Low temperature, high growth rate epitaxial silicon and silicon germanium alloy films

2004 ◽  
Vol 224 (1-4) ◽  
pp. 41-45 ◽  
Author(s):  
Michael A Todd ◽  
Keith D Weeks
2018 ◽  
Vol 112 (4) ◽  
pp. 042101 ◽  
Author(s):  
Kevin L. Schulte ◽  
Anna Braun ◽  
John Simon ◽  
Aaron J. Ptak

1989 ◽  
Vol 163 ◽  
Author(s):  
P.V. Schwartz ◽  
J.C. Sturm ◽  
P.M. Garone ◽  
S.A. Schwarz

AbstractWe report the low temperature growth (625 - 700 °C) of epitaxial silicon and silicon-germanium alloy films by vapor phase techniques with oxygen concentrations approximately 1020 cm-3. These concentrations are well above the accepted solid solubility for oxygen in silicon. The films, however, have excellent structural and electrical properties with virtually no stacking faults or “haze”. Infrared transmission analysis suggests the possible presence of OH, but the exact nature of the oxygen is not known.


Author(s):  
Dario Schiavon ◽  
Elżbieta Litwin-Staszewska ◽  
Rafał Jakieła ◽  
Szymon Grzanka ◽  
Piotr Perlin

The effect of growth temperature and precursor flows on the doping level and surface morphology of Ge-doped GaN layers was researched. The results show that germanium is more readily incorporated at low temperature, high growth rate and high V/III ratio, thus revealing a similar behavior to what was previously observed for indium. V-pit formation can be blocked at high temperature but also at low V/III ratio, the latter of which however causing step bunching.


2019 ◽  
Vol 485 ◽  
pp. 381-390 ◽  
Author(s):  
Taewook Nam ◽  
Hyunho Lee ◽  
Taejin Choi ◽  
Seunggi Seo ◽  
Chang Mo Yoon ◽  
...  

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