ◽  
R. Frizzell ◽  
A. Lyons ◽  
A. J. Robinson
Keyword(s):  
Thermal Conductivity ◽  
Applied Pressure ◽  
Solid Particles ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Filler Materials ◽  
Mechanical And Thermal Properties ◽  
Metal Foil ◽  
Thermal Interface ◽  
Thermally Conductive

Typical thermal interface materials (TIMs) consist of high thermal conductivity solid particles dispersed in a continuous, low thermal conductivity organic compound. Despite using filler materials of very high thermal conductivity, the effective thermal conductivity of these TIMs is often two orders of magnitude lower than the pure filler materials. In addition, dispensing and flow of the particle-matrix composite results in voids being trapped within the bond. To address these issues, a novel metal micro-textured thermal interface material (MMT-TIM) has been developed. This material consists of a thin metal foil with raised micro-scale features that plastically deform under an applied pressure thereby creating a continuous, thermally conductive, path between the mating surfaces. Numerical tools have been developed that couple the mechanical and thermal properties and behaviour of MMT-TIMs as they undergo large-plastic deformation during assembly. This study presents the modelling approach and predictions of MMT-TIM performance based on these numerical techniques. The predictions show good agreement with experimental results, which were obtained using prototype MMT-TIMs and an advanced TIM characterization facility. Finally, a future outlook for this technology is presented based on these promising initial results.

Verbesserte Wärmeableitung sorgt für kühlere Motorventile

Konstruktion ◽  
2017 ◽  
Vol 69 (11-12) ◽  
pp. IW8-IW9
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Eine Verbesserte

Auf der IAA 2017 in Frankfurt stellte Federal-Mogul Powertrain neue Werkstoffe für Ventilsitze und -führungen mit verbesserter Wärmeableitung vor (Bild 1). Die serienreifen Materialien High Thermal Conductivity (HTC) und die Beschichtung mit Thermal Interface Material (TIM) können die Temperaturen am Ventilteller um bis zu 70 °C reduzieren. Dies ermöglicht eine verbesserte Verbrennung und niedrigere Emissionen.

scholarly journals An Integrated Approach to Design and Develop High-Performance Polymer-Composite Thermal Interface Material

Polymers ◽  
2021 ◽  
Vol 13 (5) ◽  
pp. 807
Author(s):  
Syed Sohail Akhtar
Keyword(s):  
Thermal Conductivity ◽  
Aspect Ratio ◽  
High Performance ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Design Stage ◽  
Filler Concentration ◽  
Melt Mixing ◽  
Thermal Interface ◽  
Wide Range

A computational framework based on novel differential effective medium approximation and mean-field homogenization is used to design high-performance filler-laden polymer thermal interface materials (TIMs). The proposed design strategy has the capability to handle non-dilute filler concentration in the polymer matrix. The effective thermal conductivity of intended thermal interface composites can be tailored in a wide range by varying filler attributes such as size, aspect ratio, orientation, as well as filler–matrix interface with an upper limit imposed by the shear modulus. Serval potential polymers and fillers are considered at the design stage. High-density polyethylene (HDPE) and thermoplastic polyurethane (TPU) with a non-dilute concentration (~60 vol%) of ceramic fillers exhibit high thermal conductivity (4–5 W m−1 K−1) without compromising the high compliance of TIMs. The predicted thermal conductivity and coefficient of thermal expansion are in excellent agreement with measured data of various binary composite systems considering HDPE, TPU, and polypropylene (PP) loaded with Al2O3 and AlN fillers in varying sizes, shapes, and concentrations, prepared via the melt-mixing and compression-molding route. The model also validates that manipulating filler alignment and aspect ratio can significantly contribute to making heat-conducting networks in composites, which results in ultra-high thermal conductivity.

scholarly journals Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design

Biomolecules ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 132
Author(s):  
Woochang Kim ◽  
Chihyun Kim ◽  
Wonseok Lee ◽  
Jinsung Park ◽  
Duckjong Kim
Keyword(s):  
Thermal Conductivity ◽  
Low Cost ◽  
Three Dimensional ◽  
Precursor Solution ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Interfacial Thermal Resistance ◽  
Thermal Interface ◽  
Wetting Properties ◽  
Earth Abundant

