High frequency measurement techniques for vias in printed circuit boards

2014 ◽  
Vol 3 (4) ◽  
pp. 104-113 ◽  
Author(s):  
Miroslav Kotzev ◽  
Young H. Kwark ◽  
Sebastian Muller ◽  
Andreas Hardock ◽  
Renato Rimolo-Donadio ◽  
...  
Keyword(s):  
High Frequency ◽  
Printed Circuit Boards ◽  
Measurement Techniques ◽  
Frequency Measurement ◽  
Circuit Boards ◽  
Printed Circuit

scholarly journals Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications

2018 ◽  
Vol 193 ◽  
pp. 140-153 ◽  
Author(s):  
Gautier Girard ◽  
Mohamad Jrad ◽  
Slim Bahi ◽  
Marion Martiny ◽  
Sébastien Mercier ◽  
...  
Keyword(s):  
High Frequency ◽  
Printed Circuit Boards ◽  
Woven Composites ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Numerical Characterization

scholarly journals Process to Improve the Adherences of Copper to a PTFE Plate

2016 ◽  
Vol 2016 ◽  
pp. 1-4
Author(s):  
Abel Pérez ◽  
Alfonso Torres ◽  
Reydezel Torres
Keyword(s):  
High Frequency ◽  
Printed Circuit Boards ◽  
Low Pressure ◽  
Peel Strength ◽  
Plasma Power ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Free Process

A simple low plasma power and roughness free process for improving the adherence of Cu to PTFE is presented. The results show that low pressure and Ar flow combination are the drivers of this improved adherence. Copper Peel Strength Tensile values up to 60 kg/m are obtained which are comparable to those shown in commercial composite dielectrics for high-frequency applications Printed Circuit Boards.

scholarly journals Conductivity Measurements of Silverpastes

10.14311/1221 ◽  
2010 ◽  
Vol 50 (4) ◽  
Author(s):  
M. Dirix ◽  
O. Koch
Keyword(s):  
Electrical Conductivity ◽  
Printed Circuit Boards ◽  
Measurement Techniques ◽  
Three Dimensional ◽  
Conductivity Measurement ◽  
Circuit Boards ◽  
Conductivity Measurements ◽  
New Materials ◽  
Printed Circuit

The development of three-dimensional printed circuit boards requires research on new materials which can easily be deformed. Conducting pastes are well suited for deformation even after they are applied to the dielectric carrier. This paper deals with measurements of the electrical conductivity of these conducting pastes. Two different conductivity measurement techniques are explained and carried out. The resulting measurements give an overview of the conductivity of several measured samples.

scholarly journals The Evaluation of Thermosetting Polyphenylene Ether for High Frequency Multilayer Printed Circuit Boards.

1995 ◽  
Vol 10 (3) ◽  
pp. 153-160
Author(s):  
Takeshi ARAI ◽  
Yoshiyuki ISHII ◽  
Masakatsu KUROKI ◽  
Hidehisa YOKOYAMA ◽  
Shozo KINOSHITA ◽  
...  
Keyword(s):  
High Frequency ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit
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