Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis

2013 ◽  
Vol 43 (1) ◽  
pp. 52-56 ◽  
Author(s):  
Hsueh-Hsien Hsu ◽  
Tz-Cheng Chiu ◽  
Tao-Chih Chang ◽  
Shin-Yi Huang ◽  
Hsin-Yi Lee ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Strain Measurement ◽  
X Ray Diffraction ◽  
Element Analysis ◽  
X Ray

scholarly journals Effect of Argon-Purged Cooling on Generating Residual Stress in Oxide Scale Formed on Si-Containing Steels Examined by In Situ X-ray Diffraction and Finite Element Analysis

2020 ◽  
Vol 61 (1) ◽  
pp. 136-141
Author(s):  
Koji Sasaki ◽  
Kazushi Hayashi ◽  
Mikako Takeda ◽  
Shohei Nakakubo ◽  
Yohei Yamada ◽  
...  
Keyword(s):  
Residual Stress ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Oxide Scale ◽  
X Ray Diffraction ◽  
Element Analysis ◽  
X Ray

scholarly journals Effect of a Multiple Reduction Die on the Residual Stress of Drawn Materials

Materials ◽  
2021 ◽  
Vol 14 (6) ◽  
pp. 1358
Author(s):  
Jeong-Hun Kim ◽  
Chang-Hyun Baek ◽  
Sang-Kon Lee ◽  
Jong-Hun Kang ◽  
Joon-Hong Park ◽  
...  
Keyword(s):  
Neural Network ◽  
Residual Stress ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Residual Stresses ◽  
Deep Neural Network ◽  
Drawing Process ◽  
X Ray Diffraction ◽  
Element Analysis ◽  
X Ray

Residual stress may influence the mechanical behavior and durability of drawn materials. Thus, this study develops a multiple reduction die (MRD) that can reduce residual stress during the drawing process. The MRD set consists of several die tips, die cases, and lubricating equipment. All the die tips of the MRD were disposed of simultaneously. Finite element analysis of the drawing process was performed according to the reduction ratio of each die tip, and the variables in drawing process with the MRD were optimized using a deep neural network to minimize the residual stress. Experiments on the drawing process with the conventional die and MRD were performed to evaluate the residual stress and verify the effectiveness of the MRD. The results of X-ray diffraction measurements indicated that the axial and hoop residual stresses on the surface were dramatically reduced.

Comparison of Stresses in Al Lines Under Various Passivations

1997 ◽  
Vol 473 ◽  
Author(s):  
S. Lee ◽  
J. C. Bravman ◽  
P. A. Flinn ◽  
T. N. Marffib
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Relaxation ◽  
High Voltage ◽  
Thermal Stresses ◽  
Test Results ◽  
Element Analysis ◽  
X Ray

ABSTRACTThermal stresses in pure Al lines passivated with a baseline 1000Å oxide and additional passivations of 0.5μm oxide, 1μm polymer, or 0.5μm, 1μm, or 2μ nitride were analyzed. Results from finite element analysis and X-ray measurements were compared, and samples were examined in a high voltage SEM for stress voids. For unvoided samples, calculated and measured results showed good correlation, while results for the voided samples showed little correlation due to stress relaxation through voiding. Initial in-situ electromigration test results showed that electromigration voids can occur at stress void sites.

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