Fabrication Technologies for the On‐Chip Integration of 2D Materials

With compact footprint, low energy consumption, high scalability, and mass producibility, chip-scale integrated devices are an indispensable part of modern technological change and development. Recent advances in two-dimensional (2D) layered materials with their unique structures and distinctive properties have motivated their on-chip integration, yielding a variety of functional devices with superior performance and new features. To realize integrated devices incorporating 2D materials, it requires a diverse range of device fabrication techniques, which are of fundamental importance to achieve good performance and high reproducibility. This paper reviews the state-of-art fabrication techniques for the on-chip integration of 2D materials. First, an overview of the material properties and on-chip applications of 2D materials is provided. Second, different approaches used for integrating 2D materials on chips are comprehensively reviewed, which are categorized into material synthesis, on-chip transfer, film patterning, and property tuning / modification. Third, the methods for integrating 2D van der Waals heterostructures are also discussed and summarized. Finally, the current challenges and future perspectives are highlighted.

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Strong Light–Matter Interactions in 2D Materials Assisted by On-chip Optoelectronic Devices

Two–Dimensional Materials in Nanophotonics ◽

10.1201/9780429428777-7 ◽

2019 ◽

pp. 209-271

Author(s):

Xuetao Gan ◽

Liang Fang ◽

Jianlin Zhao

Keyword(s):

2D Materials ◽

Optoelectronic Devices ◽

Strong Light ◽

On Chip

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Recent Developments in All-Solid-State Micro-Supercapacitors Based on Two-Dimensional Materials

10.5772/intechopen.94535 ◽

2020 ◽

Author(s):

Minu Mathew ◽

Sithara Radhakrishnan ◽

Chandra Sekhar Rout

Keyword(s):

Solid State ◽

Mechanical Stability ◽

2D Materials ◽

High Surface ◽

High Surface Area ◽

Diffusion Path ◽

Redox Activity ◽

Good Surface ◽

Recent Developments ◽

On Chip

Owing to their unique features such as high surface area, rich electroactive sites, ultrathin thickness, excellent flexibility and mechanical stability and multiple surface functionalities enables outstanding electrochemical response which provides high energy and power density supercapacitors based on them. Also, the Van der Waals gap between layered 2D materials encourages the fast ion transport with shorter ion diffusion path. 2D materials such as MXenes, graphene, TMDs, and 2D metal–organic frame work, TMOs/TMHs materials, have been described with regard to their electrochemical properties for MSCs. We have summarized the recent progress in MSC based on well-developed 2D materials-based electrodes and its potential outcomes with different architectures including interdigitated pattern, stacked MSC and 3D geometries for on-chip electronics. This chapter provides a brief overview of the recent developments in the field of 2D material based all-solid-state microsupercapacitors (MSCs). A brief note on the MSC device configuration and microfabrication methods for the microelectrodes have been discussed. Taking advantage of certain 2D materials such as 2D MXenes, TMDs, TMOs/TMHs that provide good surface chemistry, tunable chemical and physical properties, intercalation, surface modification (functionalization), heterostructures, phase transformations, defect engineering etc. are beneficial for enhancement in pseudocapacitance as it promotes the redox activity.

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Fabrication techniques for the integration of 2D materials

10.36227/techrxiv.17035937 ◽

2021 ◽

Author(s):

David Moss

Keyword(s):

2D Materials ◽

Device Fabrication ◽

Superior Performance ◽

Material Synthesis ◽

Diverse Range ◽

2D Layered Materials ◽

Integrated Devices ◽

Low Energy Consumption ◽

High Scalability ◽

On Chip

<a>With compact footprint, low energy consumption, high scalability, and mass producibility, chip-scale integrated devices are an indispensable part of modern technological change and development. Recent advances in </a>two-dimensional (2D) layered materials with their unique structures and distinctive properties have motivated their on-chip integration, yielding a variety of functional devices with superior performance and new features. To realize integrated devices incorporating 2D materials, it requires a diverse range of device fabrication techniques, which are of fundamental importance to achieve good performance and high reproducibility. This paper reviews the state-of-art fabrication techniques for the on-chip integration of 2D materials. First, an overview of the material properties and on-chip applications of 2D materials is provided. Second, different approaches used for integrating 2D materials on chips are comprehensively reviewed, which are categorized into material synthesis, on-chip transfer, film patterning, and property tuning / modification. Third, the methods for integrating 2D van der Waals heterostructures are also discussed and summarized. Finally, the current challenges and future perspectives are highlighted.

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2021 Joseph W. Richards Fellowship – Summary Report: Toward On-Chip Electronic Monitoring of Bacterial Conjugation

The Electrochemical Society Interface ◽

10.1149/2.f05214if ◽

2021 ◽

Vol 30 (4) ◽

pp. 30-31

Author(s):

Derrick Butler

Keyword(s):

Antibiotic Resistance ◽

Sample Preparation ◽

Electronic Monitoring ◽

2D Materials ◽

Genetic Material ◽

Bacterial Conjugation ◽

Two Dimensional ◽

Summary Report ◽

Communication Method ◽

On Chip

Intercellular conjugation is a primary communication method by which bacteria transfer genetic material from one cell to another. Because conjugation mediates the transfer of genetic material, it enables the spread of antibiotic resistance and other virulence factors within a population. Current techniques for its study have low throughput and require extensive sample preparation, making real-time monitoring of conjugation dynamics challenging.To address these shortcomings, we are exploring two-dimensional (2D) materials as a strain-sensitive platform for on-chip, electronic monitoring of conjugation events.

