Effect of heat‐sealing parameters on the thermal profile and seal strength of multilayer films and non‐woven

Author(s):  
Divya Ponnambalam ◽  
Loong Tak Lim ◽  
Annamalai Manickavasagan ◽  
Fu Yucheng





2016 ◽  
Vol 34 (1) ◽  
pp. 10-26 ◽  
Author(s):  
Zhansheng Guo ◽  
Yang Fan ◽  
Shiyu Du

The heat-seal strength of polymer–metal–polymer laminates, widely used in the packaging industry and more recently for pouch lithium-ion batteries, is a critical factor for the integrity of flexible package structures during service. The influences of lithium hexafluorophosphate/ethylene carbonate/dimethyl carbonate (LiPF6/EC/DMC) electrolyte soaking time and storage temperature on heat-seal strength were investigated through T-peel testing using a universal testing machine. Sealed multilayer laminates’ heat-seal strength and their failure modes were measured for specimens sealed at various heat-sealing temperatures and dwell times before and after exposure to room temperature and 60℃ soaking conditions. The soaking condition significantly influences heat-seal strength, especially for the packages heat-sealed at low temperatures and short heat-sealing times. Higher storage temperature during electrolyte-soaking accelerates the heat-seal strength decrease. Failure modes are affected by the soaking conditions and become more complicated than the packages without soaking. The optimized heat-sealing processing window is obtained under a certain soaking condition. The electrolyte hydrogen ion concentration (pH) decreases with longer soaking time and higher storage temperature, indicating that acidification may also contribute to decreased heat-seal strength. The results are important for understanding how stored lithium-ion batteries deteriorate and can help to guide battery design to maximize their shelf life.



2016 ◽  
Vol 36 (9) ◽  
pp. 909-916 ◽  
Author(s):  
Toshiharu Iwasaki ◽  
Wataru Takarada ◽  
Takeshi Kikutani

Abstract The effects of processing conditions for peelable heat sealing of multilayered polyethylene (PE) films on heat sealing behavior and heat seal strength were investigated. Two sets of seal bars, knurled shape and flat shape, were used for heat sealing. After the heat sealing, the sealed portion was cooled using a set of cooling bars. Heat sealing temperature was adjusted to yield the heat seal strength of 4.0 N/15 mm, 6.0 N/15 mm and 8.0 N/15 mm at the heat sealing pressure of 0.4 MPa for each set of heat sealing bars. The heat seal strength increased with the increase of heat sealing pressure for the knurled shape bars, while it was less affected by heat sealing pressure for the flat shape bars. In situ measurements of the sealing bar clearance and interface temperature revealed that the reduction speed of clearance was significantly affected by the pressure for knurled shape bars, while it was almost independent of pressure for flat shape bars. Even though the temperatures set for the similar heat seal strength were different between knurled and flat shape bars, the maximum temperatures at the interface were almost identical. The effect of the shape of seal bars on heat seal strength became less significant after the sterilization process.



Author(s):  
Amanda K. Petford-Long ◽  
A. Cerezo ◽  
M.G. Hetherington

The fabrication of multilayer films (MLF) with layer thicknesses down to one monolayer has led to the development of materials with unique properties not found in bulk materials. The properties of interest depend critically on the structure and composition of the films, with the interfacial regions between the layers being of particular importance. There are a number of magnetic MLF systems based on Co, several of which have potential applications as perpendicular magnetic (e.g Co/Cr) or magneto-optic (e.g. Co/Pt) recording media. Of particular concern are the effects of parameters such as crystallographic texture and interface roughness, which are determined by the fabrication conditions, on magnetic properties and structure.In this study we have fabricated Co-based MLF by UHV thermal evaporation in the prechamber of an atom probe field-ion microscope (AP). The multilayers were deposited simultaneously onto cobalt field-ion specimens (for AP and position-sensitive atom probe (POSAP) microanalysis without exposure to atmosphere) and onto the flat (001) surface of oxidised silicon wafers (for subsequent study in cross-section using high-resolution electron microscopy (HREM) in a JEOL 4000EX. Deposi-tion was from W filaments loaded with material in the form of wire (Co, Fe, Ni, Pt and Au) or flakes (Cr). The base pressure in the chamber was around 8×10−8 torr during deposition with a typical deposition rate of 0.05 - 0.2nm/s.



1997 ◽  
Vol 473 ◽  
Author(s):  
H. S. Yang ◽  
F. R. Brotzen ◽  
D. L. Callahan ◽  
C. F. Dunn

ABSTRACTQuantitative measurement of the adhesion strength of thin film metallizations has been achieved by a novel technique employing electrostatic forces to generate delaminating stresses. This technique has been used in testing the adhesion of Al-Cu, Cu, and Al multilayer films deposited on Si. Micro-blister-type failure is revealed by scanning electron microscopy. The delamination process and the geometry of the blister are discussed. The measured adhesion data fit a Weibull distribution function.





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