Structural characterization of silicon films deposited at low temperature by remote plasma enhanced chemical vapor deposition

1995 ◽  
Vol 24 (1-3) ◽  
pp. 79-83 ◽  
Author(s):  
Xiaodong Li ◽  
Young-Bae Park ◽  
Dong-Hwan Kim ◽  
Shi-Woo Rhee
Keyword(s):  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Structural Characterization ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Silicon Films ◽  
Remote Plasma

Properties and Production Mechanism of Low-Temperature Deposited CAT-CVD Poly-Silicon films

1992 ◽  
Vol 283 ◽  
Author(s):  
Hideki Matsumura ◽  
Yoichi Hosoda ◽  
Seijiro Furukawa
Keyword(s):  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Gas Pressure ◽  
Silicon Films ◽  
Production Mechanism ◽  
Cvd Method ◽  
Poly Silicon ◽  
Deposition Conditions

ABSTRACTPoly-silicon films are obtained at temperatures as low as 400 °C by the catalytic chemical vapor deposition (cat-CVD) method, in which deposition gases are decomposed by the catalytic or pyrolytic reactions with a heated catalyzer near substrates. It is found that there are roughly two modes of deposition conditions such as low gas pressure mode and high gas pressure mode for obtaining poly-silicon films, and also that the Hall mobility of the cat-CVD poly-silicon films of low gas pressure mode sometimes exceeds over 100 cm2/Vs.

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