Hot embossing of transparent high aspect ratio micro parts

2013 ◽  
Vol 20 (10-11) ◽  
pp. 1967-1973 ◽  
Author(s):  
A. Kolew ◽  
M. Heilig ◽  
M. Schneider ◽  
D. Münch ◽  
R. Ezzat ◽  
...  
Author(s):  
Gang Zhao ◽  
Qiong Shu ◽  
Yue Li ◽  
Jing Chen

A novel technology is developed to fabricate high aspect ratio bulk titanium micro-parts by inductively coupled plasma (ICP) etching. An optimized etching rate of 0.9 μm/min has been achieved with an aspect ratio higher than 10:1. For the first time, SU-8 is used as titanium etching mask instead of the traditional hard mask such as TiO2 or SiO2. With an effective selectivity of 3 and a spun-on thickness beyond 100 μm, vertical etching sidewall and low sidewall roughness are obtained. Ultra-deep titanium etching up to 200 μm has been realized, which is among the best of the present reports. Titanium micro-springs and planks are successfully fabricated with this approach.


Author(s):  
Tianhong Cui ◽  
Kody Varahramyan ◽  
Yongjun Zhao ◽  
Jing Wang

This paper reports the simulation and fabrication of novel polymer-based tunneling sensors by hot embossing technique, one of the advanced polymer microfabrication technologies. ANSYS is the software tools used to simulate the mechanical microstructures of the polymer tunneling sensors. Following the optimum design of the sensors, the mold inserts of hot embossing are fabricated by anodic bonding of glass disk 5 mm think and silicon wafer, with high-aspect-ratio microstructures by ICP etching. Main structures of polymer-based tunneling sensors are hot embossed on PMMA, followed by plastic bonding to form lateral tunneling sensor platform.


2019 ◽  
Vol 34 (5) ◽  
pp. 502-512 ◽  
Author(s):  
N. Kodihalli Shivaprakash ◽  
J. Zhang ◽  
T. Nahum ◽  
C. Barry ◽  
Q. Truong ◽  
...  

2011 ◽  
Vol 21 (2) ◽  
pp. 025017 ◽  
Author(s):  
Mauno Schelb ◽  
Christoph Vannahme ◽  
Alexander Kolew ◽  
Timo Mappes

Author(s):  
Daiji Noda ◽  
Masaru Setomoto ◽  
Tadashi Hattori

Recently, the demand of micro-fabrications such as micro-sensors, microcoils, micro-actuators etc is increasing. Actuators account for a large percentage and volume and weight of a product compared with other parts. Therefore, the progress in downsizing of actuators was required. In order to resolve these problems, the key technology to realizing micro-devices is micro-fabrication process. Particularly, it is essential to the technologies for processing high aspect ratio structures in the production of micro-parts. We have proposed a three-dimensional fabrication process using X-ray lithography technique, and fabricated spiral microcoils having coil lines of narrow pitch and high aspect ratio structures. We have fabricated spiral microcoils at a pitch of 60 μm, and aspect ratio of about 5 using X-ray lithography and narrow metallization techniques on acrylic pipe surface. In addition, we also estimated the suction force of electromagnetic actuators using these microcoils. Measurement results were relatively in good agreement with theoretical values using high aspect ratio microcoils. It is very expected that the high performance microcoils could be manufactured in spite of miniature size.


2004 ◽  
Author(s):  
Yoichi Murakoshi ◽  
Xue-Chuan Shan ◽  
Toshio Sano ◽  
Masaharu Takahashi ◽  
Ryutaro Maeda

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