Hot Embossing of Microstructured Surfaces and Thermal Nanoimprinting

2012 ◽  
pp. 123-156
2005 ◽  
Vol 20 (4) ◽  
pp. 449-452 ◽  
Author(s):  
S.-J. Liu ◽  
Y.-T. Dung

2021 ◽  
Vol 113 (1-2) ◽  
pp. 407-417
Author(s):  
Omid Emadinia ◽  
Maria Teresa Vieira ◽  
Manuel Fernando Vieira

Author(s):  
Jie Gao ◽  
Yujun Deng ◽  
Linfa Peng ◽  
Peiyun Yi ◽  
Zhongqin Lin

2021 ◽  
Vol 559 ◽  
pp. 120674
Author(s):  
Michal Kurka ◽  
Karel Palka ◽  
Jiri Jancalek ◽  
Stanislav Slang ◽  
Miroslav Vlcek

2021 ◽  
Vol 112 (11-12) ◽  
pp. 3247-3261
Author(s):  
Zhengjian Wang ◽  
Xichun Luo ◽  
Haitao Liu ◽  
Fei Ding ◽  
Wenlong Chang ◽  
...  

AbstractIn recent years, research has begun to focus on the development of non-resonant elliptical vibration-assisted cutting (EVC) devices, because this technique offers good flexibility in manufacturing a wide range of periodic microstructures with different wavelengths and heights. However, existing non-resonant EVC devices for diamond turning can only operate at relatively low frequencies, which limits their machining efficiencies and attainable microstructures. This paper concerns the design and performance analysis of a non-resonant EVC device to overcome the challenge of low operational frequency. The structural design of the non-resonant EVC device was proposed, adopting the leaf spring flexure hinge (LSFH) and notch hinge prismatic joint (NHPJ) to mitigate the cross-axis coupling of the reciprocating displacements of the diamond tool and to combine them into an elliptical trajectory. Finite element analysis (FEA) using the mapped meshing method was performed to assist the determination of the key dimensional parameters of the flexure hinges in achieving high operational frequency while considering the cross-axis coupling and modal characteristics. The impact of the thickness of the LSFH on the sequence of the vibrational mode shape for the non-resonant EVC device was also quantitatively revealed in this study. Moreover, a reduction in the thickness of the LSFH can reduce the natural frequency of the non-resonant EVC device, thereby influencing the upper limit of its operational frequency. It was also found that a decrease in the neck thickness of the NHPJ can reduce the coupling ratio. Experimental tests were conducted to systematically evaluate the heat generation, cross-axis coupling, modal characteristics and diamond tool’s elliptical trajectory of a prototype of the designed device. The test results showed that it could operate at a high frequency of up to 5 kHz. The cross-axis coupling ratio and heat generation of the prototype are both at an acceptable level. The machining flexibility and accuracy of the device in generating microstructures of different wavelengths and heights through tuning operational frequency and input voltage have also been demonstrated via manufacturing the micro-dimple arrays and two-tier microstructured surfaces. High-precision microstructures were obtained with 1.26% and 10.67% machining errors in wavelength and height, respectively.


2007 ◽  
Vol 84 (1) ◽  
pp. 109-113 ◽  
Author(s):  
Patrick W. Leech ◽  
Robert A. Lee ◽  
Brett A. Sexton ◽  
Fiona Smith
Keyword(s):  

2008 ◽  
Vol 22 (31n32) ◽  
pp. 5887-5894 ◽  
Author(s):  
HONG GUE SHIN ◽  
JONG TAE KWON ◽  
YOUNG HO SEO ◽  
BYEONG HEE KIM

A simple method for the fabrication of polymer master for antireflective surface is presented. In conventional fabrication methods for antireflective surface, coating method with low refractive index have usually been used. However, it is required to have a high cost and a long processing time for mass production. In this paper, antireflective surface was fabricated by using hot embossing process with porous anodized aluminum oxide. Through multi-AAO and etching processes, nano patterned master with high aspect ratio was fabricated at the large area. Size and aspect ratio of nano patterned master are about 175 ± 25 nm and 2 ~ 3, respectively. In order to replicate nano patterned master, hot embossing process was performed by varying the processing parameters such as temperature, pressure and embossing time etc. Finally, antireflective surface can be successfully obtained after etching process to remove selectively silicon layer of AAO master. Optical and rheological characteristics of antireflective surface were analyzed by using SEM, EDX and spectrometer inspection. Antireflective structure by replicating hot embossing process can be applied to various displays and automobile components.


Author(s):  
Maia R. Bageant ◽  
David E. Hardt

Microfluidic technologies hold a great deal of promise in advancing the medical field, but transitioning them from research to commercial production has proven problematic. We propose precision hot embossing as a process to produce high volumes of devices with low capital cost and a high degree of flexibility. Hot embossing has not been widely applied to precision forming of hard polymers at viable production rates. To this end we have developed experimental equipment capable of maintaining the necessary precision in forming parameters while minimizing cycle time. In addition, since equipment precision alone does not guarantee consistent product quality, our work also focuses on real-time sensing and diagnosis of the process. This paper covers both the basic details for a novel embossing machine, and the utilization of the force and displacement data acquired during the embossing cycle to diagnose the state of the material and process. The precision necessary in both the forming machine and the instrumentation will be covered in detail. It will be shown that variation in the material properties (e.g. thickness, glass transition temperature) as well as the degree of bulk deformation of the substrate can be detected from these measurements. If these data are correlated with subsequent downstream functional tests, a total measure of quality may be determined and used to apply closed-loop cycle-to-cycle control to the entire process. By incorporating automation and specialized precision equipment into a tabletop “microfactory” setting, we aim to demonstrate a high degree of process control and disturbance rejection for the process of hot embossing as applied at the micron scale.


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