Analysis of dual-phase-lag heat conduction in short-pulse laser heating of metals with a hybrid method

2013 ◽  
Vol 52 (2) ◽  
pp. 275-283 ◽  
Author(s):  
Haw-Long Lee ◽  
Wen-Lih Chen ◽  
Win-Jin Chang ◽  
Eing-Jer Wei ◽  
Yu-Ching Yang
Keyword(s):  
Heat Conduction ◽  
Pulse Laser ◽  
Hybrid Method ◽  
Laser Heating ◽  
Short Pulse ◽  
Phase Lag ◽  
Dual Phase ◽  
Short Pulse Laser ◽  
Pulse Laser Heating

Thermal Stress Associated With Non-Fourier Heat Conduction in Femtosecond Laser Heating of Multilayer Metallic Films

2018 ◽  
Author(s):  
Swarup Bag ◽  
M. Ruhul Amin
Keyword(s):  
Thin Film ◽  
Heat Conduction ◽  
Thermal Stress ◽  
Temperature Distribution ◽  
Pulse Laser ◽  
Laser Heating ◽  
Laser Source ◽  
Phase Lag ◽  
Dual Phase ◽  
Fourier Heat Conduction

In the present work, the deformation behavior in metallic film subjected to ultra-short laser heating is investigated. Static thermo-elastic behavior is predicted for 100 nm thin film of either single layer or multiple layers. The temperature distribution is estimated from dual-phase lag non-Fourier heat conduction model. The maximum temperature after single pulse is achieved 730 K. The temperature profile for this pulse laser is used to compute elastic stress and distortion field following the minimization of potential energy of the system. In the present work, the simulation has been proposed by developing 3D finite element based coupled thermo-elastic model using dual phase lag effect. The experimental basis of transient temperature distribution in ultra-short pulse laser is extremely difficult or nearly impossible, the model results have been validated with literature reported thermal results. Since the temperature distribution due to pulse laser source varies with time, the stress analysis is performed in incremental mode. Hence, a sequentially coupled thermo-mechanical model is developed that is synchronized between thermal and mechanical analysis in each time steps of transient problem. The maximum equivalent stress is achieved 0.3 GPa. Numerical results show that the predicted thermal stress may exceeds the tensile strength of the material and may lead to crack or damage the thin film.

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