CFD study of constructal microchannel networks for liquid-cooling of electronic devices

2016 ◽  
Vol 95 ◽  
pp. 374-381 ◽  
Author(s):  
Carlos A. Rubio-Jimenez ◽  
Abel Hernandez-Guerrero ◽  
Jaime G. Cervantes ◽  
Daniel Lorenzini-Gutierrez ◽  
C. Ulises Gonzalez-Valle
Keyword(s):  
Electronic Devices ◽  
Liquid Cooling

scholarly journals CAD/CAE method of solving the hydrodynamic problem while developing powerful electronic devices

2018 ◽  
pp. 33-41 ◽  
Author(s):  
V. E. Trofimov ◽  
A. L. Pavlov ◽  
Y. G. Mamykin
Keyword(s):  
Operating System ◽  
Electronic Devices ◽  
Modeling Method ◽  
Free Software ◽  
Hydrodynamic Problem ◽  
Liquid Cooling ◽  
Software Packages

The article presents examples of the solution of the hydrodynamic problem that arises in the development of powerful electronic devices requiring liquid cooling using the CAD/CAE modeling method. The authors consider poorly documented or undocumented features of such solution based on the use of free software packages - SALOME, OpenFOAM and ParaView for the CAELinux operating system platform.

scholarly journals Heat Dissipation for Microprocessor Using Multiwalled Carbon Nanotubes Based Liquid

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Bui Hung Thang ◽  
Pham Van Trinh ◽  
Nguyen Van Chuc ◽  
Phan Hong Khoi ◽  
Phan Ngoc Minh
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Cooling System ◽  
Electronic Devices ◽  
Thermal Dissipation ◽  
Distilled Water ◽  
Liquid Cooling ◽  
Multiwalled Carbon ◽  
Liquid Cooling System ◽  
Computer Processor

Carbon nanotubes (CNTs) are one of the most valuable materials with high thermal conductivity (2000 W/m·Kcompared with thermal conductivity of Ag 419 W/m·K). This suggested an approach in applying the CNTs in thermal dissipation system for high power electronic devices, such as computer processor and high brightness light emitting diode (HB-LED). In this work, multiwalled carbon nanotubes (MWCNTs) based liquid was made by COOH functionalized MWCNTs dispersed in distilled water with concentration in the range between 0.2 and 1.2 gram/liter. MWCNT based liquid was used in liquid cooling system to enhance thermal dissipation for computer processor. By using distilled water in liquid cooling system, CPU’s temperature decreases by about 10°C compared with using fan cooling system. By using MWCNT liquid with concentration of 1 gram/liter MWCNTs, the CPU’s temperature decreases by 7°C compared with using distilled water in cooling system. Theoretically, we also showed that the presence of MWCNTs reduced thermal resistance and increased the thermal conductivity of liquid cooling system. The results have confirmed the advantages of the MWCNTs for thermal dissipation systems for theμ-processor and other high power electronic devices.

Effective Parameters on Increasing Efficiency of Microscale Heat Sinks and Application of Liquid Cooling in Real Life

2021 ◽  
Author(s):  
Yousef Alihosseini ◽  
Amir Rezazad Bari ◽  
Mehdi Mohammadi
Keyword(s):  
Heat Sink ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Academic Research ◽  
Real Life ◽  
Critical Issue ◽  
Heat Sinks ◽  
Effective Parameters ◽  
Liquid Cooling ◽  
Flow Parameters

Over the past two decades, electronic technology and miniaturization of electronic devices continue to grow exponentially, and heat dissipation becomes a critical issue for electronic devices due to larger heat generation. So, the need to cool down electronic components has led to the development of multiple cooling methods and microscale heat sinks. This chapter reviewed recent advances in developing an efficient heat sink, including (1) geometry parameters, (2) flow parameters that affect the hydraulic–thermal performance of the heat sink. Also, the main goal of this chapter is to address the current gap between academic research and industry. Furthermore, commercialized electronic cooling devices for various applications are highlighted, and their operating functions are discussed, which has not been presented before.

scholarly journals A Review on Development of Liquid Cooling System for Central Processing Unit (CPU)

2020 ◽  
Vol 78 (2) ◽  
pp. 98-113
Author(s):  
Muhammad Arif Harun ◽  
Nor Azwadi Che Sidik
Keyword(s):  
Heat Transfer ◽  
Heat Generation ◽  
Heat Transfer Performance ◽  
Cooling System ◽  
Electronic Devices ◽  
Working Fluid ◽  
Transfer Performance ◽  
Liquid Cooling ◽  
Cooling Performance ◽  
Liquid Cooling System

Electronic devices are becoming more efficient while getting a smaller size and compact design thus increase heat generation significantly. High heat generation from high technology electronic devices are needed to be cool down or control its temperature to prevent overheating problems. Due to the high cooling performance of liquid cooling, the electronic cooling system is shifting from an air-cooling system to a liquid cooling system. In the past few decades, numerous methods proposed by researchers for the central process unit (CPU) cooling using the liquid system either active cooling or passive cooling system. Other than physical configuration such as heat sink design, different configurations of working fluids are widely been studied by most of the researchers. Different working fluids have different heat transfer performance. Furthermore, a recent study has come out more interesting finding using nanofluid which can enhance heat transfer performance of liquid cooling. Nanofluid is a working fluid that has nanoparticles disperse in the base fluid which can increase the thermal properties of the based fluid. In this paper, comprehensive literature on the type of working fluid used in the respective system and methods of liquid cooling system for CPU including its cooling performance. Furthermore, this review paper discussed the different configuration of the liquid block and also the working fluid that had been used in the CPU cooling system.

Atom-probe analysis of the solid-liquid interface

1995 ◽  
Vol 53 ◽  
pp. 676-677
Author(s):  
J.A. Panitz
Keyword(s):  
Molecular Level ◽  
Selective Adsorption ◽  
Electronic Devices ◽  
Atom Probe ◽  
Chemical Agent ◽  
Hostile Environment ◽  
Solid Interface ◽  
Solid Liquid Interface ◽  
Solid Liquid ◽  
Chemically Selective

The first few atomic layers of a solid can form a barrier between its interior and an often hostile environment. Although adsorption at the vacuum-solid interface has been studied in great detail, little is known about adsorption at the liquid-solid interface. Adsorption at a liquid-solid interface is of intrinsic interest, and is of technological importance because it provides a way to coat a surface with monolayer or multilayer structures. A pinhole free monolayer (with a reasonable dielectric constant) could lead to the development of nanoscale capacitors with unique characteristics and lithographic resists that surpass the resolution of their conventional counterparts. Chemically selective adsorption is of particular interest because it can be used to passivate a surface from external modification or change the wear and the lubrication properties of a surface to reflect new and useful properties. Immunochemical adsorption could be used to fabricate novel molecular electronic devices or to construct small, “smart”, unobtrusive sensors with the potential to detect a wide variety of preselected species at the molecular level. These might include a particular carcinogen in the environment, a specific type of explosive, a chemical agent, a virus, or even a tumor in the human body.

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