Effect of annealing on nitrogen-doped ZnO grown by MOVPE with a high-speed rotating disk reactor

2010 ◽  
Vol 7 (6) ◽  
pp. 1542-1544 ◽  
Author(s):  
Naoki Nishimoto ◽  
Yuki Matsuo ◽  
Yasuhisa Fujita
1989 ◽  
Vol 145 ◽  
Author(s):  
Paul Reinert ◽  
Mark Mckee ◽  
Peter E. Norris ◽  
Richard A. Stall

AbstractAs the demands for InP epitaxial materials grow, the need for larger throughput growth techniques becomes important. However, uniformity of thickness and particularly composition of InGaAs and InGaAsP films has proved troublesome. This has limited much of the InGaAsP growth work to single wafer machines. The purpose of this work is to demonstrate good film properties and uniformity on a multi-wafer machine that holds three, two-inch diameter wafers.


1989 ◽  
Author(s):  
Mark McKee ◽  
Paul Reinert ◽  
Peter E. Norris ◽  
Richard A. Stall

2008 ◽  
Vol 53 (9(5)) ◽  
pp. 2951-2954 ◽  
Author(s):  
Naoki Nishimoto ◽  
Obuliraj Senthilkumar ◽  
Takahiro Yamamae ◽  
Kasilingam Senthilkumar ◽  
Yasuhisa Fujita

1989 ◽  
Vol 169 ◽  
Author(s):  
D. W. Noh ◽  
B. Gallois ◽  
Y. Q. Li ◽  
C. Chern ◽  
B. Rear ◽  
...  

AbstractSuperconducting thin films of YBa2Cu307‐x were grown on MgO (100) and YSZ(IOO) substrates without post‐annealing by metal organic chemical vapor deposition using vertical, high‐speed (1100 rpm) rotating disk reactor. The source materials were Y(tmhd)3, Ba(tmhd)2, and Cu(tmhd)2, which were kept at 135 °C, 240 °C, and 120 °C respectively. The precursors were transported using nitrogen as the carrier gas and introduced separately into the cylindrical stainless steel reaction chamber, which was maintained at 60 torr. The oxygen partial pressure was 30 Torr. The substrates were heated resistively at 800°C. After growth, the films were cooled down at a rate of 5 °C/min under 1 atmospheric pressure of pure oxygen. The X‐ray diffraction pattern of the films showed primarily an orientation of c‐axis perpendicular to the substrates, with weak peaks of (hoo) corresponding to a‐axis orientation. Scanning Electron Microscopy of the films showed a well‐developed a‐axis and c‐axis plate‐like structure which appeared as rectangular micron‐sized features on the MgO surface. On the YSZ substrates a‐axis and c‐axis plate‐like projections were also observed, with the dense plate‐like c‐axis orientation dominant. Four probe resistance measurements showed Tc(R=0) at 91.8 K(△TC=2.2 K) and 85 K (△TC=7 K) on YSZ and MgO substrates respectively.


Author(s):  
Alan G. Thompson ◽  
M. Schurman ◽  
Z. C. Feng ◽  
R. F. Karlicek ◽  
T. Salagaj ◽  
...  

In the past year, several organizations have fabricated reliable, high-brightness LEDs from III-Nitride materials that emit in the blue and green. Recently, Nichia in Japan have announced lasing action in GaN-based diodes. Quantum well structures are key to all these results, offering higher brightness, narrower EL linewidths, and a wider spectral range. In order for the III-Nitride technology to develop, the material growth technique must offer high volume at low cost in addition to the requisite device performance. To date, only MOVPE has demonstrated this capability. We have previously reported the growth of GaN, InGaN, and AlGaN layers by MOVPE in a multi-wafer, high-speed rotating disk reactor. Both n- and p-doping and high quality optical properties have been achieved. In this paper we extend this earlier work and present results of the performance of InGaN / (Al)GaN quantum well structures. Intense PL spectra were observed in the violet and blue regions. The thinnest wells show evidence from PL and DCXRD measurments of either discontinuous layers (islands) or a diffuse upper interface, with preliminary TEM results showing the latter to be the most likely. We also report excellent uniformity of these quantum well structures, and show electroluminescence from a SQW diode emitting at 473 nm.


1992 ◽  
Vol 282 ◽  
Author(s):  
G. S. Tompa ◽  
E. Wolak ◽  
R. A. Stall ◽  
M. A. George ◽  
M. Lippitt ◽  
...  

ABSTRACTA vertical high-speed, rotating disk reactor has been used to produce Al and CuAl alloy films on 125 mm diameter Si (100) wafers. Trimethylamine-alane and Cu (hexafluoroacetylacetonate) trimethylvinylsilane (CupraSelect™) were used as metal precursors. Aluminum films were deposited over the temperature range from ∼100 C to 700 C. Aluminum sheet resistance measurements showed the films to have resistance 2 to 3 times that of bulk Al films. CuAl alloy films were deposited sequentially and by codeposition. At 30 Torr, deposition rates as high as 3.7 um/hr, 0.024 um/hr, and 1 um/hr for Al, Cu, and CuAl films, respectively, were demonstrated. Auger analysis showed the deposited films to be free of contaminants.


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