Thermal interface materials (TIMs), typically composed of a polymer matrix with good wetting properties and thermally conductive fillers, are applied to the interfaces of mating components to reduce the interfacial thermal resistance. As a filler material, silver has been extensively studied because of its high intrinsic thermal conductivity. However, the high cost of silver and its toxicity has hindered the wide application of silver-based TIMs. Copper is an earth-abundant element and essential micronutrient for humans. In this paper, we present a copper-based multi-dimensional filler composed of three-dimensional microscale copper flakes, one-dimensional multi-walled carbon nanotubes (MWCNTs), and zero-dimensional copper nanoparticles (Cu NPs) to create a safe and low-cost TIM with a high thermal conductivity. Cu NPs synthesized by microwave irradiation of a precursor solution were bound to MWCNTs and mixed with copper flakes and polyimide matrix to obtain a TIM paste, which was stable even in a high-temperature environment. The cross-plane thermal conductivity of the copper-based TIM was 36 W/m/K. Owing to its high thermal conductivity and low cost, the copper-based TIM could be an industrially useful heat-dissipating material in the future.

Heat Conduction in High Thermal Conductivity Networked Composite Films for Thermal Interface Materials

2011 ◽  
Author(s):  
Hafez Raeisi Fard ◽  
Kamyar Pashayi ◽  
Fengyuan Lai ◽  
Joel Plawsky ◽  
Theodorian Borca-Tasciuc
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Thermal Contact ◽  
Composite Films ◽  
Vital Role ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Thermally Induced ◽  
Resistance Pathway

Fast and efficient exchange of thermal energy plays a vital role in the thermal management of electronic and optoelectronic devices. A critical component for thermal management is a thermal interface material (TIM) that is used to minimize the contact thermal resistance between surfaces and to provide a low resistance pathway to spread and remove heat. Ideal TIMs must pass several key requirements: 1) high thermal conductivity κ and low thermal contact resistance with the mating surfaces; 2) easy to apply with controlled thickness; 3) low temperature processing; 4) able to accommodate thermally induced mechanical stresses during on-off cycling of the device1. Particle-based composites have reasonable slurry viscosities, however their thermal conductivity are usually very low (<10 Wm−1K−1), even when high κ nanofillers are employed, due to the thermal interface resistance between nanoparticles and the polymer matrix2 or the absence of high κ pathways.

Thermal conduction characteristics of silicone composites including ultrasonic-treated graphite

2021 ◽  
pp. 002199832110595
Author(s):  
Weontae Oh ◽  
Jong-Seong Bae ◽  
Hyoung-Seok Moon
Keyword(s):  
Thermal Conductivity ◽  
Ultrasonic Treatment ◽  
Thermal Conduction ◽  
Light Emitting Diode ◽  
Thermal Interface Material ◽  
Ultrasonic Power ◽  
Lighting System ◽  
Thermal Interface ◽  
Light Emitting ◽  
Inorganic Oxides

The microstructural change of graphite was studied after ultrasonic treatment of the graphite. When the graphite solution was treated with varying ultrasonic power and time, the microstructure changed gradually, and accordingly, the thermal conductivity characteristics of the composite containing the as-treated graphite was also different with each other. Thermal conductivity showed the best result in the silicone composite containing graphite prepared under the optimum condition of ultrasonic treatment, and the thermal conductivity of the composite improved proportionally along with the particle size of graphite. When the silicone composite was prepared by using a mixture of inorganic oxides and graphite rather than graphite alone, the thermal conductivity of the silicone composite was further increased. A silicone composite containing graphite was used for LED (light emitting diode) lighting system as a thermal interface material (TIM), and the temperature elevation due to heat generated, while the lighting was actually operated, was analyzed.

scholarly journals Thermal Properties of the Graphene Composites: Application of Thermal Interface Materials

2018 ◽  
Vol 7 (4.33) ◽  
pp. 530
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Zaiazmin Y.N ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Matrix Material ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Uniform Thickness ◽  
Thermal Interface ◽  
Interface Materials ◽  
Main Material

Epoxy mixed with others filler for thermal interface material (TIM) had been well conducted and developed. There are problem occurs when previous material were used as matrix material likes epoxy that has non-uniform thickness of thermal interface material produce, time taken for solidification and others. Thermal pad or thermal interface material using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity and thermal contact resistance. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10 wt. %, 20 wt. % and 30 wt. % of graphene was used with different contain of graphene oxide (GO).  The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/ (mK) with 30 w. % graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene-epoxy is an excellent thermal interface material in increasing thermal conductivity.  

Sign in / Sign up

Export Citation Format

Share Document