scholarly journals The Evaluation of Thermosetting Polyphenylene Ether for High Frequency Multilayer Printed Circuit Boards.

Author(s):  
Takeshi ARAI ◽  
Yoshiyuki ISHII ◽  
Masakatsu KUROKI ◽  
Hidehisa YOKOYAMA ◽  
Shozo KINOSHITA ◽  
...  
2018 ◽  
Vol 193 ◽  
pp. 140-153 ◽  
Author(s):  
Gautier Girard ◽  
Mohamad Jrad ◽  
Slim Bahi ◽  
Marion Martiny ◽  
Sébastien Mercier ◽  
...  

2016 ◽  
Vol 2016 ◽  
pp. 1-4
Author(s):  
Abel Pérez ◽  
Alfonso Torres ◽  
Reydezel Torres

A simple low plasma power and roughness free process for improving the adherence of Cu to PTFE is presented. The results show that low pressure and Ar flow combination are the drivers of this improved adherence. Copper Peel Strength Tensile values up to 60 kg/m are obtained which are comparable to those shown in commercial composite dielectrics for high-frequency applications Printed Circuit Boards.


2014 ◽  
Vol 3 (4) ◽  
pp. 104-113 ◽  
Author(s):  
Miroslav Kotzev ◽  
Young H. Kwark ◽  
Sebastian Muller ◽  
Andreas Hardock ◽  
Renato Rimolo-Donadio ◽  
...  

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