Simulated high-frequency characteristics of coaxial via connection structures in printed circuit boards using three-dimensional electromagnetic field analysis

2009 ◽  
Author(s):  
Yoshiyuki Takasu ◽  
Katsuya Kikuchi ◽  
Hiroshi Nakagawa ◽  
Kohji Koshiji ◽  
Masahiro Aoyagi
Keyword(s):  
Electromagnetic Field ◽  
High Frequency ◽  
Printed Circuit Boards ◽  
Three Dimensional ◽  
Frequency Characteristics ◽  
Field Analysis ◽  
Circuit Boards ◽  
Printed Circuit

Three Dimensional Packaging of Bare IC Into Printed Circuit Boards for SIP

2003 ◽  
Author(s):  
Erik Jung ◽  
Dirk Wojakowski ◽  
Alexander Neumann ◽  
Rolf Aschenbrenner ◽  
Herbert Reichl
Keyword(s):  
Thermal Management ◽  
Printed Circuit Boards ◽  
Electrical Contact ◽  
Autonomous Systems ◽  
Three Dimensional ◽  
Circuit Boards ◽  
Passive Components ◽  
Electronic Products ◽  
Printed Circuit ◽  
Manufacturing Methods

The demand to miniaturize products especially for mobile applications and autonomous systems is continuing to drive the evolution of electronic products and manufacturing methods. To further the miniaturization of future products the integration of functions on miniaturized subsystems, i.e. System-in-Package (SiP) is a promising approach. Here, use of recent manufacturing methods allows to merge the SiP concept with a volumetric integration of IC’s. Up to now, most of the systems make use of single- or double-sided populated system carriers. A new challenge is to incorporate not only passive components, but as well active circuitry (IC’s) and the necessary thermal management. Ultra thin chips (i.e. silicon dies thinned down to <50μm total thickness) lend themselves to reach these goals. Chips with that thickness can be embedded in the dielectric layers of modern laminate PCB’s. Micro via technology allows to contact the embedded chip to the outer faces of the system circuitry. The aspects of embedding and making the electrical contact as well as the thermal management are highlighted. Results on FEM simulations and technical achievements are presented.

scholarly journals Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications

2018 ◽  
Vol 193 ◽  
pp. 140-153 ◽  
Author(s):  
Gautier Girard ◽  
Mohamad Jrad ◽  
Slim Bahi ◽  
Marion Martiny ◽  
Sébastien Mercier ◽  
...  
Keyword(s):  
High Frequency ◽  
Printed Circuit Boards ◽  
Woven Composites ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Numerical Characterization

scholarly journals Process to Improve the Adherences of Copper to a PTFE Plate

2016 ◽  
Vol 2016 ◽  
pp. 1-4
Author(s):  
Abel Pérez ◽  
Alfonso Torres ◽  
Reydezel Torres
Keyword(s):  
High Frequency ◽  
Printed Circuit Boards ◽  
Low Pressure ◽  
Peel Strength ◽  
Plasma Power ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Free Process

A simple low plasma power and roughness free process for improving the adherence of Cu to PTFE is presented. The results show that low pressure and Ar flow combination are the drivers of this improved adherence. Copper Peel Strength Tensile values up to 60 kg/m are obtained which are comparable to those shown in commercial composite dielectrics for high-frequency applications Printed Circuit Boards.

High frequency measurement techniques for vias in printed circuit boards

2014 ◽  
Vol 3 (4) ◽  
pp. 104-113 ◽  
Author(s):  
Miroslav Kotzev ◽  
Young H. Kwark ◽  
Sebastian Muller ◽  
Andreas Hardock ◽  
Renato Rimolo-Donadio ◽  
...  
Keyword(s):  
High Frequency ◽  
Printed Circuit Boards ◽  
Measurement Techniques ◽  
Frequency Measurement ◽  
Circuit Boards ◽  
Printed Circuit

scholarly journals Conductivity Measurements of Silverpastes

10.14311/1221 ◽  
2010 ◽  
Vol 50 (4) ◽  
Author(s):  
M. Dirix ◽  
O. Koch
Keyword(s):  
Electrical Conductivity ◽  
Printed Circuit Boards ◽  
Measurement Techniques ◽  
Three Dimensional ◽  
Conductivity Measurement ◽  
Circuit Boards ◽  
Conductivity Measurements ◽  
New Materials ◽  
Printed Circuit

The development of three-dimensional printed circuit boards requires research on new materials which can easily be deformed. Conducting pastes are well suited for deformation even after they are applied to the dielectric carrier. This paper deals with measurements of the electrical conductivity of these conducting pastes. Two different conductivity measurement techniques are explained and carried out. The resulting measurements give an overview of the conductivity of several measured samples.

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