Analysis of Current-Voltage-Temperature and Capacitance-Voltage-Temperature Characteristics of Re/n-Si Schottky Contacts

Silicon ◽  
2016 ◽  
Vol 10 (2) ◽  
pp. 361-369 ◽  
Author(s):  
Haziret Durmuş ◽  
Hamdi Şükür Kılıç ◽  
Serap Yiğit Gezgin ◽  
Şükrü Karataş
Keyword(s):  
Schottky Contacts ◽  
Temperature Characteristics ◽  
Current Voltage ◽  
Capacitance Voltage

EFFECT OF SURFACE PASSIVATION ON CAPACITANCE–VOLTAGE CHARACTERISTICS OF Sn/p-Si SCHOTTKY CONTACTS

2011 ◽  
Vol 25 (04) ◽  
pp. 531-542
Author(s):  
CABİR TEMİRCİ ◽  
BAHRI BATI
Keyword(s):  
Chemical Treatment ◽  
Room Temperature ◽  
Surface Passivation ◽  
Anodic Oxide ◽  
Treatment Method ◽  
Schottky Contacts ◽  
Metal Insulator ◽  
Current Voltage ◽  
Capacitance Voltage ◽  
Effect Of Surface

We have fabricated the Sn/p-Si Schottky barrier diodes with the interfacial layer metal–insulator–semiconductor (D-MIS) and the surface passivation metal–semiconductor MS (D-MS) by the anodization or chemical treatment method. The current–voltage (I–V) and capacitance–voltage (C–V) characteristics of the devices were measured at room temperature. We obtained that the excess capacitance (C0) value of the MIS Sn/p-Si diode with the anodic oxide layer of 16.88 pF and 0.12 pF for the MS Sn/p-Si ideal diode with the surface passivation by the anodization or chemical treatment method from reverse bias C–V characteristics. Thus, we have succeeded to diminish the excess capacitance value to the limit of 0.12 pF for the MS Sn/p-Si diode by using the anodization or chemical treatment method.

Current–voltage and capacitance–voltage characteristics of metallic polymer/InSe(:Er) Schottky contacts

2000 ◽  
Vol 51-52 ◽  
pp. 689-693 ◽  
Author(s):  
B Abay ◽  
Y Onganer ◽  
M Saǧlam ◽  
H Efeoǧlu ◽  
A Türüt ◽  
...  
Keyword(s):  
Schottky Contacts ◽  
Current Voltage ◽  
Capacitance Voltage

Schottky Contacts to N-Type 4H-SiC Fabricated with Ti-, Mo-, Ni- and Al-Based Metallizations

2011 ◽  
Vol 679-680 ◽  
pp. 453-456
Author(s):  
Denis Perrone ◽  
Sergio Ferrero ◽  
Luciano Scaltrito ◽  
Marco Naretto ◽  
Edvige Celasco ◽  
...  
Keyword(s):  
Photoelectron Spectroscopy ◽  
Schottky Diodes ◽  
Schottky Contact ◽  
Structural Evolution ◽  
Schottky Contacts ◽  
Power Losses ◽  
X Ray ◽  
Current Voltage ◽  
Capacitance Voltage ◽  
Power Densities

In this work we studied different Schottky contacts to 4H-SiC with the aim to obtain Schottky Barrier diodes (SBDs) and Junction Barrier Schottky diodes (JBS) able to operate at high temperatures, frequencies and power densities with low power losses. Schottky contacts were fabricated using Mo and Mo/Al layers annealed up to 600 °C using a Rapid Thermal Process (RTP). A comparison with previous results obtained with Ni, Ti and Ti/Al layers annealed up to 400 °C is also proposed. The Schottky contacts were characterized by means of standard Current-Voltage (I-V) and Capacitance-Voltage (C-V) techniques. X-ray Photoelectron Spectroscopy (XPS) analyses were performed in depth profile mode in order to study the structural evolution of the interface Mo/SiC and Al/Mo during annealing treatments. Mo/Al contacts show a lower barrier height and better overall performances in forward polarization when compared to the Ti- and Ni-based contacts, and they are very promising for Schottky contact fabrication on SBD and JBS.

Thermally Stable Schottky Contacts TO n-GaN

1998 ◽  
Vol 512 ◽  
Author(s):  
H. S. Venugopalan ◽  
S. E. Mohney
Keyword(s):  
Schottky Diodes ◽  
Schottky Contacts ◽  
Thermally Stable ◽  
Short Term ◽  
Barrier Heights ◽  
Current Voltage ◽  
Capacitance Voltage

ABSTRACTThe barrier heights of Ni/Ga/Ni and Re Schottky contacts to n-GaN were investigated by current-voltage (I-V) and capacitance-voltage (C-V) measurements. The elemental Ni contacts were also investigated for comparison. The Ni/Ga/Ni and Re diodes were stable on short term annealing up to 700 °C. It was also shown that the Ni/Ga/Ni (84 at% Ni, 16 at% Ga) diodes were more stable than Ni diodes. This work provides the first demonstration of Schottky diodes to n-GaN that are stable upon annealing at 700 °C.

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