Hot embossing of photonic crystal polymer structures with a high aspect ratio

2011 ◽  
Vol 21 (2) ◽  
pp. 025017 ◽  
Author(s):  
Mauno Schelb ◽  
Christoph Vannahme ◽  
Alexander Kolew ◽  
Timo Mappes
Keyword(s):  
Photonic Crystal ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Hot Embossing ◽  
Crystal Polymer

Simulation and Fabrication of Novel Polymeric Tunneling Sensor by Hot Embossing Technique

2002 ◽  
Author(s):  
Tianhong Cui ◽  
Kody Varahramyan ◽  
Yongjun Zhao ◽  
Jing Wang
Keyword(s):  
Aspect Ratio ◽  
Silicon Wafer ◽  
Optimum Design ◽  
High Aspect Ratio ◽  
Hot Embossing ◽  
Anodic Bonding ◽  
Glass Disk ◽  
Icp Etching ◽  
Sensor Platform ◽  
Polymer Microfabrication

This paper reports the simulation and fabrication of novel polymer-based tunneling sensors by hot embossing technique, one of the advanced polymer microfabrication technologies. ANSYS is the software tools used to simulate the mechanical microstructures of the polymer tunneling sensors. Following the optimum design of the sensors, the mold inserts of hot embossing are fabricated by anodic bonding of glass disk 5 mm think and silicon wafer, with high-aspect-ratio microstructures by ICP etching. Main structures of polymer-based tunneling sensors are hot embossed on PMMA, followed by plastic bonding to form lateral tunneling sensor platform.

Roll-to-Roll Hot Embossing of High Aspect Ratio Micro Pillars for Superhydrophobic Applications

2019 ◽  
Vol 34 (5) ◽  
pp. 502-512 ◽  
Author(s):  
N. Kodihalli Shivaprakash ◽  
J. Zhang ◽  
T. Nahum ◽  
C. Barry ◽  
Q. Truong ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Hot Embossing ◽  
Roll To Roll ◽  
Micro Pillars

Photonic crystal materials realized by high aspect ratio micro-rod arrays

2012 ◽  
Author(s):  
Christian Kraeh ◽  
Markus Schieber ◽  
Alexandru Popescu ◽  
Harry Hedler ◽  
Jonathan Finley
Keyword(s):  
Photonic Crystal ◽  
Aspect Ratio ◽  
High Aspect Ratio
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