To explore whether pressure and temperature can affect thermal contact
resistance, we have proposed a new experimental approach for measurement of
the thermal contact resistance. Taking the thermal contact resistance between
phenolic resin and carbon-carbon composites, cuprum, and aluminum as the
examples, the influence of the thermal contact resistance between specimens
under pressure is tested by experiment. Two groups of experiments are
performed and then an analysis on influencing factors of the thermal contact
resistance is presented in this paper. The experimental results reveal that
the thermal contact resistance depends not only on the thermal conductivity
coefficient of materials, but on the interfacial temperature and pressure.
Furthermore, the thermal contact resistance between cuprum and aluminum is
more sensitive to pressure and temperature than that between phenolic resin
and carbon-carbon composites.