scholarly journals Growth of an Ag3Sn Intermetallic Compound Layer Within Photovoltaic Module Ribbon Solder Joints

2019 ◽  
Vol 7 (1) ◽  
pp. 89-96 ◽  
Author(s):  
Yu-Jae Jeon ◽  
Min-Soo Kang ◽  
Young-Eui Shin
Keyword(s):  
Intermetallic Compound ◽  
Solder Joints ◽  
Compound Layer ◽  
Photovoltaic Module ◽  
Intermetallic Compound Layer

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

2011 ◽  
Vol 133 (3) ◽  
Author(s):  
Tong An ◽  
Fei Qin
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Impact Loading ◽  
Driving Force ◽  
Solder Joints ◽  
Compound Layer ◽  
Drop Impact ◽  
Lead Free ◽  
Intermetallic Compound Layer ◽  
Crack Driving Force

The significant difference between failure modes of lead-containing and lead-free solder joints under drop impact loading remains to be not well understood. In this paper, we propose a feasible finite element approach to model the cracking behavior of solder joints under drop impact loading. In the approach, the intermetallic compound layer/solder bulk interface is modeled by the cohesive zone model, and the crack driving force in the intermetallic compound layer is evaluated by computing the energy release rate. The numerical simulation of a board level package under drop impact loading shows that, for the lead-containing Sn37Pb solder joint, the damage in the vicinity of the intermetallic compound layer initiates earlier and is much greater than that in the lead-free Sn3.5Ag solder joint. This damage relieves the stress in the intermetallic compound layer and reduces the crack driving force in it and consequently alleviates the risk of the intermetallic compound layer fracturing.

Effect of Intermetallic Compound Layer Development on Interface Strength of Solder joints

2000 ◽  
Vol 2000 (0) ◽  
pp. 231-232
Author(s):  
Masaki OMIYA ◽  
Yuya NAKAKO ◽  
Kikuo KISHIMOTO ◽  
Toshikazu SHIBUYA ◽  
Masazumi AMAGAI
Keyword(s):  
Intermetallic Compound ◽  
Solder Joints ◽  
Compound Layer ◽  
Interface Strength ◽  
Intermetallic Compound Layer ◽  
Layer Development

A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints

2000 ◽  
Vol 123 (1) ◽  
pp. 52-57 ◽  
Author(s):  
J. K. Chen ◽  
J. E. Beraun ◽  
D. Y. Tzou
Keyword(s):  
Intermetallic Compound ◽  
Solder Joints ◽  
Dissimilar Materials ◽  
Compound Layer ◽  
Layer Growth ◽  
Intermetallic Compound Layer ◽  
Delayed Response ◽  
Phase Lag ◽  
Dual Phase ◽  
History Of

A dual-phase-lag diffusion (DPLD) model is presented for predicting the intermetallic compound (IMC) layer growth in solder joints. It extends from Fick’s law by taking into account the delayed response between the interdiffusion of two dissimilar materials and the chemical reaction that forms the IMC. The merit of this model is that it uniquely represents four different types of IMC growth kinetics, all of which are found in the literature. Comparison between the model and experimental results for 100Sn/Cu and Ag/Zn systems demonstrates that the proposed DPLD model captures the growth history of IMC layers quite well.

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