Integrated Circuit Components and Structures

1990 ◽  
pp. 15-32
Author(s):  
M. J. Morant
Keyword(s):  
Integrated Circuit ◽  
Circuit Components

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

2008 ◽  
Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair
Keyword(s):  
Mechanical Properties ◽  
Quality Control ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Manufacturing Process ◽  
Solder Bumps ◽  
Initial Work ◽  
Circuit Components ◽  
Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

Integrated Circuit Components For 94 Ghz Applications

1987 ◽  
Author(s):  
Y. C. Ngan ◽  
Y. E. Yen ◽  
D. English ◽  
A. Grote ◽  
T. Pham ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Circuit Components

Wideband planar Goubau line integrated circuit components at millimetre waves

2011 ◽  
Vol 5 (8) ◽  
pp. 882 ◽  
Author(s):  
Y. Xu ◽  
C. Nerguizian ◽  
R.G. Bosisio
Keyword(s):  
Integrated Circuit ◽  
Millimetre Waves ◽  
Circuit Components

Inexpensive Diode Thermometry Using Integrated Circuit Components

1974 ◽  
Vol 4 (2) ◽  
pp. 250-254 ◽  
Author(s):  
P. A. Tang ◽  
K. G. McNaughton ◽  
T. A. Black
Keyword(s):  
Data Acquisition ◽  
Integrated Circuit ◽  
Low Cost ◽  
High Accuracy ◽  
Temperature Sensing ◽  
Data Acquisition Systems ◽  
Circuit Components ◽  
Two Temperature

Two temperature sensing circuits using silicon diodes and integrated circuit components are described. They are intended for use with data acquisition systems and are suitable for field or laboratory applications. Both can be constructed by persons without electronic training and have features of simplicity, low cost, and high accuracy.

MCNP Simulation of In-Core Dose Rates for an Offline CANDU® Reactor

2017 ◽  
Vol 3 (3) ◽  
Author(s):  
Jordan G. Gilbert ◽  
Scott Nokleby ◽  
Ed Waller
Keyword(s):  
Monte Carlo ◽  
Dose Rate ◽  
Integrated Circuit ◽  
Multidisciplinary Team ◽  
Operating Conditions ◽  
Inspection System ◽  
Dose Rates ◽  
Pressure Tubes ◽  
Circuit Components ◽  
Safe Operating

Inspections of pressure tubes in CANDU® reactors are a key part of maintaining safe operating conditions. The current inspection system, the channel inspection and gauging apparatus for reactors (CIGAR), performs the job well but is limited by the fact that it can only inspect one channel at a time. A multidisciplinary team is currently developing a novel robotic inspection system. As part of this work, a Monte Carlo N-particle (MCNP) model has been developed in order to predict the dose rates that the improved inspection system will be exposed to and, from this, predict the component lifetime. This MCNP model will be capable of predicting in-core dose rates at any location within the reactor, and as such could be used for other situations where the in-core dose rate needs to be known. Based on estimates from this model, it is expected that at 7 days after shutdown, the improved inspection system could survive in core for approximately 7 h, providing it uses a tungsten shield 2.5 cm in thickness around the integrated circuit components. This is expected to be sufficient to perform a single inspection.

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