Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

2008 ◽  
Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair
Keyword(s):  
Mechanical Properties ◽  
Quality Control ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Manufacturing Process ◽  
Solder Bumps ◽  
Initial Work ◽  
Circuit Components ◽  
Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Nanoscale Elastic Imaging of Aluminum/Low-k Dielectric Interconnect Structures

2000 ◽  
Vol 612 ◽  
Author(s):  
G. S. Shekhawat ◽  
O.V. Kolosov ◽  
G.A.D. Briggs ◽  
E. O. Shaffer ◽  
S. Martin ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Integrated Circuit ◽  
Nanometer Scale ◽  
Metrological Reliability ◽  
Force Microscopy ◽  
Polymer Interface ◽  
Properties Of Materials ◽  
Materials Used ◽  
Low K ◽  
Ic Test

AbstractA new characterization tool based on ultrasonic force microscopy (UFM) has been developed to image the nanometer scale mechanical properties of aluminum/low-k polymer damascence integrated circuit (IC) test structures. Aluminum and polymer regions are differentiated on the basis of elastic modulus with a spatial resolution ≤ 10 nm. This technique reveals a reactive-ion etch (RIE)-induced hardening of the low-k polymer that is manifested in the final IC test structure by a region of increased hardness at the aluminum/polymer interface. The ability to characterize nanometer scale mechanical properties of materials used for IC back-end-of-line (BEOL) manufacture offers new opportunities for metrological reliability evaluation of low-k integration processes.

scholarly journals Mechanical Characterization of Rapid Solidified Alsicumg Alloys by New CRSS Casting Method Under T6 Condition

2019 ◽  
Vol 8 (12) ◽  
pp. 2897-2902
Keyword(s):  
Mechanical Properties ◽  
Manufacturing Process ◽  
High Performance ◽  
Weight Ratio ◽  
Solidification Process ◽  
Casting Process ◽  
Casting Method ◽  
Silicon Alloys ◽  
Hardness Tester

Aluminum-silicon alloys acquiring extensive industrial attention due to their superior resistance to rate of wear and elevated strength to weight ratio properties. Though the properties of the materials substantially depend on the manufacturing process they involve. Thus many industries focusing on new manufacturing methods to produce high-performance alloys. In this present study, AlSi (16-18) alloys were prepared by new CRSS (combined rheo stir squeeze) casting method with rapid-solidification process under T-6 condition. CRSS-T6 as casting process enhances the microstructural and mechanical properties significantly by 40-70%. Whereas, the maximum value of hardness (179.37) was found with AlSi17Cu3.5Mg0.8 with CRSS-T6. The improvements in hardness and elastic properties were mainly ascribed to size, distribution, and morphology of Si-particles because of its manufacturing process. SEM, advanced metallurgical microstructure and EDS analysis techniques are used for the surface morphologies observation. Moreover, Brinell hardness tester and Tensometer are used for the characterization of mechanical properties

scholarly journals Hybrid Fly Ash-Based Geopolymeric Foams: Microstructural, Thermal and Mechanical Properties

Materials ◽  
2020 ◽  
Vol 13 (13) ◽  
pp. 2919 ◽  
Author(s):  
Giuseppina Roviello ◽  
Laura Ricciotti ◽  
Antonio Jacopo Molino ◽  
Costantino Menna ◽  
Claudio Ferone ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Fly Ash ◽  
Circular Economy ◽  
Coal Fly Ash ◽  
Silicate Solution ◽  
Thermal And Mechanical Properties ◽  
Blowing Agent ◽  
Materials Used

This research investigates the preparation and characterization of new organic–inorganic geopolymeric foams obtained by simultaneously reacting coal fly ash and an alkali silicate solution with polysiloxane oligomers. Foaming was realized in situ using Si0 as a blowing agent. Samples with density ranging from 0.3 to 0.7 g/cm3 that show good mechanical properties (with compressive strength up to ≈5 MPa for a density of 0.7 g/cm3) along with thermal performances (λ = 0.145 ± 0.001 W/m·K for the foamed sample with density 0.330 g/cm3) comparable to commercial lightweight materials used in the field of thermal insulation were prepared. Since these foams were obtained by valorizing waste byproducts, they could be considered as low environmental impact materials and, hence, with promising perspectives towards the circular economy.

Flip Chip Underfill RF Characterization

2019 ◽  
Vol 2019 (1) ◽  
pp. 000243-000247
Author(s):  
Robert B. Paul ◽  
A. Ege Engin ◽  
Jerry Aguirre
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
High Speed ◽  
Flip Chip ◽  
Power Integrity ◽  
Cavity Resonators ◽  
Dielectric Characterization ◽  
Noise Coupling ◽  
Solder Bumps ◽  
Underfill Material

