Modeling Self-organization of Adsorbate at Chemical Vapor Deposition in Accumulative Ion Plasma Devices

Author(s):  
Vasyl O. Kharchenko ◽  
Alina V. Dvornichenko
RSC Advances ◽  
2016 ◽  
Vol 6 (18) ◽  
pp. 14958-14963 ◽  
Author(s):  
Yunxuan Dong ◽  
Shunxi Tang ◽  
Hang Cui ◽  
Jian Zhang ◽  
Qiliang Cui

Two types of 3D InN microstructures were prepared via different self-organization processes in the up- and downstream regions of the Si substrate.


Nano Research ◽  
2020 ◽  
Vol 13 (6) ◽  
pp. 1723-1732
Author(s):  
Jinmei Wang ◽  
Dongyue Xie ◽  
Zhen Li ◽  
Xiaohang Zhang ◽  
Xing Sun ◽  
...  

1996 ◽  
Vol 68 (23) ◽  
pp. 3284-3286 ◽  
Author(s):  
F. Heinrichsdorff ◽  
A. Krost ◽  
M. Grundmann ◽  
D. Bimberg ◽  
A. Kosogov ◽  
...  

Author(s):  
J. Drucker ◽  
R. Sharma ◽  
J. Kouvetakis ◽  
K.H.J. Weiss

Patterning of metals is a key element in the fabrication of integrated microelectronics. For circuit repair and engineering changes constructive lithography, writing techniques, based on electron, ion or photon beam-induced decomposition of precursor molecule and its deposition on top of a structure have gained wide acceptance Recently, scanning probe techniques have been used for line drawing and wire growth of W on a silicon substrate for quantum effect devices. The kinetics of electron beam induced W deposition from WF6 gas has been studied by adsorbing the gas on SiO2 surface and measuring the growth in a TEM for various exposure times. Our environmental cell allows us to control not only electron exposure time but also the gas pressure flow and the temperature. We have studied the growth kinetics of Au Chemical vapor deposition (CVD), in situ, at different temperatures with/without the electron beam on highly clean Si surfaces in an environmental cell fitted inside a TEM column.


Author(s):  
M. E. Twigg ◽  
E. D. Richmond ◽  
J. G. Pellegrino

For heteroepitaxial systems, such as silicon on sapphire (SOS), microtwins occur in significant numbers and are thought to contribute to strain relief in the silicon thin film. The size of this contribution can be assessed from TEM measurements, of the differential volume fraction of microtwins, dV/dν (the derivative of the microtwin volume V with respect to the film volume ν), for SOS grown by both chemical vapor deposition (CVD) and molecular beam epitaxy (MBE).In a (001) silicon thin film subjected to compressive stress along the [100] axis , this stress can be relieved by four twinning systems: a/6[211]/( lll), a/6(21l]/(l1l), a/6[21l] /( l1l), and a/6(2ll)/(1ll).3 For the a/6[211]/(1ll) system, the glide of a single a/6[2ll] twinning partial dislocation draws the two halves of the crystal, separated by the microtwin, closer together by a/3.


2001 ◽  
Vol 11 (PR3) ◽  
pp. Pr3-885-Pr3-892 ◽  
Author(s):  
N. Popovska ◽  
S. Schmidt ◽  
E. Edelmann ◽  
V. K. Wunder ◽  
H. Gerhard ◽  
...  

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