Low temperature deposition of amorphous silicon oxide and silicon nitride films

1985 ◽  
Vol 77-78 ◽  
pp. 925-928 ◽  
Author(s):  
P.D. Richard ◽  
D.V. Tsu ◽  
G. Lucovsky ◽  
S.Y. Lin
2019 ◽  
Vol 8 (11) ◽  
pp. P715-P718
Author(s):  
Yoshinobu Shiba ◽  
Akinobu Teramoto ◽  
Tomoyuki Suwa ◽  
Katsutoshi Ishii ◽  
Akira Shimizu ◽  
...  

2010 ◽  
Vol 11 (3) ◽  
pp. 109-112
Author(s):  
Jae‐Dam Hwang ◽  
Kyoung‐Min Lee ◽  
Ki‐Su Keum ◽  
Youn‐Jin Lee ◽  
Wan‐Shick Hong

2006 ◽  
Vol 55 (2) ◽  
pp. 142-147
Author(s):  
Hironobu UMEMOTO ◽  
Atsushi MASUDA ◽  
Hideki MATSUMURA ◽  
Toshiharu MINAMIKAWA ◽  
Akira HEYA ◽  
...  

1992 ◽  
Vol 282 ◽  
Author(s):  
K. Hochberg ◽  
David A. Roberts

ABSTRACTA precursor for the LPCVD of silicon oxide films has been developed that extends the low temperature deposition range to 100°C. The chemical, 1,4 disilabutane (DSB), produces silicon oxide depositions similar to those of the higher temperature silane and diethylsilane (DES) processes. Optimum DSB processes require pressures below 300 mTorr, similar to silane, in contrast to DES pressures above 600 mTorr at 350°C. This results in poorer conformalities than those of DES, but the step coverages are still superior to those from silane oxides. The DSB films are low stress, carbon-free oxide layers that are suitable for temperature-sensitive underlayers and substrates such as photoresist, plastics, GaAs, and HgCdTe.


2001 ◽  
Vol 7 (S2) ◽  
pp. 1228-1229
Author(s):  
Lew Rabenberg ◽  
J. P. Zhou ◽  
Kil-Soo Ko ◽  
Rita Johnson

Thin films of amorphous silicon oxide and silicon nitride are routinely used as gate dielectrics in silicon-based microelectronic devices. It is valuable to be able to image them and measure their thicknesses quickly and accurately. This brief note describes conditions that can be used to obtain accurate and reproducible TEM images of oxide-nitride-oxide (ONO) thin films.Obtaining adequate contrast differences between oxide and nitride is not trivial because they have the same average atomic number, and both phases are amorphous. As stoichiometric compounds, both SiO2 and Si3N4 would have average atomic numbers equal to 10. For SiO2, (14+2(8))/3=10, and for Si3N4, (3(14)+4(7))/7=10. Thus, the atomic number contrast between these two is weak or nonexistent. Similarly, the amorphous character prevents the use of conventional diffraction contrast techniques.However, the density of Si3N4 (3.2 g/cm3) is considerably greater than the density of SiO2 (2.6 g/cm3), reflecting the higher average coordination of N compared with O.


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