Effect of hybrid filler ratio and filler particle size on thermal conductivity and oil bleed of polydimethylsiloxane/Al2O3/ZnO liquid thermal filler for microelectronics packaging applications

2020 ◽  
Author(s):  
Vigneshwarram Kumaresan ◽  
Srimala Sreekantan ◽  
Mutharasu Devarajan ◽  
Khairudin Mohamed
Keyword(s):  
Thermal Conductivity ◽  
Particle Size ◽  
Filler Particle ◽  
Microelectronics Packaging ◽  
Hybrid Filler ◽  
Filler Particle Size

scholarly journals The Effects of Filler Shape, Type, and Size on the Properties of Encapsulation Molding Components

Electronics ◽  
2021 ◽  
Vol 10 (2) ◽  
pp. 98
Author(s):  
Shouyen Chao ◽  
Yowching Liaw ◽  
Jung-Hua Chou
Keyword(s):  
Thermal Conductivity ◽  
Particle Size ◽  
Coefficient Of Thermal Expansion ◽  
Filler Particle ◽  
Fused Silica ◽  
Molding Compound ◽  
Spherical Silica ◽  
Filler Particle Size ◽  
Size Type ◽  
Better Than

Fillers are essential in the encapsulation molding compound. For three fillers of crystal, spherical, and fused silica, the effects of their size, type, and shape on the viscosity, flow spiral length, thermal conductivity, and coefficient of thermal expansion (CTE) of the compound were explored in this study. The results show that fillers with a larger particle size have a smaller viscosity and flow better; spherical fillers are better than the polygonal ones in this respect. In contrast, both thermal conductivity and CTE increase as the filler particle size increases; the values of these two properties of crystal silica are about twice those of fused silica; the thermal conductivity of polygonal silica is larger than that of spherical silica. On the other hand, the dependence of CTE on the filler shape is insignificant, but is significant to the filler type. The degree of curing of the compound with polygonal silica is also higher than that with either spherical or crystal silica. Namely, curing is affected by both filler type and shape, and can be tuned accordingly to suit specific needs.

Study on High Thermal Conductive BN/Epoxy Resin Composites

2011 ◽  
Vol 105-107 ◽  
pp. 1751-1754 ◽  
Author(s):  
Hui Wang ◽  
Peng Chen ◽  
Jian Sun ◽  
Xiao Jun Kuang ◽  
Zhen Kun Yao
Keyword(s):  
Thermal Conductivity ◽  
Particle Size ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Filler Particle ◽  
Linear Increase ◽  
Circuit Board ◽  
Composite Matrix ◽  
Sem Image ◽  
Filler Particle Size

In contemporary electronic technology era, the volume of electronic equipment and printed circuit board reduced so dramatically that the requirements of heat dissipation and insulation increase thereafter. In this research, γ-aminopropyltriethoxysilane (KH550)-treated boron nitride (BN) powder was used as a filler to modify epoxy composites. Effects of the BN particle size and concentration on the thermal conductivity of composites were investigated. SEM image showed the treated BN filler dispersed well in the composite matrix. Moreover, the thermal conductivity was enhanced as the BN concentration was increased. Similar phenomenon was also observed when the filler particle size was reduced. Results indicated that with increasing amount of BN addition, the composites’ thermal conductivity showed a nearly linear increase. When the mass fraction of BN was 30% and its particle size was 220 nm, the thermal conductivity reached 3.4 W/(m•k), which was 17 times as high as that of pure EP resin.

The Influence of Inorganic Filler Particle Size on Composite Ion-Exchange Membranes for Desalination

2011 ◽  
Vol 115 (31) ◽  
pp. 15124-15132 ◽  
Author(s):  
Chalida Klaysom ◽  
Seung-Hyeon Moon ◽  
Bradley P. Ladewig ◽  
G. Q. Max Lu ◽  
Lianzhou Wang
Keyword(s):  
Particle Size ◽  
Ion Exchange ◽  
Filler Particle ◽  
Inorganic Filler ◽  
Ion Exchange Membranes ◽  
Filler Particle Size

Effect of resin-composite filler particle size and shape on shrinkage-stress

2012 ◽  
Vol 28 (6) ◽  
pp. 609-614 ◽  
Author(s):  
Julian D. Satterthwaite ◽  
Amit Maisuria ◽  
Karin Vogel ◽  
David C. Watts
Keyword(s):  
Particle Size ◽  
Resin Composite ◽  
Filler Particle ◽  
Shrinkage Stress ◽  
Size And Shape ◽  
Filler Particle Size ◽  
Composite Filler ◽  
Particle Size And Shape
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