A cost-effective repair scheme for clustered TSV defects in 3D ICs

2022 ◽  
Vol 129 ◽  
pp. 114460
Author(s):  
Dilip Kumar Maity ◽  
Surajit Kumar Roy ◽  
Chandan Giri
Keyword(s):  
Cost Effective ◽  
3D Ics

Cost Effective Production of Glass Interposers for 3D ICs Using APEX(TM) Glass Ceramic

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001269-001290
Author(s):  
Jeb H. Flemming ◽  
Kevin Dunn ◽  
James Gouker ◽  
Carrie Schmidt
Keyword(s):  
Glass Ceramic ◽  
Cost Effective ◽  
Electrical Performance ◽  
Sensitive Material ◽  
Aspect Ratios ◽  
3D Ics ◽  
Simple Processing ◽  
Micron Diameter ◽  
On Chip ◽  
Processing Steps

The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; electrical leakage and lack of improved electrical performance beyond 16nm. As a result, industry is transitioning from the current SOC-based approach to a through-silicon-via (TSV) based 3D IC-stacked approach. However, a major challenge remains; these 3D ICs need to be interconnected to other ICs with a much higher number of I/Os than are available with current ceramic or organic interposers. While silicon interposers currently in development can provide these high I/Os, they cannot do so at low enough cost. In this talk, we will present on our efforts in glass interposers fabrication. Glass interposers possess many advantages over silicon interposers including: cost, production time, and scale. Life MicroFab's APEX™ Glass ceramic is a photo-sensitive material used to create high density arrays of through glass vias (TGVs) using three simple processing steps: exposure, baking, and etching. To date, we have been successful in producing large arrays of 12 micron diameter TGVs, with 14 micron center-to-center pitchs, in 125 micron thick APEX™ Glass ceramic. We will present (1) on our efforts producing high aspect ratio TGVs in thin (500-250 micron) and ultra thin (250-75 micron) APEX™ Glass ceramic wafers, (2) maximum TGV aspect ratios, and (3) TGV fidelity and limits of manufacturing.

CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs

2019 ◽  
Vol 29 (11) ◽  
pp. 2050144
Author(s):  
Tianming Ni ◽  
Yue Shu ◽  
Hao Chang ◽  
Lin Lu ◽  
Guangzhen Dai ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Three Dimensional ◽  
Cost Effective ◽  
Bonding Process ◽  
High Yield ◽  
Repair Rate ◽  
3D Ics ◽  
Simulation Results ◽  
Silicon Vias

Due to the winding level of the thinned wafers and the surface roughness of silicon dies, the quality of through-silicon vias (TSVs) varies during the fabrication and bonding process. If one TSV exhibits a defect during its manufacturing process, the probability of multiple defects occurring in the TSVs neighboring increases the faulty TSVs (FTSV), i.e., the TSV defects tend to be clustered which significantly reduces the yield of three-dimensional integrated circuits (3D-ICs). To resolve the clustered TSV faults, router-based and ring-based redundant TSV (RTSV) architecture were proposed. However, the repair rate is low and the hardware overhead is high. In this paper, we propose a novel cross-cellular based RTSV architecture to utilize the area more efficiently as well as to maintain high yield. The simulation results show that the proposed architecture has higher repair rate as well as more cost-effective overhead, compared with router-based and ring-based methods.

scholarly journals Cost-Effective TSV Grouping for Yield Improvement of 3D-ICs

2011 ◽  
Author(s):  
Yi Zhao ◽  
Saqib Khursheed ◽  
Bashir M. Al-Hashimi
Keyword(s):  
Cost Effective ◽  
Yield Improvement ◽  
3D Ics

Cost effective Precision 3D Glass Microfabrication for Electronic Packaging

2011 ◽  
Vol 2011 (1) ◽  
pp. 000199-000201
Author(s):  
Jeb H. Flemming ◽  
Kevin Dunn ◽  
James Gouker ◽  
Carrie Schmidt ◽  
Colin Buckley
Keyword(s):  
Glass Ceramic ◽  
Cost Effective ◽  
Electrical Performance ◽  
Sensitive Material ◽  
Aspect Ratios ◽  
3D Ics ◽  
Simple Processing ◽  
Micron Diameter ◽  
On Chip ◽  
Processing Steps

The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; (1) electrical leakage and (2) the lack of improved electrical performance beyond 16nm. As a result, the industry is transitioning from the current SOC-based approach to a through-silicon-via (TSV) based 3D IC-stacked approach. However, a major challenge remains; these 3D ICs need to be interconnected to other ICs with a much higher number of I/Os than are available with current ceramic or organic interposers. While silicon interposers currently in development can provide these high I/Os, they cannot do so at low enough cost. In this extended abstract, 3D Glass Solutions, a division of Life BioScience, Inc., presents our efforts in glass interposer microfabrication. Glass interposers possess many advantages over silicon interposers including: cost, production time, and scale. 3D Glass Solution’s APEX™ Glass ceramic is a photo-sensitive material used to create high density arrays of through glass vias (TGVs) using three simple processing steps: exposure, baking, and etching. To date, we have been successful in producing large arrays of 12 micron diameter TGVs, with 14 micron center-to-center pitch, in 125 micron thick APEX™ Glass ceramic. This extended abstract covers (1) on our efforts producing high aspect ratio TGVs in ultra thin (75–250 micron) APEX™ Glass ceramic wafers, (2) maximum TGV aspect ratios, and (3) TGV fidelity and limits of manufacturing.

