Layer‐By‐Layer Printing Strategy for High‐Performance Flexible Electronic Devices with Low‐Temperature Catalyzed Solution‐Processed SiO 2

Small Methods ◽  
2021 ◽  
pp. 2100263
Author(s):  
Qingqing Sun ◽  
Tianqi Gao ◽  
Xiaomeng Li ◽  
Wanli Li ◽  
Xiaoqian Li ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Performance ◽  
Electronic Devices ◽  
Layer By Layer ◽  
Solution Processed ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

scholarly journals A bio-enabled maximally mild layer-by-layer Kapton surface modification approach for the fabrication of all-inkjet-printed flexible electronic devices

2016 ◽  
Vol 6 (1) ◽  
Author(s):  
Yunnan Fang ◽  
Jimmy G. D. Hester ◽  
Wenjing Su ◽  
Justin H. Chow ◽  
Suresh K. Sitaraman ◽  
...  
Keyword(s):  
Surface Modification ◽  
Electronic Devices ◽  
Layer By Layer ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

High performance n-type organic–inorganic nanohybrid semiconductors for flexible electronic devices

2011 ◽  
Vol 12 (2) ◽  
pp. 348-352 ◽  
Author(s):  
Yerok Park ◽  
Kyu S. Han ◽  
Byoung H. Lee ◽  
Sangho Cho ◽  
Kwang H. Lee ◽  
...  
Keyword(s):  
High Performance ◽  
Electronic Devices ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

Low Temperature Solution-Based Fabrications of Metal Oxide Semiconductor Films by Mechanical Sintering

2008 ◽  
Vol 1113 ◽  
Author(s):  
Manabu Yoshida ◽  
Kouji Suemori ◽  
Sei Uemura ◽  
Satoshi Hoshino ◽  
Noriyuki Takada ◽  
...  
Keyword(s):  
Low Temperature ◽  
Metal Oxide ◽  
Electronic Devices ◽  
Three Dimensional ◽  
Solution Process ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Flexible Electronic ◽  
Printed Patterns ◽  
Flexible Electronic Devices

ABSTRACTVarious flexible electronic devices have been intensively studied and developed in this decade. Most of consumers expect to obtain these flexible electronic devices in the next decade. The spread of flexible electronic devices depends on the process costs and material costs. Today prices of materials and energy sources are continuously increasing. Therefore, using of expensive materials and wasteful processes for fabricating electronic devices should be reconsidered. Printing techniques, a representative solution process, are inexpensive and very effective for mass production of electronic devices. We have developed a low-temperature process for fabricating flexible printed patterns of metals and semiconductors by using relatively inexpensive commercial pastes. A characteristic of our process is to utilize mechanical energies for sintering particles contained in pastes. In our process, the precise three-dimensional pressure control brings about the improvement of electrical properties in the printed patterns, the preservation of pattern accuracy and the mechanical durability of the printed patterns. In our experiment, we have already fabricated very low resistivity metal patterns (about 6×10−6Ω·cm) at ca.120°C without using any kinds of nano-particle paste, and also fabricated metal oxide semiconductor patterns.

High performance, environmentally benign and integratable Zn//MnO2microbatteries

2018 ◽  
Vol 6 (9) ◽  
pp. 3933-3940 ◽  
Author(s):  
Wenhui Lai ◽  
Yang Wang ◽  
Zhanwu Lei ◽  
Ronghe Wang ◽  
Ziyin Lin ◽  
...  
Keyword(s):  
High Performance ◽  
Light Emitting Diode ◽  
Electronic Devices ◽  
Environmentally Benign ◽  
Battery Cell ◽  
Light Emitting ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

A Zn//MnO2micro-battery cell can power a light-emitting diode (LED) and share the same fabrication platform with many flexible electronic devices.

A novel, facile, layer-by-layer substrate surface modification for the fabrication of all-inkjet-printed flexible electronic devices on Kapton

2016 ◽  
Vol 4 (29) ◽  
pp. 7052-7060 ◽  
Author(s):  
Yunnan Fang ◽  
Jimmy G. D. Hester ◽  
Ben M. deGlee ◽  
Chia-Chi Tuan ◽  
Philip D. Brooke ◽  
...  
Keyword(s):  
Surface Modification ◽  
Substrate Surface ◽  
Electronic Devices ◽  
Layer By Layer ◽  
Flexible Electronic ◽  
Surface Modified ◽  
Weak Polyelectrolytes ◽  
First Time ◽  
Flexible Electronic Devices

Kapton HN films were surface modified, for the first time, by taking advantage of their additive and using only weak polyelectrolytes, for all-inkjet-printed flexible electronic devices.

Highly conductive and flexible molybdenum oxide nanopaper for high volumetric supercapacitor electrode

2017 ◽  
Vol 5 (6) ◽  
pp. 2897-2903 ◽  
Author(s):  
Liang Huang ◽  
Bin Yao ◽  
Jiyu Sun ◽  
Xiang Gao ◽  
Jiabin Wu ◽  
...  
Keyword(s):  
Molybdenum Oxide ◽  
High Performance ◽  
Electronic Devices ◽  
High Conductivity ◽  
Supercapacitor Electrode ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

Paper-like electrodes with high conductivity and flexibility hold great potential for assembling high-performance flexible electronic devices.

A rapid low temperature self-healable polymeric composite for flexible electronic devices

2018 ◽  
Vol 6 (43) ◽  
pp. 21428-21434 ◽  
Author(s):  
Naveen Tiwari ◽  
Fanny Ho ◽  
Ankit Ankit ◽  
Nripan Mathews
Keyword(s):  
Ionic Liquid ◽  
Dielectric Properties ◽  
Low Temperature ◽  
Electronic Devices ◽  
Polymeric Composite ◽  
Diels Alder ◽  
Flexible Electronic ◽  
Healing Temperature ◽  
Alder Adduct ◽  
Flexible Electronic Devices

Ionic liquid incorporation into Diels–Alder adduct based healable polymers drastically reduces their healing temperature and improves their mechanical and dielectric properties.

scholarly journals Nanoscale Analysis of Surface Bending Strain in Film Substrates for Preventing Fracture in Flexible Electronic Devices

2021 ◽  
pp. 2001662
Author(s):  
Ryo Taguchi ◽  
Norihisa Akamatsu ◽  
Kohei Kuwahara ◽  
Kayoko Tokumitsu ◽  
Yoshiaki Kobayashi ◽  
...  
Keyword(s):  
Electronic Devices ◽  
Bending Strain ◽  
Flexible Electronic ◽  
Flexible Electronic Devices
Sign in / Sign up

Export Citation Format

Share Document