Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)

A model for thermal fatigue of large area adhesive joints between materials with dissimilar thermal expansion

Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1994.288983 ◽

2002 ◽

Cited By ~ 4

Author(s):

A. Bjorneklett ◽

T. Tuhus ◽

H. Kristiansen

Keyword(s):

Thermal Expansion ◽

Thermal Fatigue ◽

Adhesive Joints ◽

Large Area

Download Full-text

GaAs MMIC thermal modeling for channel temperatures in accelerated life test fixtures and microwave modules

Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1994.288985 ◽

2002 ◽

Cited By ~ 16

Author(s):

J. Wilson ◽

K. Decker

Keyword(s):

Thermal Modeling ◽

Accelerated Life Test ◽

Life Test ◽

Accelerated Life

Download Full-text

Experimental determination of the effect of printed circuit card conductivity on the thermal performance of surface mount electronic packages

Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1994.288995 ◽

2002 ◽

Cited By ~ 14

Author(s):

H. Shaukatullah ◽

M.A. Gaynes

Keyword(s):

Experimental Determination ◽

Thermal Performance ◽

Electronic Packages ◽

Surface Mount ◽

Printed Circuit

Download Full-text

Liquid cooling performance for a 3-dimensional multichip module and miniature heat sink

Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1994.288991 ◽

2002 ◽

Cited By ~ 2

Author(s):

M.R. Vogel

Keyword(s):

Heat Sink ◽

Multichip Module ◽

Liquid Cooling ◽

Cooling Performance ◽

3 Dimensional

Download Full-text

Advanced micro air-cooling systems for high density packaging

Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1994.288994 ◽

2002 ◽

Cited By ~ 14

Author(s):

B. Gromoll

Keyword(s):

High Density ◽

Air Cooling ◽

Cooling Systems ◽

High Density Packaging

Download Full-text

An exact solution of the steady-state surface temperature for a general multilayer structure

Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1994.288984 ◽

2002 ◽

Cited By ~ 4

Author(s):

J. Albers

Keyword(s):

Exact Solution ◽

Steady State ◽

Surface Temperature ◽

Multilayer Structure

Download Full-text

Transient thermal model for the MQUAD microelectronic package

Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1994.288989 ◽

2002 ◽

Cited By ~ 4

Author(s):

B.M. Guenin

Keyword(s):

Thermal Model ◽

Transient Thermal ◽

Microelectronic Package

Download Full-text

Thermal performance of air-cooled hybrid heat sinks for a low velocity environment

Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1994.288999 ◽

2002 ◽

Cited By ~ 7

Author(s):

M.R. Vogel

Keyword(s):

Thermal Performance ◽

Heat Sinks ◽

Low Velocity

Download Full-text

Effect of circuit board parameters on thermal performance of electronic components in natural convection cooling

Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1994.288997 ◽

2002 ◽

Cited By ~ 6

Author(s):

K. Azar ◽

S.S. Pan ◽

J. Parry ◽

H. Rosten

Keyword(s):

Natural Convection ◽

Thermal Performance ◽

Circuit Board ◽

Electronic Components ◽

Convection Cooling

Download Full-text

Analysis of thermal transient data with synthesized dynamic models for semiconductor devices

Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) ◽

10.1109/stherm.1994.288990 ◽

2002 ◽

Cited By ~ 14

Author(s):

J.W. Sofia

Keyword(s):

Dynamic Models ◽

Semiconductor Devices ◽

Transient Data ◽

Thermal Transient

Download Full-text

Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A model for thermal fatigue of large area adhesive joints between materials with dissimilar thermal expansion

GaAs MMIC thermal modeling for channel temperatures in accelerated life test fixtures and microwave modules

Experimental determination of the effect of printed circuit card conductivity on the thermal performance of surface mount electronic packages

Liquid cooling performance for a 3-dimensional multichip module and miniature heat sink

Advanced micro air-cooling systems for high density packaging

An exact solution of the steady-state surface temperature for a general multilayer structure

Transient thermal model for the MQUAD microelectronic package

Thermal performance of air-cooled hybrid heat sinks for a low velocity environment

Effect of circuit board parameters on thermal performance of electronic components in natural convection cooling

Analysis of thermal transient data with synthesized dynamic models for semiconductor devices

Export Citation Format

Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A model for thermal fatigue of large area adhesive joints between materials with dissimilar thermal expansion

GaAs MMIC thermal modeling for channel temperatures in accelerated life test fixtures and microwave modules

Experimental determination of the effect of printed circuit card conductivity on the thermal performance of surface mount electronic packages

Liquid cooling performance for a 3-dimensional multichip module and miniature heat sink

Advanced micro air-cooling systems for high density packaging

An exact solution of the steady-state surface temperature for a general multilayer structure

Transient thermal model for the MQUAD microelectronic package

Thermal performance of air-cooled hybrid heat sinks for a low velocity environment

Effect of circuit board parameters on thermal performance of electronic components in natural convection cooling

Analysis of thermal transient data with synthesized dynamic models for semiconductor devices

Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
Latest Publications