The application of electron microscopy to diagnosis in gynecologic neoplasms and tumor-like conditions

1984 ◽  
Vol 42 ◽  
pp. 102-105
Author(s):  
Lawrence M. Roth
Keyword(s):  
Electron Microscopy ◽  
Reproductive Tract ◽  
Malignant Tumors ◽  
Frozen Section ◽  
Cost Effective ◽  
Female Reproductive Tract ◽  
Ultrastructural Examination ◽  
Specific Diagnosis ◽  
Potential Value ◽  
Gynecologic Neoplasms

The female reproductive tract may be the site of a wide variety of benign and malignant tumors, as well as non-neoplastic tumor-like conditions, most of which can be diagnosed by light microscopic examination including special stains and more recently immunoperoxidase techniques. Nevertheless there are situations where ultrastructural examination can contribute substantially to an accurate and specific diagnosis. It is my opinion that electron microscopy can be of greatest benefit and is most cost effective when applied in conjunction with other methodologies. Thus, I have developed an approach which has proved useful for me and may have benefit for others. In cases where it is deemed of potential value, glutaraldehyde-fixed material is obtained at the time of frozen section or otherwise at operation. Coordination with the gynecologic oncologist is required in the latter situation. This material is processed and blocked and is available if a future need arises.

The IBM-PC in electron microscopy

1996 ◽  
Vol 54 ◽  
pp. 612-613
Author(s):  
James F. Mancuso
Keyword(s):  
Head Start ◽  
Image Acquisition ◽  
Cost Effective ◽  
Financial Applications ◽  
Number Of Factors ◽  
Instrument Control ◽  
The Cost ◽  
Training And Support ◽  
Control Image ◽  
Ibm Pc

IBM PC compatible computers are widely used in microscopy for applications ranging from control to image acquisition and analysis. The choice of IBM-PC based systems over competing computer platforms can be based on technical merit alone or on a number of factors relating to economics, availability of peripherals, management dictum, or simple personal preference.IBM-PC got a strong “head start” by first dominating clerical, document processing and financial applications. The use of these computers spilled into the laboratory where the DOS based IBM-PC replaced mini-computers. Compared to minicomputer, the PC provided a more for cost-effective platform for applications in numerical analysis, engineering and design, instrument control, image acquisition and image processing. In addition, the sitewide use of a common PC platform could reduce the cost of training and support services relative to cases where many different computer platforms were used. This could be especially true for the microscopists who must use computers in both the laboratory and the office.

A Review of 21 iPad Applications for Augmentative and Alternative Communication Purposes

2012 ◽  
Vol 21 (2) ◽  
pp. 60-71 ◽  
Author(s):  
Ashley Alliano ◽  
Kimberly Herriger ◽  
Anthony D. Koutsoftas ◽  
Theresa E. Bartolotta
Keyword(s):  
Augmentative And Alternative Communication ◽  
Cost Effective ◽  
Alternative Form ◽  
Alternative Communication ◽  
Text To Speech ◽  
Reference Guide ◽  
Expressive Communication ◽  
Communication Needs ◽  
User Friendly ◽  
Ipad Applications

Abstract Using the iPad tablet for Augmentative and Alternative Communication (AAC) purposes can facilitate many communicative needs, is cost-effective, and is socially acceptable. Many individuals with communication difficulties can use iPad applications (apps) to augment communication, provide an alternative form of communication, or target receptive and expressive language goals. In this paper, we will review a collection of iPad apps that can be used to address a variety of receptive and expressive communication needs. Based on recommendations from Gosnell, Costello, and Shane (2011), we describe the features of 21 apps that can serve as a reference guide for speech-language pathologists. We systematically identified 21 apps that use symbols only, symbols and text-to-speech, and text-to-speech only. We provide descriptions of the purpose of each app, along with the following feature descriptions: speech settings, representation, display, feedback features, rate enhancement, access, motor competencies, and cost. In this review, we describe these apps and how individuals with complex communication needs can use them for a variety of communication purposes and to target a variety of treatment goals. We present information in a user-friendly table format that clinicians can use as a reference guide.

Teletinnitus Program at the VA Gulf Coast Veterans Health Care System

2014 ◽  
Vol 4 (1) ◽  
pp. 23-29
Author(s):  
Constance Hilory Tomberlin
Keyword(s):  
Health Care ◽  
Patient Satisfaction ◽  
Patient Care ◽  
Health Care System ◽  
Gulf Coast ◽  
New Technology ◽  
Cost Effective ◽  
Veterans Health ◽  
Potential Benefits ◽  
Care System

There are a multitude of reasons that a teletinnitus program can be beneficial, not only to the patients, but also within the hospital and audiology department. The ability to use technology for the purpose of tinnitus management allows for improved appointment access for all patients, especially those who live at a distance, has been shown to be more cost effective when the patients travel is otherwise monetarily compensated, and allows for multiple patient's to be seen in the same time slots, allowing for greater access to the clinic for the patients wishing to be seen in-house. There is also the patient's excitement in being part of a new technology-based program. The Gulf Coast Veterans Health Care System (GCVHCS) saw the potential benefits of incorporating a teletinnitus program and began implementation in 2013. There were a few hurdles to work through during the beginning organizational process and the initial execution of the program. Since the establishment of the Teletinnitus program, the GCVHCS has seen an enhancement in patient care, reduction in travel compensation, improvement in clinic utilization, clinic availability, the genuine excitement of the use of a new healthcare media amongst staff and patients, and overall patient satisfaction.

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