Coupling of Creep Deformation Mechanism Equations and Dynamic Recrystallization Kinetics for the Calculation of Processing Maps for Metallic Alloys

2021 ◽  
Author(s):  
Woo-Jin Kim ◽  
Hee-Tae Jeong
Keyword(s):  
Dynamic Recrystallization ◽  
Creep Deformation ◽  
Deformation Mechanism ◽  
Metallic Alloys ◽  
Processing Maps ◽  
Recrystallization Kinetics

scholarly journals Hot Deformation Behavior and Processing Maps of a New Ti-6Al-2Nb-2Zr-0.4B Titanium Alloy

Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2456
Author(s):  
Zhijun Yang ◽  
Weixin Yu ◽  
Shaoting Lang ◽  
Junyi Wei ◽  
Guanglong Wang ◽  
...  
Keyword(s):  
Titanium Alloy ◽  
Flow Stress ◽  
Constitutive Equation ◽  
Deformation Mechanism ◽  
Power Dissipation ◽  
Hot Deformation ◽  
Dissipation Rate ◽  
Dynamic Recovery ◽  
Processing Maps ◽  
Temperature Range

The hot deformation behaviors of a new Ti-6Al-2Nb-2Zr-0.4B titanium alloy in the strain rate range 0.01–10.0 s−1 and temperature range 850–1060 °C were evaluated using hot compressing testing on a Gleeble-3800 simulator at 60% of deformation degree. The flow stress characteristics of the alloy were analyzed according to the true stress–strain curve. The constitutive equation was established to describe the change of deformation temperature and flow stress with strain rate. The thermal deformation activation energy Q was equal to 551.7 kJ/mol. The constitutive equation was ε ˙=e54.41[sinh (0.01σ)]2.35exp(−551.7/RT). On the basis of the dynamic material model and the instability criterion, the processing maps were established at the strain of 0.5. The experimental results revealed that in the (α + β) region deformation, the power dissipation rate reached 53% in the range of 0.01–0.05 s−1 and temperature range of 920–980 °C, and the deformation mechanism was dynamic recovery. In the β region deformation, the power dissipation rate reached 48% in the range of 0.01–0.1 s−1 and temperature range of 1010–1040 °C, and the deformation mechanism involved dynamic recovery and dynamic recrystallization.

Microstructures and Creep of AM50-Sb-Gd Alloys

2005 ◽  
Vol 488-489 ◽  
pp. 749-752 ◽  
Author(s):  
Su Gui Tian ◽  
Keun Yong Sohn ◽  
Hyun Gap Cho ◽  
Kyung Hyun Kim
Keyword(s):  
Activation Energy ◽  
Creep Rate ◽  
Stress Exponent ◽  
Creep Behavior ◽  
Creep Deformation ◽  
Deformation Mechanism ◽  
Creep Resistance ◽  
Fine Particles ◽  
Dislocation Climb ◽  
The Matrix

Creep behavior of AM50-0.4% Sb-0.9%Gd alloy has been studied at temperatures ranging from 150 to 200°C and at stresses ranging from 40 to 90 MPa. Results show that the creep rate of AM50-0.4%Sb-0.9%Gd alloy was mainly controlled by dislocation climb at low stresses under 50 MPa. The activation energy for the creep was 131.2 ± 10 kJ/mol and the stress exponent was in the range from 4 to 9 depending on the applied stress. More than one deformation-mechanism were involved during the creep of this alloy. Microstructures of the alloy consist of a–Mg matrix and fine particles, distinguished as Mg17Al12, Sb2Mg3, and Mg2Gd or Al7GdMn5 that were homogeneously distributed in the matrix of the alloy, which effectively reduced the movement of dislocations, enhancing the creep resistance. Many dislocations were identified to be present on non-basal planes after creep deformation.

scholarly journals Creep Deformation Mechanism of P/M Al-8 mass%Fe Alloy

1992 ◽  
Vol 56 (4) ◽  
pp. 390-398 ◽  
Author(s):  
Fuyuki Yoshida ◽  
Norio Matsuda ◽  
Keisuke Matsuura
Keyword(s):  
Creep Deformation ◽  
Deformation Mechanism
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