Abstract To develop reliable high-speed packages, characterization of the underfill material used in the flip-chip process has become of greater importance. The underfill, typically an epoxy resin-based material, offers thermal and structural benefits for the integrated circuit (IC) on package. With so many inputs and outputs (IOs) in close proximity to one another, the integrated circuits on package can have unexpected signal and power integrity issues. Furthermore, chip packages can support signals only up to the frequency where noise coupling (e.g., crosstalk, switching noise, etc.) leads to the malfunctioning of the system. Vertical interconnects, such as vias and solder bumps, are major sources of noise coupling. Inserting ground references between every signal net is not practical. For the solder bumps, the noise coupling depends on the permittivity of the underfill material. Therefore, characterizing the permittivity of the underfill material helps in predicting signal and power integrity issues. Such liquid or semi-viscous materials are commonly characterized from a simple fringe capacitance model of an open-ended coaxial probe immersed in the material. The open-ended coaxial method, however, is not as accurate as resonator-based methods. There is a need for a methodology to accurately extract the permittivity of liquid or semi-viscous materials at high frequencies. The proposed method uses solid walled cavity resonators, where the resonator is filled with the underfill material and cured. Dielectric characterization is a complex process, where the physical characteristics of the cavities must be known or accurately measured. This includes the conductivity of the conductors, roughness of the conductors, the dimensions of the cavity, and the port pin locations. This paper discusses some of the challenges that are encountered when characterizing dielectrics with cavity resonators. This characterization methodology can also be used to characterize other materials of interest.

Current State of Masonry Properties Material on Emerging Zones in Lima City

2014 ◽  
Vol 9 (6) ◽  
pp. 1015-1020 ◽  
Author(s):  
Luis Lavado ◽  
◽  
Jenny Taira ◽  
Jorge Gallardo
Keyword(s):  
Mechanical Properties ◽  
Manufacturing Process ◽  
Structural Materials ◽  
Structural Features ◽  
Experimental Results ◽  
Current State ◽  
Materials Used ◽  
The City ◽  
Different Levels

Masonry is one of the most common structural materials used to build houses in the city of Lima, Peru. The structural features of this material and its components vary widely, however, due to the manufacturing process, which uses bricks and aggregates and different levels of labor. This paper presents experimental results realized using bricks, prism and wallettes to determine the mechanical properties of masonry.

Application of data screening to the characterization of integrated circuits

1989 ◽  
Vol 67 (4) ◽  
pp. 221-224
Author(s):  
Zarrin Ghaemi
Keyword(s):  
Integrated Circuits ◽  
Test Data ◽  
Integrated Circuit ◽  
Software Package ◽  
Automatic Method ◽  
Statistical Software ◽  
Data Screening ◽  
Actual Test ◽  
Visual Graph

Large amounts of integrated-circuit test data may be too great to be analysed by (human) visual graph inspection, and must be inspected by an automatic method. In this paper, a method called data screening is described. Data screening automatically identifies the presence of abnormalities (unexpected clusters and (or) outliers) in sets of test data, and has been implemented in a program in a statistical software package called Enhansys. The method has been used on actual test data with good results.

“dual phase” thin films prepared by deposition of aluminum on liquid nucleant gallium layers

1992 ◽  
Vol 50 (2) ◽  
pp. 1432-1433
Author(s):  
Warren J. Moberly ◽  
Daniel Schwarcz ◽  
Milton Ohring
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Surface Roughness ◽  
Integrated Circuits ◽  
Al Alloys ◽  
Dual Phase ◽  
Grain Boundary Embrittlement ◽  
Al Metallization ◽  
Boundary Embrittlement

Aluminum thin films have been universally employed as interconnections in integrated circuits for the last quarter of a century. However, during this time Al metallization has never been totally immune from assorted reliability problems. This present research involves preparation and characterization of “dual phase” thin films, comprised of Al (or a transition metal) vacuum evaporated onto a liquid Ga (or other low melting temperature metal) nucleant layer. Ga is well known for causing grain boundary embrittlement in structural Al alloys. However, the Ga may well enhance the mechanical properties in Al thin films used as interconnect metallization, where this “dual phase” microstructure will prevent the buildup of stress that has historically resulted in electromigration failures in semiconductor devices. In addition, the presence of a liquid nucleant layer results in thin films (up to 2 μm thick) having surface roughness of the order of the film thickness, which in turn would enhance the bondability of such films.

A Novel Fault Isolation Technique Using Noise Detection and Characterization of Light Emitted From Integrated Circuits

1998 ◽  
Author(s):  
Hong Zheng ◽  
Joe Patterson ◽  
G. P. Li
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Light Emission ◽  
Fault Isolation ◽  
Noise Detection ◽  
Isolation Technique ◽  
Potential Effectiveness ◽  
Defect Sites ◽  
A New Technique

Abstract This paper describes a new technique for identifying defects on integrated circuit. This technique detects the noise content in light emitted from defect sites. The purpose of this technique is to determine which of many light emission sites represent a defect and which represent normal devices. It reports the first phase of studies to evaluate the feasibility and potential effectiveness of this technique. The feasibility of this technique has been demonstrated by simultaneously monitoring electrical noise and the noise in the light emitted from a gallium arsenide light emission diode (LED) and a bipolar transistor. The paper will present the methodology and apparatus used to detect and analyze the noise in light emission.

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