Scanning electron microscopy study of the cross section of intermetallic compound in the solder ball on the plastic ball grid array package following reliability tests

2005 ◽  
Vol 34 (7) ◽  
pp. 1026-1029
Author(s):  
Yeh-Fang Duann ◽  
Jen-Hung Chiang ◽  
Shung-Jim Yang ◽  
Hsun-Wen Chang
Keyword(s):  
Electron Microscopy ◽  
Cross Section ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Microscopy Study ◽  
Electron Microscopy Study ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Ball Grid Array Package ◽  
Scanning Electron

Factors influencing adhesive bonding at the bone/implant interface

1992 ◽  
Vol 50 (2) ◽  
pp. 1114-1115
Author(s):  
Julie A. Martini ◽  
Robert H. Doremus
Keyword(s):  
Electron Microscopy ◽  
Adhesive Bonding ◽  
Microscopy Study ◽  
Electron Microscopy Study ◽  
Bone Implant ◽  
Factors Influencing ◽  
Lr White ◽  
Transmission Electron ◽  
New Zealand White Rabbits ◽  
Scanning Electron

Tracy and Doremus have demonstrated chemical bonding between bone and hydroxylapatite with transmission electron microscopy. Now researchers ponder how to improve upon this bond in turn improving the life expectancy and biocompatibility of implantable orthopedic devices.This report focuses on a study of the- chemical influences on the interfacial integrity and strength. Pure hydroxylapatite (HAP), magnesium doped HAP, strontium doped HAP, bioglass and medical grade titanium cylinders were implanted into the tibial cortices of New Zealand white rabbits. After 12 weeks, the implants were retrieved for a scanning electron microscopy study coupled with energy dispersive spectroscopy.Following sacrifice and careful retrieval, the samples were dehydrated through a graduated series starting with 50% ethanol and continuing through 60, 70, 80, 90, 95, and 100% ethanol over a period of two days. The samples were embedded in LR White. Again a graduated series was used with solutions of 50, 75 and 100% LR White diluted in ethanol.

To morphology, ecology and distribution of rare species Sellaphora hustedtii (Krasske) Lange-Bertalot et Werum (Bacillariophyta) from waterbodies of the Gydan Peninsula

2014 ◽  
Vol 48 ◽  
pp. 57-65 ◽  
Author(s):  
S. I. Genkal ◽  
M. I. Jarushina
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
River Basin ◽  
Rare Species ◽  
Western Siberia ◽  
Microscopy Study ◽  
Electron Microscopy Study ◽  
Diagnostic Features ◽  
Scanning Electron Microscopy Study ◽  
Scanning Electron

A rare species Sellaphora hustedtii, which is also new for the flora of Russia, has been found in waterbodies of the Messoyakha River basin (south-western part of the Gydan Peninsula, Western Siberia). The scanning electron microscopy study revealed variability of the main quantitative and qualitative diagnostic features of the species (length and width of the valve, number of striae and areolae in 10 μm, shape of the valve and structure of the raphe). New data on the ecology and distribution of the species allowed us to specify its diagnosis.

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

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