Effective Light Management in Thin Silicon Wafers

2018 ◽  
pp. 1-24
Author(s):  
Zhi-Peng Ling
Keyword(s):  
Silicon Wafers ◽  
Light Management ◽  
Thin Silicon

Backside Thinning and Stress-Relief Techniques for Thin Silicon Wafers

2014 ◽  
pp. 207-226
Author(s):  
Christof Landesberger ◽  
Christoph Paschke ◽  
Hans-Peter Spöhrle ◽  
Karlheinz Bock
Keyword(s):  
Stress Relief ◽  
Silicon Wafers ◽  
Thin Silicon

Analysis of Silicon Micromachining by UV Lasers, and Implications for Full Cut Laser Dicing of Ultra-Thin Semiconductor Device Wafers

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 001743-001759
Author(s):  
Andy Hooper ◽  
Daragh Finn
Keyword(s):  
Cross Sections ◽  
Laser Scanning ◽  
Semiconductor Device ◽  
Laser Pulses ◽  
Silicon Wafers ◽  
Silicon Devices ◽  
Laser Fluences ◽  
Slow Velocity ◽  
3D Packaging ◽  
Thin Silicon

3D packaging technologies such as FLASH rely on die-to-die stacking of ultra-thin silicon devices with individual die thicknesses below 100 um. Because ultra-thin silicon wafers are very fragile, mechanical saw dicing of sub 100 um thick wafers tends to be more challenging, requiring slower processing and reduced throughput and/or yields. These challenges make full cut laser dicing an attractive solution. This presentation provides an investigation for machining of 50 um thick silicon wafers using a Gaussian-shaped, nanosecond pulsewidth, 355 nm UV laser. A range of machining speeds and laser fluences are compared, from single laser pulses to highly overlapped slow-velocity machining. 3D Laser Scanning Microscope and FIB/TEM cross sections are employed to characterize the state and depth of heating damage into the Si material. Implications for laser machining rates and die break strength are investigated for full cut laser dicing.

Ultra-Thin Silicon Wafers Fabrication and Inverted Pyramid Texturing Based on Cu-Catalyzed Chemical Etching

Silicon ◽  
2020 ◽  
Author(s):  
Altyeb Ali Abaker Omer ◽  
Zudong He ◽  
Shihao Hong ◽  
Yuanchih Chang ◽  
Jie Yu ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Silicon Wafers ◽  
Inverted Pyramid ◽  
Thin Silicon

A study on the diamond grinding of ultra-thin silicon wafers

2011 ◽  
Vol 226 (1) ◽  
pp. 66-75 ◽  
Author(s):  
L Zhou ◽  
Y B Tian ◽  
H Huang ◽  
H Sato ◽  
J Shimizu
Keyword(s):  
Silicon Wafers ◽  
Diamond Grinding ◽  
Thin Silicon
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