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Fabrication techniques for the integration of 2D materials

10.36227/techrxiv.17035937.v1 ◽

2021 ◽

Author(s):

David Moss

Keyword(s):

2D Materials ◽

Device Fabrication ◽

Superior Performance ◽

Material Synthesis ◽

Diverse Range ◽

2D Layered Materials ◽

Integrated Devices ◽

Low Energy Consumption ◽

High Scalability ◽

On Chip

<a>With compact footprint, low energy consumption, high scalability, and mass producibility, chip-scale integrated devices are an indispensable part of modern technological change and development. Recent advances in </a>two-dimensional (2D) layered materials with their unique structures and distinctive properties have motivated their on-chip integration, yielding a variety of functional devices with superior performance and new features. To realize integrated devices incorporating 2D materials, it requires a diverse range of device fabrication techniques, which are of fundamental importance to achieve good performance and high reproducibility. This paper reviews the state-of-art fabrication techniques for the on-chip integration of 2D materials. First, an overview of the material properties and on-chip applications of 2D materials is provided. Second, different approaches used for integrating 2D materials on chips are comprehensively reviewed, which are categorized into material synthesis, on-chip transfer, film patterning, and property tuning / modification. Third, the methods for integrating 2D van der Waals heterostructures are also discussed and summarized. Finally, the current challenges and future perspectives are highlighted.

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Simultaneously enhanced linear and nonlinear photon generations from WS2 by using dielectric circular Bragg resonators

Nanophotonics ◽

10.1515/nanoph-2020-0143 ◽

2020 ◽

Vol 9 (8) ◽

pp. 2587-2592

Author(s):

Bo Chen ◽

Zhe He ◽

Zhuo-Jun Liu ◽

Yun-Kun Wang ◽

Yu-Nan Gao ◽

...

Keyword(s):

Second Harmonic ◽

2D Materials ◽

Transition Metal Dichalcogenides ◽

Optoelectronic Devices ◽

Linear Optics ◽

Non Linear Optics ◽

Bragg Resonator ◽

Metal Dichalcogenides ◽

Linear And Nonlinear ◽

On Chip

AbstractMonolayer transition metal dichalcogenides (TMDs) have emerged as a promising platform for chip-integrated optoelectronics and non-linear optics. Here, we demonstrate a two-dimensional (2D) monolayer tungsten disulfide (WS2) efficiently coupled to a dielectric circular Bragg resonator (CBR). The coupling of the WS2 and CBR leads to pronounced enhancements in both photoluminescence (PL) and second harmonic generation (SHG) by a factor of 34 and 5, respectively. Our work provides a powerful tool to enhance the interactions between light and the 2D materials, paving the way for efficient on-chip optoelectronic devices.

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2D materials integrated with metallic nanostructures: fundamentals and optoelectronic applications

Nanophotonics ◽

10.1515/nanoph-2020-0074 ◽

2020 ◽

Vol 9 (7) ◽

pp. 1877-1900 ◽

Cited By ~ 2

Author(s):

Siqi Yan ◽

Xiaolong Zhu ◽

Jianji Dong ◽

Yunhong Ding ◽

Sanshui Xiao

Keyword(s):

2D Materials ◽

Optoelectronic Devices ◽

Metallic Nanostructures ◽

Atomic Scale ◽

Future Research ◽

Plasmonic Nanostructures ◽

Metal Structures ◽

Scale Thickness ◽

Future Research Directions ◽

On Chip

AbstractDue to their novel electronic and optical properties, atomically thin layered two-dimensional (2D) materials are becoming promising to realize novel functional optoelectronic devices including photodetectors, modulators, and lasers. However, light–matter interactions in 2D materials are often weak because of the atomic-scale thickness, thus limiting the performances of these devices. Metallic nanostructures supporting surface plasmon polaritons show strong ability to concentrate light within subwavelength region, opening thereby new avenues for strengthening the light–matter interactions and miniaturizing the devices. This review starts to present how to use metallic nanostructures to enhance light–matter interactions in 2D materials, mainly focusing on photoluminescence, Raman scattering, and nonlinearities of 2D materials. In addition, an overview of ultraconfined acoustic-like plasmons in hybrid graphene–metal structures is given, discussing the nonlocal response and quantum mechanical features of the graphene plasmons and metals. Then, the review summarizes the latest development of 2D material–based optoelectronic devices integrated with plasmonic nanostructures. Both off-chip and on-chip devices including modulators and photodetectors are discussed. The potentials of hybrid 2D materials plasmonic optoelectronic devices are finally summarized, giving the future research directions for applications in optical interconnects and optical communications.

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Integration of 2D materials on a silicon photonics platform for optoelectronics applications

Nanophotonics ◽

10.1515/nanoph-2016-0155 ◽

2016 ◽

Vol 6 (6) ◽

pp. 1205-1218 ◽

Cited By ~ 29

Author(s):

Nathan Youngblood ◽

Mo Li

Keyword(s):

Optical Properties ◽

Data Storage ◽

Silicon Photonics ◽

High Performance ◽

2D Materials ◽

Covalent Bonds ◽

Networks On Chip ◽

Out Of Plane ◽

Telecom Networks ◽

On Chip

AbstractOwing to enormous growth in both data storage and the demand for high-performance computing, there has been a major effort to integrate telecom networks on-chip. Silicon photonics is an ideal candidate, thanks to the maturity and economics of current CMOS processes in addition to the desirable optical properties of silicon in the near IR. The basics of optical communication require the ability to generate, modulate, and detect light, which is not currently possible with silicon alone. Growing germanium or III/V materials on silicon is technically challenging due to the mismatch between lattice constants and thermal properties. One proposed solution is to use two-dimensional materials, which have covalent bonds in-plane, but are held together by van der Waals forces out of plane. These materials have many unique electrical and optical properties and can be transferred to an arbitrary substrate without lattice matching requirements. This article reviews recent progress toward the integration of 2D materials on a silicon photonics platform for optoelectronic applications.

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