An Investigation of the Cause of Failure in a Spring Hose Clamp

Abstract The paper reports the investigation on the root cause of source-drain leakage in bulk FinFET devices. While the failing device was readily isolated by nanoprobing technique and the electrical analysis pinpointed the potential defect location inside the Fin channel, the identification of physical root cause went through extreme challenges imposed by the tiny-sized device and the unique FinFET 3D architecture. The initial TEM analysis was misled by the projection of a species in the lamella surface and thus could not explain the electrical data. Careful analysis on the device structure was able to identify the origin of the species and led to the discovery of the actual root cause. This paper will provide the analysis details leading to the findings, and highlight the role of electrical understanding in not only providing guidance for physical analysis but also revealing the true root cause of failure in FinFET devices.

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Failure Localization in a Multistage S-Band Power Amplifier

ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2016p0373 ◽

2016 ◽

Author(s):

Clarence Rebello ◽

Ted Kolasa ◽

Parag Modi

Keyword(s):

Output Power ◽

Power Amplifier ◽

Fault Tree ◽

Root Cause ◽

Failure Investigation ◽

Band Power ◽

Cause Of Failure ◽

Design Materials ◽

Board Level ◽

Failure Localization

Abstract During the search for the root cause of a board level failure, all aspects of the product must be revisited and investigated. These aspects encompass design, materials, and workmanship. In this discussion, the failure investigation involved an S-Band Power Amplifier assembly exhibiting abnormally low RF output power where initial troubleshooting did not provide a clear cause of failure. A detailed fault tree drove investigations that narrowed the focus to a few possible root causes. However, as the investigation progressed, multiple contributors were eventually discovered, some that were not initially considered.

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Case Study—Failure Analysis of a Multiplexer

ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2016p0243 ◽

2016 ◽

Author(s):

Michael Woo ◽

Marcos Campos ◽

Luigi Aranda

Keyword(s):

Failure Analysis ◽

High Reliability ◽

Component Failure ◽

Root Cause ◽

Knowing That ◽

Cause Of Failure ◽

The Cost

Abstract A component failure has the potential to significantly impact the cost, manufacturing schedule, and/or the perceived reliability of a system, especially if the root cause of the failure is not known. A failure analysis is often key to mitigating the effects of a componentlevel failure to a customer or a system; minimizing schedule slips, minimizing related accrued costs to the customer, and allowing for the completion of the system with confidence that the reliability of the product had not been compromised. This case study will show how a detailed and systemic failure analysis was able to determine the exact cause of failure of a multiplexer in a high-reliability system, which allowed the manufacturer to confidently proceed with production knowing that the failure was not a systemic issue, but rather that it was a random “one time” event.

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Infra-Red Reflectance Microscopy (IRRM) for Daisy Chain Flip Chip Device Failure Analysis

ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2004p0669 ◽

2004 ◽

Author(s):

Carlo Grilletto ◽

Steve Hsiung ◽

Andrew Komrowski ◽

John Soopikian ◽

Daniel J.D. Sullivan ◽

...

Keyword(s):

Failure Analysis ◽

Flip Chip ◽

State Of The Art ◽

Failure Mechanisms ◽

Simple Metal ◽

X Ray ◽

Infra Red ◽

Cause Of Failure ◽

Reflectance Microscopy ◽

Ir Emission

Abstract This paper describes a method to "non-destructively" inspect the bump side of an assembled flip-chip test die. The method is used in conjunction with a simple metal-connecting "modified daisy chain" die and makes use of the fact that polished silicon is transparent to infra-red (IR) light. The paper describes the technique, scope of detection and examples of failure mechanisms successfully identified. It includes an example of a shorting anomaly that was not detectable with the state of the art X-ray equipment, but was detected by an IR emission microscope. The anomalies, in many cases, have shown to be the cause of failure. Once this has been accomplished, then a reasonable deprocessing plan can be instituted to proceed with the failure analysis.

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An investigation into the cause of road failure along Sagamu-Papalanto highway southwestern Nigeria

Geoenvironmental Disasters ◽

10.1186/s40677-020-00174-8 ◽

2021 ◽

Vol 8 (1) ◽

Author(s):

Ubido Oyem Emmanuel ◽

Igwe Ogbonnaya ◽

Ukah Bernadette Uche

Keyword(s):

Construction Materials ◽

Road Construction ◽

Linear Shrinkage ◽

Liquid Limit ◽

Dry Density ◽

Maximum Dry Density ◽

Southwestern Nigeria ◽

Low Resistivity ◽

The Road ◽

Cause Of Failure

AbstractInvestigation into the cause of road failure has been carried out along a 60 km long Sagamu –Papalanto highway southwestern Nigeria. Geochemical, mineralogical, geotechnical and geophysical analyses were conducted to evaluate the cause of failure along the study area. The results of the laboratory tests showed that the percentage amount of fines ranges from 12 to 61.3%, natural moisture content from 6.8 to 19.7%, liquid limit in the range of 25.1–52.2%, linear shrinkage between 3.96 to 12.71%, plastic limit ranges from 18.2–35%, plasticity index ranges from 5.2 to 24.6%, free swell in the range from 5.17–43.9%, maximum dry density ranges from 1.51–1.74 g /cm3, specific gravity ranges from 2.52–2.64 and CBR between 3 and 12%. The Cone Penetrometer Test (CPT) shows a resistance value of 20–138 kgf/cm2. The major clay mineral that is predominant in the studied soil is kaolinite. The major oxides present are SiO2, Al2O3, Fe2O3, K2O, Na2O, MgO and CaO. The result of the 2D Electrical Resistivity Imaging revealed a low resistivity values for profile 2 and 3 ranging from 100 Ωm – 300 Ωm, between a distance of 20 m – 240 m along the profile to a depth of 7.60 m and a low resistivity value ranging from 50 Ωm – 111Ωm, between a distance of 80 m − 120 m along the profile to a depth of 15 m. It was concluded that the low CBR, low MDD and the class of subsoils namely A-26, A-7, A-2-7 (clayey soils) which were identified are responsible for the cause of failure experienced in the study area. These makes the soils unsuitable as road construction materials and hence, there is need for stabilization during the reconstruction and rehabilitation of the road.

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Causes of failure of combined approach tympanoplasty in the treatment of acquired cholesteatomas of the middle ear and the mastoid

The Journal of Laryngology & Otology ◽

10.1017/s0022215100131123 ◽

1995 ◽

Vol 109 (8) ◽

pp. 710-712 ◽

Cited By ~ 7

Author(s):

T. R. Kapur

Keyword(s):

Tympanic Membrane ◽

Eustachian Tube ◽

Middle Ear ◽

Squamous Epithelium ◽

Combined Approach ◽

Tube Obstruction ◽

Incomplete Removal ◽

Tube Dysfunction ◽

Cause Of Failure ◽

Causes Of Failure

AbstractForty cases of failed combined approach tympanoplasty were analysed. The commonest cause of failure was adhesions between the facial ridge and the tympanic membrane, causing segmental attico-mastoid malaeration in 51.3 per cent of cases followed-up continually. Other causes were, large dermoids, incomplete removal of squamous epithelium, and eustachian tube obstruction. Eustachian tube dysfunction did not appear to be a major cause of failure.

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