Strength Evaluation for Brittle Failure of Intermetallic Compound Layer in Solder Joints
2000 ◽
Vol 2000
(0)
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pp. 525-526
2001 ◽
Vol 2001
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pp. 437-438
2014 ◽
Vol 25
(10)
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pp. 4219-4224
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2000 ◽
Vol 23
(2)
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pp. 277-284
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2014 ◽
Vol 25
(12)
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pp. 5195-5200
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2019 ◽
Vol 7
(1)
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pp. 89-96
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2000 ◽
Vol 2000
(0)
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pp. 231-232
2013 ◽
Vol 79
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pp. 1-14
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A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints
2000 ◽
Vol 123
(1)
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pp. 52-57
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