Three-Dimensional Micromachining of Silicon Nitride for Power Microelectromechanical Systems

2001 ◽  
pp. 1112-1115
Author(s):  
Shinya Sugimoto ◽  
Shuji Tanaka ◽  
Jing-Feng Li ◽  
Takashi Genda ◽  
Ryuzo Watanabe ◽  
...  
Keyword(s):  
Silicon Nitride ◽  
Microelectromechanical Systems ◽  
Three Dimensional

Modeling of a One-Sided Bonded and Rigid Constraint Using Beam Theory

2008 ◽  
Vol 75 (3) ◽  
Author(s):  
Peter J. Ryan ◽  
George G. Adams ◽  
Nicol E. McGruer
Keyword(s):  
Boundary Conditions ◽  
Microelectromechanical Systems ◽  
Three Dimensional ◽  
Beam Theory ◽  
Rotational Stiffness ◽  
Element Analysis ◽  
Transverse Loads ◽  
Rigid Constraint ◽  
Dimensional Finite Element ◽  
Three Dimensional Finite Element

In beam theory, constraints can be classified as fixed/pinned depending on whether the rotational stiffness of the support is much greater/less than the rotational stiffness of the freestanding portion. For intermediate values of the rotational stiffness of the support, the boundary conditions must account for the finite rotational stiffness of the constraint. In many applications, particularly in microelectromechanical systems and nanomechanics, the constraints exist only on one side of the beam. In such cases, it may appear at first that the same conditions on the constraint stiffness hold. However, it is the purpose of this paper to demonstrate that even if the beam is perfectly bonded on one side only to a completely rigid constraining surface, the proper model for the boundary conditions for the beam still needs to account for beam deformation in the bonded region. The use of a modified beam theory, which accounts for bending, shear, and extensional deformation in the bonded region, is required in order to model this behavior. Examples are given for cantilever, bridge, and guided structures subjected to either transverse loads or residual stresses. The results show significant differences from the ideal bond case. Comparisons made to a three-dimensional finite element analysis show a good agreement.

scholarly journals PIP Preparation of Silica Fibre Fabric Reinforced Silicon Nitride-Based Composites using Polyhydridomethylsilazane

2005 ◽  
Vol 14 (4) ◽  
pp. 096369350501400
Author(s):  
Gong-jin Qi ◽  
Chang-rui Zhang ◽  
Hai-feng Hu ◽  
Chang-cheng Zhou
Keyword(s):  
Mechanical Property ◽  
Silicon Nitride ◽  
Three Dimensional ◽  
Matrix Interface ◽  
Interface Bonding ◽  
Pull Out ◽  
New Type ◽  
Ammonia Atmosphere ◽  
Fibre Matrix ◽  
Silica Fibre

A new type of composites, three-dimensional silica fibre fabric reinforced silicon nitride-based composites, were prepared by PIP method through repeated infiltration of polyhydridomethylsilazane and pyrolysis at 773-873K in ammonia atmosphere. The density of the composites reached 1.66g/cm3 after four PIP cycles, and the flexural strength was 56.3 MPa. The composites showed a near-brittle fracture mode without long fibre pull-out in the fracture surface. It was the relatively strong fibre/matrix interface bonding that led to the moderate mechanical property.

Three-Dimensional Elastic-Plastic Fractal Analysis of Surface Adhesion in Microelectromechanical Systems

1998 ◽  
Vol 120 (4) ◽  
pp. 808-813 ◽  
Author(s):  
K. Komvopoulos ◽  
W. Yan
Keyword(s):  
Microelectromechanical Systems ◽  
Van Der Waals ◽  
Three Dimensional ◽  
Surface Adhesion ◽  
Restoring Force ◽  
Elastic Plastic ◽  
Surface Separation ◽  
High Adhesion ◽  
Interfacial Force ◽  
Asperity Deformation

High adhesion is often encountered at contact interfaces of miniaturized devices, known as microelectromechanical systems, due to the development of capillary, electrostatic, and van der Waals attractive forces. In addition, deformation of contacting asperities on opposing surfaces produces a repulsive interfacial force. Permanent surface adhesion (referred to as stiction) occurs when the total interfacial force is attractive and exceeds the micromachine restoring force. In the present study, a three-dimensional fractal topography description is incorporated into an elastic-plastic contact mechanics analysis of asperity deformation. Simulation results revealing the contribution of capillary, electrostatic, van der Waals, and asperity deformation forces to the total interfacial force are presented for silicon/silicon and aluminum/aluminum material systems and different mean surface separation distances. Results demonstrate a pronounced effect of surface roughness on the micromachine critical stiffness required to overcome interfacial adhesion.

A facile method of massively producing three-dimensional silicon nitride nanowire cloth

2016 ◽  
Vol 185 ◽  
pp. 222-225 ◽  
Author(s):  
Kebing Guo ◽  
Jinhua Lu ◽  
Qian Guo
Keyword(s):  
Silicon Nitride ◽  
Three Dimensional

Study of Porous Ceramic Based on Silicon Nitride Prepared Using Three-Dimensional Printing Technology

2017 ◽  
Vol 57 (6) ◽  
pp. 600-604 ◽  
Author(s):  
L. N. Rabinskii ◽  
A. V. Ripetskii ◽  
V. A. Pogodin ◽  
S. A. Sitnikov ◽  
Yu. O. Solyaev
Keyword(s):  
Silicon Nitride ◽  
Porous Ceramic ◽  
Three Dimensional ◽  
Printing Technology ◽  
Three Dimensional Printing ◽  
Dimensional Printing

Numerical Modeling of Axisymmetric and Three-Dimensional Flows in Microelectromechanical Systems Nozzles

AIAA Journal ◽  
2002 ◽  
Vol 40 (5) ◽  
pp. 897-904 ◽  
Author(s):  
Alina A. Alexeenko ◽  
Deborah A. Levin ◽  
Sergey F. Gimelshein ◽  
Robert J. Collins ◽  
Brian D. Reed
Keyword(s):  
Numerical Modeling ◽  
Microelectromechanical Systems ◽  
Three Dimensional

Preparation of silicon nitride foam with three-dimensional interconnected pore structure

2016 ◽  
Vol 89 ◽  
pp. 620-625 ◽  
Author(s):  
Liuyan Yin ◽  
Xingui Zhou ◽  
Jinshan Yu ◽  
Honglei Wang
Keyword(s):  
Silicon Nitride ◽  
Pore Structure ◽  
Three Dimensional ◽  
Interconnected Pore ◽  
Interconnected Pore Structure

A Three-Dimensional Silicon Nitride Polarizing Beam Splitter

2014 ◽  
Vol 26 (7) ◽  
pp. 706-709 ◽  
Author(s):  
Jijun Feng ◽  
Ryoichi Akimoto
Keyword(s):  
Silicon Nitride ◽  
Beam Splitter ◽  
Three Dimensional ◽  
Polarizing Beam Splitter
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