A comparative analysis of printed circuit drying methods for the reliability of assembly process

2022 ◽  
Vol 129 ◽  
pp. 114478
Author(s):  
Piotr Ciszewski ◽  
Mariusz Sochacki ◽  
Wojciech Stęplewski ◽  
Marek Kościelski ◽  
Aneta Araźna ◽  
...  
Keyword(s):  
Comparative Analysis ◽  
Drying Methods ◽  
Assembly Process ◽  
Printed Circuit

Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration

2018 ◽  
Vol 15 (4) ◽  
pp. 141-147 ◽  
Author(s):  
Cheng-Ta Ko ◽  
Henry Yang ◽  
John Lau ◽  
Ming Li ◽  
Margie Li ◽  
...  
Keyword(s):  
Seed Layer ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Heterogeneous Integration ◽  
Assembly Process ◽  
Molding Compound ◽  
Printed Circuit ◽  
Chip Size ◽  
Design Materials ◽  
Dry Film

Abstract The design, materials, process, and fabrication of a heterogeneous integration of four chips by a fan-out panel-level packaging (FOPLP) method are investigated in this study. Emphasis is placed on (1) the application of a dry-film epoxy molding compound for molding the chips and (2) the application of a special assembly process called uni-substrate-integrated package for fabricating the redistribution layers (RDLs) of the FOPLP. The Ajinomoto build-up film is used as the dielectric of the RDLs and is built up by the semiadditive process. Electroless Cu is used to make the seed layer, laser direct imaging is used for opening the photoresist, and printed circuit board (PCB) Cu plating is used for making the conductor wiring of the RDLs. The panel dimensions are 508 × 508 mm. The package dimensions of the FOPLP are 10 × 10 mm. The large chip size and the small chip sizes are, respectively, 5 × 5 mm and 3 × 3 mm. The uniqueness of this study is that all the processes are carried out by using the PCB equipment.

scholarly journals TECHNOLOGICAL PROCESSES OF SOY DRYING

2019 ◽  
pp. 52-58
Author(s):  
Valentyna Bandura ◽  
Oleksandr Popiak
Keyword(s):  
Electromagnetic Field ◽  
Comparative Analysis ◽  
Technological Process ◽  
State Standard ◽  
Soybean Seed ◽  
The State ◽  
Drying Methods ◽  
Soybean Seeds ◽  
Technological Processes

Different technologies of soybean seed drying are considered, their positive and negative sides are revealed. A comparative analysis of drying methods was carried out. It is established that the drying of soybean seeds in an electromagnetic field is one of the most promising. A combination of two methods of drying infrared and microwave soybean seeds in a single technological process is proposed. The requirements for the quality of soybean seeds are considered when stored in accordance with the State Standard, in particular the observance of humidity, which should not be more than 12%.

Technology ability of assembly process analysis of important types of connections

2020 ◽  
pp. 230-234
Author(s):  
N.V. Vodolazskaya
Keyword(s):  
Comparative Analysis ◽  
Process Analysis ◽  
Experimental Studies ◽  
Assembly Process ◽  
Threaded Connections

The article analyses the technological features of assembly of important types of joints, which include group threaded connections. Taking into account the requirements of the joint sealing, the forces in the fasteners for the case of multistroke tightening are calculated. The procedure for loading these parts at the fi rst and subsequent rounds for different values of relative compliance of joint parts is proposed. The calculation versions and the results of comparative analysis of analytical and experimental studies are given.

scholarly journals Comparative analysis of four terpenoids in root and cortex of Tripterygium wilfordii Radix by different drying methods

2016 ◽  
Vol 16 (1) ◽  
Author(s):  
Tuanjie Wang ◽  
Fei Shen ◽  
Shulan Su ◽  
Yongliang Bai ◽  
Sheng Guo ◽  
...  
Keyword(s):  
Comparative Analysis ◽  
Drying Methods ◽  
Tripterygium Wilfordii
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