The Evaluation of Thermosetting Polyphenylene Ether for High Frequency Multilayer Printed Circuit Boards.
1995 ◽
Vol 10
(3)
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pp. 153-160
2016 ◽
Vol 19
(1)
◽
pp. 9-13
Keyword(s):
Solder connections for high frequency applications between flexible and rigid printed circuit boards
2006 ◽
Vol 29
(1)
◽
pp. 118-126
◽
2018 ◽
Vol 193
◽
pp. 140-153
◽
Keyword(s):
Keyword(s):
2014 ◽
Vol 3
(4)
◽
pp. 104-113
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Keyword(s):
2007 ◽
Vol 2
(6)
◽
pp. 596-599
◽
2012 ◽
Vol 132
(12)
◽
pp. 1897-1903
◽
Keyword(s):