Aluminum Oxide and Silicon Nitride Thin Films as Anti-Corrosion Layers

Author(s):  
C. Qu ◽  
P. Li ◽  
J. Fan ◽  
D. Edwards ◽  
W. Schulze ◽  
...  
2021 ◽  
Vol 1198 (1) ◽  
pp. 012015
Author(s):  
A. Yu. Mironovich ◽  
V.G. Kostishyn ◽  
I.M. Isaev

Abstract In this work structural studies of BaFe12O19/Al2O3/Si3N4 thin films with different thicknesses of aluminum oxide and silicon nitride are represented. It is shown that barium hexaferrite crystallizes on the amorphous surface of aluminum oxide with spontaneously formed (00l) uniaxial texture. Microstructural differences in BaFe12O19 films were observed with varying of the thickness of amorphous sublayers, which is explained by the effect of mechanical stress.


2012 ◽  
Vol 51 (28) ◽  
pp. 6789 ◽  
Author(s):  
Jan Kischkat ◽  
Sven Peters ◽  
Bernd Gruska ◽  
Mykhaylo Semtsiv ◽  
Mikaela Chashnikova ◽  
...  

2002 ◽  
Vol 751 ◽  
Author(s):  
Anindya Dasgupta ◽  
Abhijit Roy Chowdhuri ◽  
Christos G. Takoudis

ABSTRACTThin films of aluminum oxide were deposited on silicon nitride thin films using trimethylaluminum and oxygen at 0.5 Torr and 300 °C. Fourier transform infrared (FTIR) and x-ray photoelectron spectroscopic (XPS) analyses of these films showed no aluminum silicate phase at the film-substrate interface. The O/Al ratio in the deposited film was found to be higher than that in stoichiometric Al2O3 indicating the presence of excess oxygen. FTIR spectroscopy and XPS of the annealed samples did not show any formation of silicon oxide, oxynitride or silicate at the aluminum oxide/silicon nitride interface. In contrast to aluminum oxide on clean silicon substrates, using ultrathin silicon nitride as a barrier layer could prevent excess oxygen migration towards the Si substrate and formation of any interfacial layers.


2006 ◽  
Vol 201 (3-4) ◽  
pp. 1109-1116 ◽  
Author(s):  
Atul Khanna ◽  
Deepak G. Bhat ◽  
Adrian Harris ◽  
Ben D. Beake

1998 ◽  
Vol 546 ◽  
Author(s):  
V. Ziebartl ◽  
O. Paul ◽  
H. Baltes

AbstractWe report a new method to measure the temperature-dependent coefficient of thermal expansion α(T) of thin films. The method exploits the temperature dependent buckling of clamped square plates. This buckling was investigated numerically using an energy minimization method and finite element simulations. Both approaches show excellent agreement even far away from simple critical buckling. The numerical results were used to extract Cα(T) = α0+α1(T−T0 ) of PECVD silicon nitride between 20° and 140°C with α0 = (1.803±0.006)×10−6°C−1, α1 = (7.5±0.5)×10−9 °C−2, and T0 = 25°C.


2010 ◽  
Vol 518 (14) ◽  
pp. 3891-3893 ◽  
Author(s):  
J.C. Alonso ◽  
F.A. Pulgarín ◽  
B.M. Monroy ◽  
A. Benami ◽  
M. Bizarro ◽  
...  

1991 ◽  
Vol 48-49 ◽  
pp. 409-413 ◽  
Author(s):  
T. Wadayama ◽  
T. Hihara ◽  
A. Hatta ◽  
W. Suëtaka

2014 ◽  
Vol 116 (4) ◽  
pp. 043506 ◽  
Author(s):  
F. Volpi ◽  
M. Braccini ◽  
A. Devos ◽  
G. Raymond ◽  
A. Pasturel ◽  
...  

2001 ◽  
Vol 40 (Part 1, No. 6B) ◽  
pp. 4292-4298 ◽  
Author(s):  
Xue-Sen Wang ◽  
Zongquan Li ◽  
Lei Wang ◽  
Yanfang Hu ◽  
Guangjie Zhai ◽  
...  
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