Simulation of force, energy, and surface integrity during nanometric machining by molecular dynamics (MD)

2022 ◽  
pp. 163-186
Author(s):  
Chenshuo Liu ◽  
Pei Chen ◽  
Zhiwei Zhang
Keyword(s):  
Molecular Dynamics ◽  
Surface Integrity ◽  
Nanometric Machining

scholarly journals Effects of Lubrication on the Friction in Nanometric Machining Processes: A Molecular Dynamics Approach

2017 ◽  
Vol 869 ◽  
pp. 85-93 ◽  
Author(s):  
Martin P. Lautenschlaeger ◽  
Simon Stephan ◽  
Herbert M. Urbassek ◽  
Benjamin Kirsch ◽  
Jan Christian Aurich ◽  
...  
Keyword(s):  
Molecular Dynamics ◽  
Machining Process ◽  
Substantial Part ◽  
Machining Processes ◽  
Lennard Jones ◽  
Nanometric Machining ◽  
Dry Contact ◽  
The Coefficient Of Friction ◽  
Dynamics Simulations ◽  
Physical Phenomena

Physical phenomena in a nanometric machining process were studied by molecular dynamics simulations. A cylindrical tool was indented and then moved laterally on an initially flat workpiece. The focus of the study is on the effect of lubrication on the nanoscale. Therefore, the indentation and the scratching were studied both in vacuum and submersed in a lubricant. All materials were modeled by Lennard-Jones truncated and shifted potential sites. It is observed, that in the lubricated case, a substantial part of the cutting edge of the tool is in dry contact with the workpiece. Nevertheless, compared to the dry scenario, the lubrication lowers the coefficient of friction. However, the work which is needed for the indentation and the scratching is not reduced. The processed surface is found to be smoother in the lubricated case. As expected, the lubrication has an important influence on the temperature field observed in the simulation.

Choosing Appropriate Interatomic Potentials for Nanometric Molecular Dynamics (MD) Simulations

2016 ◽  
Vol 686 ◽  
pp. 194-199
Author(s):  
Akinjide O. Oluwajobi ◽  
Xun Chen
Keyword(s):  
Molecular Dynamics ◽  
Diamond Tool ◽  
Md Simulations ◽  
Dynamics Simulation ◽  
Interatomic Potentials ◽  
Embedded Atom ◽  
Pair Potentials ◽  
Empirical Potentials ◽  
Nanometric Machining ◽  
Cutting Processes

There is a need to choose appropriate interatomic empirical potentials for the molecular dynamics (MD) simulation of nanomachining, so as to represent chip formation and other cutting processes reliably. Popularly applied potentials namely; Lennard-Jones (LJ), Morse, Embedded Atom Method (EAM) and Tersoff were employed in the molecular dynamics simulation of nanometric machining of copper workpiece with diamond tool. The EAM potentials were used for the modelling of the copper-copper atom interactions. The pairs of EAM-Morse and EAM-LJ were used for the workpiece-tool (copper-diamond) atomic interface. The Tersoff potential was used for the carbon-carbon interactions in the diamond tool. Multi-pass simulations were carried out and it was observed that the EAM-LJ and the EAM-Morse pair potentials with the tool modelled as deformable with Tersoff potential were best suitable for the simulation. The former exhibit the lowest cutting forces and the latter has the lowest potential energy.

Molecular Dynamics Simulation on the Mechanism of Nanometric Machining of Single-Crystal Silicon

2004 ◽  
Vol 471-472 ◽  
pp. 144-148 ◽  
Author(s):  
Hui Wu ◽  
Bin Lin ◽  
S.Y. Yu ◽  
Hong Tao Zhu
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Single Crystal ◽  
Single Crystal Silicon ◽  
Atomic Scale ◽  
Dynamics Simulation ◽  
Crystal Silicon ◽  
Nanometric Cutting ◽  
Simulation Techniques ◽  
Nanometric Machining

Molecular dynamics (MD) simulation can play a significant role in addressing a number of machining problems at the atomic scale. This simulation, unlike other simulation techniques, can provide new data and insights on nanometric machining; which cannot be obtained readily in any other theory or experiment. In this paper, some fundamental problems of mechanism are investigated in the nanometric cutting with the aid of molecular dynamics simulation, and the single-crystal silicon is chosen as the material. The study showed that the purely elastic deformation took place in a very narrow range in the initial stage of process of nanometric cutting. Shortly after that, dislocation appeared. And then, amorphous silicon came into being under high hydrostatic pressure. Significant change of volume of silicon specimen is observed, and it is considered that the change occur attribute to phase transition from a diamond silicon to a body-centered tetragonal silicon. The study also indicated that the temperature distributing of silicon in nanometric machining exhibited similarity to conventional machining.

scholarly journals Multi-Pass Nanometric Machining Simulation Using the Molecular Dynamics (MD)

2011 ◽  
Vol 496 ◽  
pp. 241-246 ◽  
Author(s):  
Akinjide Oluwajobi ◽  
Xun Chen
Keyword(s):  
Molecular Dynamics ◽  
Md Simulation ◽  
Diamond Tool ◽  
Deformable Body ◽  
Lateral Force ◽  
Cross Sectional ◽  
Nanometric Machining ◽  
Atomic Vibrations ◽  
Force Components ◽  
Eam Potential

The multi-pass nanometric machining of copper with diamond tool was carried out using the Molecular Dynamics (MD) simulation. The copper-copper interactions were modelled by the EAM potential and the copper-diamond interactions were modelled by the Morse potential. The diamond tool was modelled as a deformable body and the Tersoff potential was applied for the carbon-carbon interactions. It was observed that the average tangential and the normal components of the cutting forces reduced in the consecutive cutting passes. Also, the lateral force components are affected by atomic vibrations and the cross sectional area during the cutting process.

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