Influence of porous Cu interlayer on the intermetallic compound layer and shear strength of MWCNT-reinforced SAC 305 composite solder joints

2021 ◽  
Author(s):  
M. A. Azmah Hanim ◽  
Anusha Baradi Dasan ◽  
T. T. Dele-Afolabi ◽  
Tadashi Ariga ◽  
K. Vidyatharran
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Composite Solder ◽  
Solder Joints ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Cu Interlayer

Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint

2015 ◽  
Vol 27 (1) ◽  
pp. 52-58 ◽  
Author(s):  
Peter K. Bernasko ◽  
Sabuj Mallik ◽  
G. Takyi
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Layer Thickness ◽  
Solder Joints ◽  
Ageing Time ◽  
Circuit Board ◽  
Intermetallic Compound Layer ◽  
Content Type ◽  
Surface Mount

Purpose – The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints. Design/methodology/approach – To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester). Findings – It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids. Research limitations/implications – A proper correlation between shear strength and fracture mode is required. Practical implications – The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint. Originality/value – The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.

Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste

2015 ◽  
Vol 754-755 ◽  
pp. 546-550 ◽  
Author(s):  
Rita Mohd Said ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Contact Angle ◽  
Intermetallic Compound ◽  
Composite Solder ◽  
Copper Substrate ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Solder Paste ◽  
X Ray Diffraction ◽  
Free Solder ◽  
Sic Particle

The effects of SiC on wettability and intermetallic compound (IMC) formation of Sn-Cu-Ni solder paste composite were systematically investigated. Lead-free solder paste composite was produced by mixing silicon carbide (SiC) particle with Sn-Cu-Ni (SN100C) solder paste. The wettability of composite solder was studied by observing the contact angle between solder and copper substrate. The IMC phase formation on copper substrate interface was identified using X-ray diffraction (XRD). The phase as detected in the composite solder is Cu6Sn5.The wettability of composite solder was observed through contact angle between solder and copper substrate and Sn-Cu-Ni + 1.0 wt.% SiC shows improvements in wetting angle and suppresses the IMCs formation.

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

2011 ◽  
Vol 133 (3) ◽  
Author(s):  
Tong An ◽  
Fei Qin
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Impact Loading ◽  
Driving Force ◽  
Solder Joints ◽  
Compound Layer ◽  
Drop Impact ◽  
Lead Free ◽  
Intermetallic Compound Layer ◽  
Crack Driving Force

The significant difference between failure modes of lead-containing and lead-free solder joints under drop impact loading remains to be not well understood. In this paper, we propose a feasible finite element approach to model the cracking behavior of solder joints under drop impact loading. In the approach, the intermetallic compound layer/solder bulk interface is modeled by the cohesive zone model, and the crack driving force in the intermetallic compound layer is evaluated by computing the energy release rate. The numerical simulation of a board level package under drop impact loading shows that, for the lead-containing Sn37Pb solder joint, the damage in the vicinity of the intermetallic compound layer initiates earlier and is much greater than that in the lead-free Sn3.5Ag solder joint. This damage relieves the stress in the intermetallic compound layer and reduces the crack driving force in it and consequently alleviates the risk of the intermetallic compound layer fracturing.

Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM

2005 ◽  
Vol 297-300 ◽  
pp. 863-868
Author(s):  
Dae Gon Kim ◽  
Hyung Sun Jang ◽  
Jong Woong Kim ◽  
Seung Boo Jung
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Layer Thickness ◽  
Flip Chip ◽  
Solder Bump ◽  
Ductile Failure ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Quantitative Analyses ◽  
Dominant Phase

In the present work, we investigated the interfacial reactions and shear properties between Sn-3.0Ag-0.5Cu flip chip solder bump and Cu UBM after multiple reflows. The quantitative analyses of the intermetallic compound layer thickness as a function of the number of reflows were performed. After six reflows, the reaction product could be distinguished by two intermetallic compounds: Cu3Sn adjacent to the substrate and Cu6Sn5 which was the dominant phase. The thickness of total intermetallic compound layers increased with the number of reflows. The shear strength value did not significantly change as a function of the number of reflows. Nearly all of the test specimens showed ductile failure mode, and this could be well explained with the results of FEM analyses.

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