Mathematical Software for Testing and Setting up the Induction Soldering Process

Author(s):  
Anton Milov ◽  
Vadim Tynchenko ◽  
Vyacheslav Petrenko ◽  
Vladislav Kukartsev
2020 ◽  
Vol 21 (3) ◽  
pp. 424-432
Author(s):  
O. A. Bocharova ◽  
◽  
A. V. Murygin ◽  
A. N. Bocharov ◽  
R. V. Zaitsev ◽  
...  

1997 ◽  
Author(s):  
Steven M. Hadfield ◽  
Carl Crockett ◽  
Paul J. Simonich ◽  
Matthew G. Mcharg ◽  
William J. Mandeville

Author(s):  
John R. Rice ◽  
Charles Lawson ◽  
William J. Cody ◽  
William Gear ◽  
Hans J. Oser ◽  
...  

Mathematics ◽  
2021 ◽  
Vol 9 (6) ◽  
pp. 662
Author(s):  
María Jesús Santos ◽  
Alejandro Medina ◽  
José Miguel Mateos Roco ◽  
Araceli Queiruga-Dios

Sophomore students from the Chemical Engineering undergraduate Degree at the University of Salamanca are involved in a Mathematics course during the third semester and in an Engineering Thermodynamics course during the fourth one. When they participate in the latter they are already familiar with mathematical software and mathematical concepts about numerical methods, including non-linear equations, interpolation or differential equations. We have focused this study on the way engineering students learn Mathematics and Engineering Thermodynamics. As students use to learn each matter separately and do not associate Mathematics and Physics, they separate each matter into different and independent compartments. We have proposed an experience to increase the interrelationship between different subjects, to promote transversal skills, and to make the subjects closer to real work. The satisfactory results of the experience are exposed in this work. Moreover, we have analyzed the results obtained in both courses during the academic year 2018–2019. We found that there is a relation between both courses and student’s final marks do not depend on the course.


1994 ◽  
Vol 60 (12) ◽  
pp. 1806-1810 ◽  
Author(s):  
Kohei MURAKAMI ◽  
Akira ADACHI ◽  
Jitsuho HIROTA ◽  
Masaharu YOSHIDA ◽  
Osamu HAYASHI ◽  
...  

2012 ◽  
Vol 562-564 ◽  
pp. 188-191
Author(s):  
Keh Moh Lin ◽  
Yang Hsien Lee ◽  
Wen Yeong Huang ◽  
Po Chun Hsu ◽  
Chin Yang Huang ◽  
...  

To find out the important factors which decisively affect the soldering quality of photovoltaic modules, solar cells were soldered under different conditions (different temperatures, PbSn vs. SnAgCu solder, manual vs. semi-automatic). Experimental results show that the soldering quality of PbSn under 350°C in the semi-automatic soldering process was quite stable while the soldering quality of lead-free solder was generally unacceptable in the manual or semi-automatic process under different temperatures. This result indicates that the soldering process with lead-free solder still needs to be further improved. It was also found that most cracks were formed on the interface between the solder and the silver paste and then expanded outwards.


Author(s):  
Mohammad Faizan ◽  
Guo-X. Wang

Soldering has become an indispensable joining process in the electronic packaging industry. The industry is aiming for the use of environment friendly lead-free solders. All the lead-free solders are high tin-containing alloys. During the soldering process, an intense interaction of metallization on PCB and tin from the solder occurs at the metallization/solder interface. Intermetallic compound (IMC) is formed at the interface and subsequently PCB bond-metal (substrate) is dissolved into the molten solder. In the present study the terms bond-metal and substrate will be used interchangeably and the term 'substrate' refers to the top layer of the PCB which comes in contact with the molten solder during soldering reaction. Thickness of the intermetallic phase formed at the joint interface and amount of substrate lost is critical in achieving reliable solder joints. During the wet phase of soldering process, the IMC does not grow as layered structure; rather it takes the shape of scallops. The growth of scalloped IMC during the solder/substrate interaction entails complicated physics. Understanding of the actual kinetics involved in the formation of IMC phase is important in controlling the process to achieve desired results. This paper presents theoretical analysis of the kinetics involved in the formation of the scalloped intermetallic phase. The intermetallic phase growth is experimentally investigated to support the underlying kinetics of the process. Numerical model has been suggested to translate the physics of the process. The model is based on the basic mass diffusion equations and can predict the substrate dissolution and IMC thickness as a function of soldering time.


IEEE Access ◽  
2021 ◽  
pp. 1-1
Author(s):  
Paul Mejia ◽  
Luiz Cesar Martini ◽  
Felipe Grijalva ◽  
Julio Cesar Larco ◽  
Juan Carlos Rodriguez

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