Thermal Design Method for Strures of Microwave Hot Air Reactor

Author(s):  
Guo Chen ◽  
Jin Chen ◽  
Jinhui Peng
Keyword(s):  
2020 ◽  
Vol 59 (07) ◽  
pp. 1 ◽  
Author(s):  
Gaopeng Zhang ◽  
Hong Zhao ◽  
Yaohong Chen ◽  
Guangdong Zhang ◽  
Zhi Zhang ◽  
...  

Author(s):  
Piyush Sabharwall ◽  
Denis E. Clark ◽  
Ronald E. Mizia ◽  
Michael V. Glazoff ◽  
Michael G. McKellar

The goal of next generation reactors is to increase energy efficiency in the production of electricity and provide high-temperature heat for industrial processes. The efficient transfer of energy for industrial applications depends on the ability to incorporate effective heat exchangers between the nuclear heat transport system and the industrial process. The need for efficiency, compactness, and safety challenge the boundaries of existing heat exchanger technology. Various studies have been performed in attempts to update the secondary heat exchanger that is downstream of the primary heat exchanger, mostly because its performance is strongly tied to the ability to employ more efficient industrial processes. Modern compact heat exchangers can provide high compactness, a measure of the ratio of surface area-to-volume of a heat exchange. The microchannel heat exchanger studied here is a plate-type, robust heat exchanger that combines compactness, low pressure drop, high effectiveness, and the ability to operate with a very large pressure differential between hot and cold sides. The plates are etched and thereafter joined by diffusion welding, resulting in extremely strong all-metal heat exchanger cores. After bonding, any number of core blocks can be welded together to provide the required flow capacity. This study explores the microchannel heat exchanger and draws conclusions about diffusion welding/bonding for joining heat exchanger plates, with both experimental and computational modeling, along with existing challenges and gaps. Also, presented is a thermal design method for determining overall design specifications for a microchannel printed circuit heat exchanger for both supercritical (24 MPa) and subcritical (17 MPa) Rankine power cycles.


2019 ◽  
Vol 141 (3) ◽  
Author(s):  
Sadegh Khalili ◽  
Husam Alissa ◽  
Kourosh Nemati ◽  
Mark Seymour ◽  
Robert Curtis ◽  
...  

There are various designs for segregating hot and cold air in data centers such as cold aisle containment (CAC), hot aisle containment (HAC), and chimney exhaust rack. These containment systems have different characteristics and impose various conditions on the information technology equipment (ITE). One common issue in HAC systems is a pressure build-up inside the HAC (known as backpressure). Backpressure also can be present in CAC systems in case of airflow imbalances. Hot air recirculation, limited cooling airflow rate in servers, and reversed flow through ITE with weaker fan systems (e.g., network switches) are some known consequences of backpressure. Currently, there is a lack of experimental data on the interdependency between overall performance of ITE and its internal design when backpressure is imposed on ITE. In this paper, three commercial 2-rack unit (RU) servers with different internal designs from various generations and performance levels are tested and analyzed under various environmental conditions. Smoke tests and thermal imaging are implemented to study the airflow patterns inside the tested equipment. In addition, the impact of hot air leakage into the servers through chassis perforations on the fan speed and the power consumption of the servers are studied. Furthermore, the cause of the discrepancy between measured inlet temperatures by the intelligent platform management interface (IPMI) and external sensors is investigated. It is found that arrangement of fans, segregation of space upstream and downstream of fans, leakage paths, the location of baseboard management controller (BMC) sensors, and the presence of backpressure can have a significant impact on ITE power and cooling efficiency.


Author(s):  
W. J. Birmingham ◽  
E. M. Bates ◽  
C. A. Romero-Talamás

We describe an analytic approach to designing axially water-cooled Bitter-type electromagnets with an emphasis on heat dissipation considerations. The design method here described aims to enhance the efficiency of the design process by minimizing the role of finite element analysis (FEA) software. A purely analytic design optimization scheme is prescribed for establishing the cooling hole placement. FEA software is only used to check the accuracy of analytic predictions. The analytic method derived in this paper predicts the required heat dissipation rate by approximating the volumetric joule heating profile with a smooth, continuous profile. Equations for turbulent convective heat transfer in circular ducts are generalized to model the cooling capacity of elongated cooling passages. This method is currently in use at the University of Maryland Baltimore County Dusty Plasma Laboratory to design a Bitter magnet capable of generating fields of 10 T.


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