Influence of water absorption on high-frequency characteristics of insulation layers of printed circuit boards

2007 ◽  
Vol 2 (6) ◽  
pp. 596-599 ◽  
Author(s):  
Kaori Fukunaga ◽  
Shinji Kurahashi
2018 ◽  
Vol 193 ◽  
pp. 140-153 ◽  
Author(s):  
Gautier Girard ◽  
Mohamad Jrad ◽  
Slim Bahi ◽  
Marion Martiny ◽  
Sébastien Mercier ◽  
...  

2016 ◽  
Vol 2016 ◽  
pp. 1-4
Author(s):  
Abel Pérez ◽  
Alfonso Torres ◽  
Reydezel Torres

A simple low plasma power and roughness free process for improving the adherence of Cu to PTFE is presented. The results show that low pressure and Ar flow combination are the drivers of this improved adherence. Copper Peel Strength Tensile values up to 60 kg/m are obtained which are comparable to those shown in commercial composite dielectrics for high-frequency applications Printed Circuit Boards.


2014 ◽  
Vol 3 (4) ◽  
pp. 104-113 ◽  
Author(s):  
Miroslav Kotzev ◽  
Young H. Kwark ◽  
Sebastian Muller ◽  
Andreas Hardock ◽  
Renato Rimolo-Donadio ◽  
...  

Author(s):  
Takeshi ARAI ◽  
Yoshiyuki ISHII ◽  
Masakatsu KUROKI ◽  
Hidehisa YOKOYAMA ◽  
Shozo KINOSHITA ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document