Experimental characterization of short flax fiber mat composites: tensile and flexural properties and damage analysis using acoustic emission

2017 ◽  
Vol 52 (11) ◽  
pp. 6567-6580 ◽  
Author(s):  
Mohamed Habibi ◽  
Gilbert Lebrun ◽  
Luc Laperrière
2017 ◽  
Vol 19 (2) ◽  
pp. 127-136 ◽  
Author(s):  
Dongsheng Li ◽  
Junbo Shao ◽  
Jinping Ou ◽  
Yanlei Wang

2011 ◽  
Vol 488-489 ◽  
pp. 146-149
Author(s):  
Clement Dunand-Châtellet ◽  
Ziad Moumni

This paper provides an original experimental characterization of the shakedown state of a shape memory alloy structure under cyclic pseudo-elastic loading. This analysis is performed through the observation of the dissipated energy at a macroscopic scale as well as the temperature on the surface of the sample through infrared thermography measurement. Morevover, a deeper study is led thanks to acoustic emission to quantify the shifts between microscopic evolutions at a lower scale. The main conclusion is that these 3 quantities are correlated and enable us to identify different stages the structure crosses until the shakedown state.


2019 ◽  
Vol 147 ◽  
pp. 100-110 ◽  
Author(s):  
Mondher Haggui ◽  
Abderrahim El Mahi ◽  
Zouhaier Jendli ◽  
Ali Akrout ◽  
Mohamed Haddar

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.


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